SCHEMBL11325844

SCHEMBL11325844

O=C(CCCCC(=O)ONC1CCCCC1)ONC1CCCCC1

nearest known ligand 0.48

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
SMN1; SMN2 Q16637 3/20 0.48
EPHX2 P34913 3/20 0.47
NAAA Q02083 2/20 0.43
ALDH1A1 P00352 2/20 0.43
GAA P10253 1/20 0.43
HDAC3 O15379 2/20 0.42
HDAC1 Q13547 2/20 0.42
HDAC2 Q92769 2/20 0.42
HDAC10 Q969S8 2/20 0.42
HDAC11 Q96DB2 2/20 0.42
HDAC8 Q9BY41 2/20 0.42
HDAC6 Q9UBN7 2/20 0.42
NCOR2 Q9Y618 1/20 0.42
EPHX1 P07099 6/20 0.41
NPC1 O15118 2/20 0.40
RAB9A P51151 2/20 0.40
MAPT P10636 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29061111 0.98 EPHX2 (0.50) SMN1; SMN2EPHX2NAAAALDH1A1GAA
SCHEMBL2998396 0.92 EPHX1 (0.44) SMN1; SMN2EPHX2ALDH1A1EPHX1NPC1
SCHEMBL11800669 0.91 NAAA (0.57) EPHX2NAAAEPHX1
SCHEMBL27839050 0.90 NAAA (0.59) EPHX2NAAAEPHX1
SCHEMBL28882747 0.90 NAAA (0.59) EPHX2NAAAEPHX1
SCHEMBL28059682 0.90 NAAA (0.59) EPHX2NAAAEPHX1
SCHEMBL6836287 0.90 NAAA (0.59) EPHX2NAAAEPHX1
SCHEMBL29290660 0.90 NAAA (0.59) EPHX2NAAAEPHX1
SCHEMBL1017033 0.90 NAAA (0.59) EPHX2NAAAEPHX1
SCHEMBL11790864 0.90 NAAA (0.59) EPHX2NAAAEPHX1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117644315-A High-activity post-welding low-residue tin-bismuth-silver lead-free solder paste and preparation method thereof 青岛融合装备科技有限公司 2024-03-05 CN claimed
CN-112589318-B Water-soluble lead-free soldering paste, water-washing solder paste and preparation method thereof 深圳市晨日科技股份有限公司 2022-05-27 CN claimed
CN-112589318-A Water-soluble lead-free soldering paste, water-washing solder paste and preparation method thereof 深圳市晨日科技股份有限公司 2021-04-02 CN claimed
CN-118417761-A Tin wire soldering flux for 5G communication wire harness welding, preparation method thereof and tin wire 北京达博长城锡焊料有限公司 2024-08-02 CN disclosed
CN-117644315-A High-activity post-welding low-residue tin-bismuth-silver lead-free solder paste and preparation method thereof 青岛融合装备科技有限公司 2024-03-05 CN disclosed
CN-117644316-A Low-temperature water-washing antioxidant solder paste, welding method thereof and water washing method 深圳市晨日科技股份有限公司 2024-03-05 CN disclosed
CN-116604222-A Environment-friendly cleaning-free water-based scaling powder for series welding of photovoltaic modules and preparation method thereof 杭州正盟环保工程有限公司 2023-08-18 CN disclosed
CN-112589318-B Water-soluble lead-free soldering paste, water-washing solder paste and preparation method thereof 深圳市晨日科技股份有限公司 2022-05-27 CN disclosed
CN-112589318-A Water-soluble lead-free soldering paste, water-washing solder paste and preparation method thereof 深圳市晨日科技股份有限公司 2021-04-02 CN disclosed
CN-108500511-A The manufacturing method of flux composition, solder composition, electric substrate and electric substrate 株式会社田村制作所 2018-09-07 CN disclosed
US-4253886-A Corrosion resistant ferromagnetic metal powders and method of preparing the same FUJI PHOTO FILM CO., LTD. (JP) 1981-03-03 US disclosed