Predicted protein targets (top 13)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KIF11 | P52732 | 14/20 | 0.61 |
| ▸ | KCNH2 | Q12809 | 2/20 | 0.46 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.46 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.46 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.46 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.46 |
| ▸ | CYP11B1 | P15538 | 1/20 | 0.39 |
| ▸ | CYP11B2 | P19099 | 1/20 | 0.39 |
| ▸ | CHRM4 | P08173 | 4/20 | 0.36 |
| ▸ | CHRM5 | P08912 | 4/20 | 0.36 |
| ▸ | CHRM3 | P20309 | 4/20 | 0.36 |
| ▸ | CHRM2 | P08172 | 3/20 | 0.36 |
| ▸ | CHRM1 | P11229 | 3/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Bromide SCHEMBL1568274 | 0.98 | KIF11 (0.59) | KIF11KCNH2CYP3A4CYP2D6CYP2C9 | |
| Iodide SCHEMBL11517960 | 0.98 | KIF11 (0.59) | KIF11KCNH2CYP3A4CYP2D6CYP2C9 | |
| Hydrochloric Acid SCHEMBL10954300 | 0.98 | KIF11 (0.59) | KIF11KCNH2CYP3A4CYP2D6CYP2C9 | |
| SCHEMBL28977022 | 0.93 | KIF11 (0.59) | KIF11KCNH2CYP3A4CYP2D6CYP2C9 | |
| Bicarbonate SCHEMBL8616457 | 0.92 | KIF11 (0.53) | KIF11KCNH2CYP3A4CYP2D6CYP2C9 | |
| SCHEMBL6653059 | 0.91 | KIF11 (0.57) | KIF11KCNH2CYP3A4CYP2D6CYP2C9 | |
| SCHEMBL3784063 | 0.91 | KIF11 (0.57) | KIF11KCNH2CYP3A4CYP2D6CYP2C9 | |
| SCHEMBL6649594 | 0.91 | KIF11 (0.57) | KIF11KCNH2CYP3A4CYP2D6CYP2C9 | |
| SCHEMBL4626248 | 0.91 | KIF11 (0.57) | KIF11KCNH2CYP3A4CYP2D6CYP2C9 | |
| SCHEMBL6647653 | 0.91 | KIF11 (0.57) | KIF11KCNH2CYP3A4CYP2D6CYP2C9 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 102 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11945909-B2 | Process for preparing polycarbonates using a catalyst system having a quarternary nitrogen compond and a quarternary phosphorous compound | EPC Engineering & Technologies GmbH (DE) | 2024-04-02 | — | — | US | claimed |
| CN-114308064-B | Multistage pore solid material domain-limited metal-based catalyst and preparation method and application thereof | 东北电力大学 | 2023-08-11 | — | — | CN | claimed |
| CN-114308064-A | Hierarchical porous solid material confinement metal-based catalyst and preparation method and application thereof | 东北电力大学 | 2022-04-12 | — | — | CN | claimed |
| CN-107552006-B | Porous solid supported metal-based ionic liquid for enriching HCl gas | 浙江工业大学 | 2021-04-06 | — | — | CN | claimed |
| EP-3330247-B1 | CATALYTIC OXIDATION OF 3,5,5-TRIMETHYLCYCLOHEXA-3-ENE-1-ONE (BETA-ISOPHORONE) WITH HYDROGEN PEROXIDE TO 2,6,6-TRIMETHYL-2-CYCLOHEXENE-1,4-DION (KETO ISOPHORONE) | EVONIK DEGUSSA GMBH (DE) | 2019-05-08 | — | — | EP | claimed |
| US-4225497-A | ACID CATALYSTS FOR IMIDATION | RHONE-POULENC INDUSTRIES (FR) | 1980-09-30 | — | — | US | claimed |
| EP-4748893-A1 | PHOTOCURABLE RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, COATING AGENT, CURED PRODUCT, SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, AND CURING, BONDING, SEALING, AND COATING METHODS USING PHOTOCURABLE RESIN COMPOSITION | Namics Corporation (JP) | 2026-05-27 | — | — | EP | disclosed |
| EP-4703352-A1 | SULFONATE, OXIME SULFONATE, IMIDE SULFONATE, AMIDE SULFONATE, ACID GENERATING AGENT CONTAINING SAID COMPOUND, AND PHOTORESIST CONTAINING SAID ACID GENERATING AGENT | San-Apro Ltd. (JP) | 2026-03-04 | — | — | EP | disclosed |
| US-20250145476-A1 | METHOD FOR PURIFYING ELECTRONIC-GRADE BORON TRICHLORIDE | DALIAN CREDITCHEM ELECTRONIC MATERICAL CO., LTD. (CN) | 2025-05-08 | — | — | US | disclosed |
| US-20250115705-A1 | RESIN COMPOSITION FOR LENS, CURED SUBSTANCE FOR LENS, AND LENS | MITSUI CHEMICALS, INC. (JP) | 2025-04-10 | — | — | US | disclosed |
| WO-2025023159-A1 | PHOTOCURABLE RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, COATING AGENT, CURED PRODUCT, SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, AND CURING, BONDING, SEALING, AND COATING METHODS USING PHOTOCURABLE RESIN COMPOSITION | ナミックス株式会社 | 2025-01-30 | — | — | WO | disclosed |
| CN-116281950-B | Separation and purification method of fluorocarbon gas | 大连科利德光电子材料有限公司 | 2025-01-10 | — | — | CN | disclosed |
| WO-2025004805-A1 | RESIN COMPOSITION FOR LENS, CURED PRODUCT FOR LENS, AND LENS | 三井化学株式会社 | 2025-01-02 | — | — | WO | disclosed |
| US-5324767-A | Thermosetting resin composition for casting high-voltage coil, and molded coil and panel formed by casting and curing the composition | HITACHI, LTD. (JP) | 1994-06-28 | — | — | US | disclosed |
| EP-0602647-A1 | Superconducting magnet, superconducting magnet coil, and manufacturing method thereof | HITACHI, LTD. (JP) | 1994-06-22 | — | — | EP | disclosed |
| EP-0488275-A2 | Resin-impregnated superconducting magnet coil and process for it production | HITACHI, LTD. (JP) | 1992-06-03 | — | — | EP | disclosed |
| US-5024923-A | Sulfur-containing metal complex | FUJI PHOTO FILM CO., LTD. (JP) | 1991-06-18 | — | — | US | disclosed |
| US-4271252-A | METAL COMPLEX SALT | FUJI PHOTO FILM CO., LTD. (JP) | 1981-06-02 | — | — | US | disclosed |
| US-4256817-A | TUNGSTEN-NICKEL SULFIDE COMPLEX SALT | FUJI PHOTO FILM CO., LTD. (JP) | 1981-03-17 | — | — | US | disclosed |
| US-4225497-A | ACID CATALYSTS FOR IMIDATION | RHONE-POULENC INDUSTRIES (FR) | 1980-09-30 | — | — | US | disclosed |