SCHEMBL1140586

SCHEMBL1140586

CCCCCCCCCCCCCC(C(=O)[O-])=C(CCCCCCCCCCCCC)C(=O)[O-].CCCC[Sn+2]CCCC

nearest known ligand 0.55

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CES2 O00748 4/20 0.50
CES1 P23141 4/20 0.50
FABP3 P05413 4/20 0.46
THRB P10828 1/20 0.44
FNTA P49354 1/20 0.44
FNTB P49356 1/20 0.44
PGGT1B P53609 1/20 0.44
PPARG P37231 6/20 0.43
PPARD Q03181 6/20 0.43
PPARA Q07869 6/20 0.43
HDAC11 Q96DB2 5/20 0.43
TSHR P16473 4/20 0.43
GPR84 Q9NQS5 4/20 0.43
ALDH1A1 P00352 2/20 0.43
TLR2 O60603 2/20 0.43
TDP1 Q9NUW8 2/20 0.43
FABP4 P15090 2/20 0.43
PTPN1 P18031 2/20 0.43
SLC22A6 Q4U2R8 1/20 0.43
SLC22A8 Q8TCC7 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL809604 1.00 CES2 (0.50) CES2CES1FABP3THRBFNTA
SCHEMBL385243 1.00 CES2 (0.50) CES2CES1FABP3THRBFNTA
SCHEMBL385245 1.00 CES2 (0.50) CES2CES1FABP3THRBFNTA
SCHEMBL383230 0.96 CES2 (0.50) CES2CES1FABP3THRBFNTA
SCHEMBL5266753 0.96 CES2 (0.50) CES2CES1FABP3THRBFNTA
SCHEMBL5266747 0.96 CES2 (0.50) CES2CES1FABP3THRBFNTA
SCHEMBL383228 0.96 CES2 (0.50) CES2CES1FABP3THRBFNTA
SCHEMBL3767401 0.95 CES2 (0.45) CES2CES1FABP3THRBFNTA
SCHEMBL3767406 0.95 CES2 (0.45) CES2CES1FABP3THRBFNTA
SCHEMBL8778133 0.92 CES2 (0.45) CES2CES1FABP3THRBFNTA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 146 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4720168-A1 METHOD OF PREPARING A MOISTURE CURABLE RESIN COMPOSITION Kaneka Americas Holding, Inc. (US) 2026-04-08 EP disclosed
US-12448479-B2 Radiation curable and printable composition HENKEL AG & CO. KGAA (DE) 2025-10-21 US disclosed
EP-3931237-B1 MOISTURE CURABLE ADHESIVE COMPOSITIONS KANEKA AMERICAS HOLDING INC (US) 2025-08-20 EP disclosed
US-12391853-B2 Adhesive formulations for roofing applications and related methods BMIC LLC (US) 2025-08-19 US disclosed
US-20250179272-A1 REMOVABLE ADHESIVE AND SEALANT COMPOSITION HENKEL AG & CO. KGAA (DE) 2025-06-05 US disclosed
WO-2025111365-A1 METHOD OF PREPARING A MOISTURE CURABLE RESIN COMPOSITION WITH A NON-TIN CATALYST KANEKA AMERICAS HOLDING, INC. (US) 2025-05-30 WO disclosed
EP-4324892-B1 REMOVABLE ADHESIVE AND SEALANT COMPOSITION HENKEL AG & CO KGAA (DE) 2025-04-16 EP disclosed
CN-114127156-B Moisture curable adhesive composition 钟化美洲控股公司 2025-01-21 CN disclosed
US-12163043-B2 Curable composition comprising polysiloxane polyalkyleneglycol brush copolymers HENKEL AG & CO. KGAA (DE) 2024-12-10 US disclosed
WO-2024249895-A1 METHOD OF PREPARING A MOISTURE CURABLE RESIN COMPOSITION KANEKA AMERICAS HOLDING, INC. (US) 2024-12-05 WO disclosed
EP-1533341-A1 CURABLE COMPOSITION AND SEALING METHOD FOR CERAMIC SIDING BOARDS KANEKA CORPORATION (JP) 2005-05-25 EP disclosed
US-20040214950-A1 Curable composition KANEKA CORPORATION (JP) 2004-10-28 US disclosed
EP-1471113-A1 Curable composition Kaneka Corporation (JP) 2004-10-27 EP disclosed
US-20030096904-A1 Curable composition and its use MITSUI CHEMICALS, INC. (JP) 2003-05-22 US disclosed
EP-1304354-A1 CURABLE COMPOSITION AND USES THEREOF Mitsui Chemicals, Inc. (JP) 2003-04-23 EP disclosed
US-6451439-B2 A PRIMER COMPRISES, AS COMPONENT, A SATURATED HYDROCARBON POLYMER HAVING ATLEAST ONE-SILICON CONTAINING GROUP WHICH HAS A HYDROXY GROUP OR HYDROLYZABLE GROUP BOUND TO SILICON ATOM AND IS CAPABLE OF CROSSLINKING KANEKA CORPORATION (JP) 2002-09-17 US disclosed
US-20010047056-A1 Primer composition and method of effecting adhesion for sealing compositions KANEKA CORPORATION (JP) 2001-11-29 US disclosed
US-6025445-A CROSSLINKABLE; POLYSILOXANES; DIALKYLTIN DIALKOXIDE AND HYDRATED METAL SALT CURING AGENT; STORAGE STABILITY KANEKA CORPORATION (JP) 2000-02-15 US disclosed
EP-0931821-A2 Primer composition and method of effecting adhesion for sealing compositions KANEKA CORPORATION (JP) 1999-07-28 EP disclosed
EP-0839872-A2 Curable polymer having reactive silicon-containing functional groups KANEKA CORPORATION (JP) 1998-05-06 EP disclosed