SCHEMBL1127971

SCHEMBL1127971

C1CCC2(OC1)OCCO2

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11231591 0.97
SCHEMBL11297895 0.93 TSHR (0.31)
SCHEMBL1127584 0.90
SCHEMBL17536580 0.83 ALDH1A1 (0.42)
SCHEMBL6668929 0.75 ALDH1A1 (0.39)
SCHEMBL21841454 0.74
SCHEMBL11172642 0.72 MAPT (0.31)
SCHEMBL1720520 0.69 POLB (0.32)
SCHEMBL3658994 0.69 KCNH2 (0.38)
SCHEMBL10796699 0.67 GAA (0.31)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 100 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-4368314-A POLYEPOXIDE MOLDING MATERIALS HAVING SMALL SHRINKAGE TOAGOESI CHEMICAL INDUSTRY CO., LTD. (JP) 1983-01-11 US claimed
EP-4738010-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION COATING FILM, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION FILM, CURED FILM, AND ELECTRONIC COMPONENT COMPRISING SAME Toray Industries, Inc. (JP) 2026-05-06 EP disclosed
US-20260092142-A1 RESIN COMPOSITION, CURED PRODUCT, SCINTILLATOR PANEL, AND INDUCTOR TORAY INDUSTRIES, INC. (JP) 2026-04-02 US disclosed
EP-4692937-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT AND METHOD FOR PRODUCING SAME, HOLLOW STRUCTURE, ELECTRONIC COMPONENT, AND ELASTIC WAVE FILTER Toray Industries, Inc. (JP) 2026-02-11 EP disclosed
US-12545784-B2 Resin composition, resin composition film, cured film, hollow structure using same, and semiconductor device TORAY INDUSTRIES, INC. (JP) 2026-02-10 US disclosed
EP-4668018-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION COATING, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION FILM, CURED FILM, AND SEMICONDUCTOR DEVICE USING THESE Toray Industries, Inc. (JP) 2025-12-24 EP disclosed
US-12461444-B2 Sulfonium salt, photoacid generator, curable composition, and resist composition SAN-APRO LTD. (JP) 2025-11-04 US disclosed
WO-2025126939-A1 PHOTOSENSITIVE RESIN COMPOSITION FILM, CURED PRODUCT, SCINTILLATOR PANEL USING SAME, AND SEMICONDUCTOR DEVICE 東レ株式会社 2025-06-19 WO disclosed
US-20250197634-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION FILM, CURED PRODUCT, AND ELECTRONIC COMPONENT USING SAME TORAY INDUSTRIES, INC. (JP) 2025-06-19 US disclosed
EP-3909943-B1 SULFONIUM SALT, PHOTOACID GENERATOR, CURABLE COMPOSITION AND RESIST COMPOSITION SAN APRO LTD (JP) 2025-06-04 EP disclosed
US-6558871-B1 Photopolymerization initiator comprising at least one of diaryliodonium salt NIPPON SODA CO. LTD. (JP) 2003-05-06 US disclosed
EP-1201638-A1 PHOTOCURABLE COMPOSITION CONTAINING IODONIUM SALT COMPOUND NIPPON SODA CO., LTD. (JP) 2002-05-02 EP disclosed
EP-1106639-A1 PHOTOCURABLE COMPOSITION CONTAINING IODONIUM SALT COMPOUND NIPPON SODA CO., LTD. (JP) 2001-06-13 EP disclosed
US-6166100-A Cationically polymerizable pigmented composition KANSAI PAINT CO., LTD. (JP) 2000-12-26 US disclosed
EP-0751124-B1 Sulfonium salt compound and polymerization initiator NIPPON SODA CO (JP) 2000-12-13 EP disclosed
US-6093753-A CURABLE COMPOSITION COMPRISING A CATIONIC POLYMERIZABLE COMPOUND WHICH IS AN ALICYCLIC EPOXY COMPOUND OR A VINYL ETHER COMPOUND AND A CATIONIC POLYMERIZATION INITIATOR; PAINTS, ADHESIVES, INKS, PHOTORESISTS NIPPON SODA CO., LTD. (JP) 2000-07-25 US disclosed
US-5798396-A HARDENING COMPOSITION; SENSITIZER AND A CATIONIC POLYMERIZABLE COMPOUND NIPPON SODA CO., LTD. (JP) 1998-08-25 US disclosed
EP-0846681-A1 NOVEL SULFONIUM SALT COMPOUNDS, POLYMERIZATION INITIATOR, CURABLE COMPOSITION, AND CURING METHOD NIPPON SODA CO., LTD. (JP) 1998-06-10 EP disclosed
EP-0751124-A1 SULFONIUM SALT COMPOUND AND POLYMERIZATION INITIATOR NIPPON SODA CO., LTD. (JP) 1997-01-02 EP disclosed
US-4368314-A POLYEPOXIDE MOLDING MATERIALS HAVING SMALL SHRINKAGE TOAGOESI CHEMICAL INDUSTRY CO., LTD. (JP) 1983-01-11 US disclosed