⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1006494 | 0.84 | TSHR (0.41) | — | |
| SCHEMBL143928 | 0.79 | — | — | |
| SCHEMBL143927 | 0.79 | — | — | |
| SCHEMBL607966 | 0.79 | ANPEP (0.52) | — | |
| SCHEMBL56091 | 0.79 | — | — | |
| SCHEMBL28350802 | 0.78 | — | — | |
| SCHEMBL2806516 | 0.78 | TRPV1 (0.44) | — | |
| SCHEMBL8410936 | 0.78 | TDP1 (0.38) | — | |
| SCHEMBL15528706 | 0.77 | — | — | |
| SCHEMBL24594014 | 0.77 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11384255-B2 | Polishing slurry composition for STI process | KCTECH CO., LTD. (KR) | 2022-07-12 | — | — | US | claimed |
| US-20210163785-A1 | POLISHING SLURRY COMPOSITION FOR STI PROCESS | KCTECH CO., LTD. (KR) | 2021-06-03 | — | — | US | claimed |
| WO-2005035935-A1 | METHODS OF CEMENTING SUBTERRANEAN ZONES WITH CEMENT COMPOSITIONS HAVING ENHANCED COMPRESSIVE STRENGTHS | HALLIBURTON ENERGY SERVICES, INC. (US) | 2005-04-21 | — | — | WO | claimed |
| US-20050077045-A1 | METHODS OF CEMENTING SUBTERRANEAN ZONES WITH CEMENT COMPOSITIONS HAVING ENHANCED COMPRESSIVE STRENGTHS | HALLIBURTON ENERGY SERVICES, INC. | 2005-04-14 | — | — | US | claimed |
| US-12031062-B2 | Polishing slurry composition for sti process | KCTECH CO., LTD. (KR) | 2024-07-09 | — | — | US | disclosed |
| US-20220177727-A1 | POLISHING SLURRY COMPOSITION FOR STI PROCESS | KCTECH CO., LTD. (KR) | 2022-06-09 | — | — | US | disclosed |
| US-20210163785-A1 | POLISHING SLURRY COMPOSITION FOR STI PROCESS | KCTECH CO., LTD. (KR) | 2021-06-03 | — | — | US | disclosed |
| EP-1812381-B1 | ETHYLENICALLY UNSATURATED GROUP-CONTAINING ISOCYANATE COMPOUND AND PROCESS FOR PRODUCING THE SAME, AND REACTIVE MONOMER, REACTIVE (METH)ACRYLATE POLYMER AND ITS USE | SHOWA DENKO KK (JP) | 2011-02-16 | — | — | EP | disclosed |
| US-7579066-B2 | Ethylenically unsaturated group-containing isocyanate compound and process for producing the same, and reactive monomer, reactive (meth) acrylate polymer and its use | SHOWA DENKO K.K. (JP) | 2009-08-25 | — | — | US | disclosed |
| US-20080132597-A1 | Ethylenically Unsaturated Group-Containing Isocyanate Compound and Process for Producing the Same, and Reactive Monomer, Reactive (Meth) Acrylate Polymer and its Use | RESONAC CORPORATION (JP) | 2008-06-05 | — | — | US | disclosed |
| US-6096443-A | Transparencies | XEROX CORPORATION (US) | 2000-08-01 | — | — | US | disclosed |