SCHEMBL1129712

SCHEMBL1129712

c1ccc(OCC2CO2)c(CC2CO2)c1

nearest known ligand 0.64

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 4/20 0.64
GLA P06280 1/20 0.64
TDP1 Q9NUW8 1/20 0.55
TP53 P04637 3/20 0.49
TSHR P16473 3/20 0.49
HIF1A Q16665 2/20 0.49
CYP3A4 P08684 1/20 0.49
SMN1; SMN2 Q16637 1/20 0.49
MEN1 O00255 2/20 0.43
KMT2A Q03164 2/20 0.43
RIPK1 Q13546 1/20 0.41
MAPT P10636 2/20 0.40
HPGD P15428 2/20 0.40
PKM P14618 2/20 0.40
CYP1A2 P05177 1/20 0.40
ADRB2 P07550 1/20 0.40
HTR1A P08908 1/20 0.40
SLC6A2 P23975 1/20 0.40
HTR2A P28223 1/20 0.40
SLC6A4 P31645 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7123430 0.87 ALDH1A1 (0.47) ALDH1A1GLATDP1TP53TSHR
SCHEMBL1745602 0.87 ALDH1A1 (0.66) ALDH1A1GLATDP1TP53TSHR
SCHEMBL3900147 0.86 ALDH1A1 (0.46) ALDH1A1GLATDP1TP53TSHR
SCHEMBL7129045 0.86 ALDH1A1 (0.46) ALDH1A1GLATDP1TP53TSHR
SCHEMBL19859435 0.85 ALDH1A1 (0.54) ALDH1A1GLATDP1TP53TSHR
SCHEMBL22357196 0.85 ALDH1A1 (0.78) ALDH1A1GLATDP1TP53TSHR
SCHEMBL679937 0.85 ALDH1A1 (0.78) ALDH1A1GLATDP1TP53TSHR
SCHEMBL1140449 0.84 ALDH1A1 (0.62) ALDH1A1GLATDP1TP53TSHR
SCHEMBL9483453 0.84 ALDH1A1 (0.62) ALDH1A1GLATDP1TP53TSHR
SCHEMBL3899604 0.84 ALDH1A1 (0.45) ALDH1A1GLATDP1TP53TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 151 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118374249-B Epoxy resin suitable for chip packaging underfill, composition and use method thereof 络合高新材料(上海)有限公司 2024-09-20 CN claimed
CN-118374249-A Epoxy resin suitable for chip packaging underfill, composition and use method thereof 络合高新材料(上海)有限公司 2024-07-23 CN claimed
CN-114525015-A Resin composition for low-temperature operation and maintenance repair 上纬新材料科技股份有限公司 2022-05-24 CN claimed
US-11261357-B2 Thermally activatable, fast curing adhesive coating UNIVERSITÄT KASSEL (DE) 2022-03-01 US claimed
CN-114057992-A Resin composition for carbon fiber molding 上纬新材料科技股份有限公司 2022-02-18 CN claimed
CN-113956441-A Die pressing free radical modified epoxy resin composition 上纬新材料科技股份有限公司 2022-01-21 CN claimed
CN-113150496-A Epoxy resin reinforced material 上纬新材料科技股份有限公司 2021-07-23 CN claimed
EP-3504283-B1 SOLID HOMOGENEOUS AMORPHOUS HIGH HEAT EPOXY BLENDS, ARTICLES, AND USES THEREOF SHPP GLOBAL TECH BV (NL) 2021-04-07 EP claimed
CN-104877357-B Preparation method and application of epoxy asphalt compatibilizer 湖北大学 2017-04-12 CN claimed
EP-2655528-B1 BICOMPONENT REACTIVE INK FOR INK JET PRINTING SICPA HOLDING SA (CH) 2015-02-11 EP claimed
CN-102838847-A Composition for improving insulating property of glass reinforced plastic battery jar body SWANCOR SHANGHAI FINE CHEMICAL CO LTD 2012-12-26 CN claimed
WO-2012123403-A1 EPOXY RESIN SYSTEM WITH VISUAL MONITORING OF THE HARDENING STATE Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V. (DE) 2012-09-20 WO claimed
EP-0449292-B1 Multilayer printed circuit board and production thereof HITACHI LTD (JP) 1997-08-20 EP claimed
EP-0608273-B1 UV-CURABLE SILICONE RELEASE COMPOSITIONS MINNESOTA MINING & MFG (US) 1997-05-28 EP claimed
EP-0262891-B1 Resin composition of thermosetting resin and thermoplastic resin TOHO RAYON KK (JP) 1996-12-27 EP claimed
EP-0608273-A1 UV-CURABLE SILICONE RELEASE COMPOSITIONS. MINNESOTA MINING & MFG (US) 1994-08-03 EP claimed
WO-1993008238-A1 UV-CURABLE SILICONE RELEASE COMPOSITIONS MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1993-04-29 WO claimed
US-4362889-A EPOXY RESINS THE AMERICAN DENTAL ASSOCIATION HEALTH FOUNDATION (US) 1982-12-07 US claimed
US-4251565-A Use of a polyfunctional surface-active comonomer and other agents to improve adhesion between a resin or composite material and a substrate AMERICAN DENTAL ASSOCIATION HEALTH FOUNDATION (US) 1981-02-17 US claimed
US-4212959-A MALEIMIDE COMPOUNDS, DIEPOXY COMPOUNDS; NON-SOLVENT VARNISH MITSUBISHI DENKI KABUSHIKI KAISHA (JP) 1980-07-15 US claimed