SCHEMBL113684

SCHEMBL113684

[CH]1CCC2OC2C1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2403544 0.79
SCHEMBL17027683 0.75 ALDH1A1 (0.36)
SCHEMBL17027684 0.75 ALDH1A1 (0.36)
SCHEMBL17027685 0.75 ALDH1A1 (0.36)
SCHEMBL1299873 0.73
SCHEMBL821057 0.73
SCHEMBL16746016 0.73
SCHEMBL1299536 0.73
SCHEMBL20617561 0.71 ALDH1A1 (0.31)
SCHEMBL328857 0.71 ALDH1A1 (0.31)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 4125 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118325101-A Amphoteric silicon-based sheet material and preparation method and application thereof 华南理工大学 2024-07-12 CN claimed
EP-4397623-A1 EPOXY GROUP-CONTAINING ORGANOSILICA SOL, EPOXY RESIN COMPOSITION AND PRODUCTION METHOD THEREOF Nissan Chemical Corporation (JP) 2024-07-10 EP claimed
CN-118240257-A Waterproof film layer and preparation method thereof 江苏菲沃泰纳米科技股份有限公司 2024-06-25 CN claimed
CN-112608600-B Curable resin composition containing silicone resin, cured product thereof, and method for producing silicone resin 日铁化学材料株式会社 2024-05-14 CN claimed
CN-117881628-A Epoxy group-containing organosilicon sol, epoxy resin composition, and method for producing same 日产化学株式会社 2024-04-12 CN claimed
CN-117859183-A Conductive adhesive composition for bonding solar cells 汉高股份有限及两合公司 2024-04-09 CN claimed
US-11932714-B2 Copolymer, film composition and composite material employing the same INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2024-03-19 US claimed
CN-114380929-B Functionalized (co) polymers for adhesive systems 德莎欧洲股份公司 2024-02-06 CN claimed
CN-117043196-A Polymer latex composition 昕特玛私人有限公司 2023-11-10 CN claimed
US-11746174-B2 Biodegradable polyester INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2023-09-05 US claimed
EP-0178414-A1 Chemically curable resins derived from 1-oxa-3-aza-tetralin groups containing compounds and cycloaliphatic epoxy resins, process for their preparation and cure as well as the use of such resins Gurit-Essex AG (CH) 1986-04-23 EP claimed
EP-0163052-A2 Polymeric composition Du Pont-Mitsui Polychemicals Co., Ltd. (JP) 1985-12-04 EP claimed
EP-0087013-B1 DURABLE PRIMER COMPOSITION Toray Silicone Co., Ltd. (JP) 1985-11-21 EP claimed
US-4436787-A SILICONE RESINS, EPOXY RESINS DOW CORNING CORPORATION (US) 1984-03-13 US claimed
EP-0087013-A1 Durable primer composition Toray Silicone Co., Ltd. (JP) 1983-08-31 EP claimed
US-4252933-A Self-bonding silicone coating composition GENERAL ELECTRIC COMPANY (US) 1981-02-24 US claimed
US-4228054-A Organopolysiloxane latex compositions TORAY SILICONE COMPANY, LTD. (JP) 1980-10-14 US claimed
US-4101272-A EPOXYSILOXANE, POLYAMINE, SHRINKAGE INHIBITION COMMONWEALTH SCIENTIFIC AND INDUSTRIAL RESEARCH ORGANIZATION (AU) 1978-07-18 US claimed
US-4077943-A ADHESION SHIN-ETSU CHEMICAL CO., LTD. (JA) 1978-03-07 US claimed
US-3959242-A MOLD RELEASE SURFACE THE GOODYEAR TIRE & RUBBER COMPANY (US) 1976-05-25 US claimed