Predicted protein targets (top 4)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MAPT | P10636 | 1/20 | 0.38 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.32 |
| ▸ | MEN1 | O00255 | 1/20 | 0.30 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Formaldehyde SCHEMBL28199185 | 0.92 | MAPT (0.33) | MAPTMEN1KMT2A | |
| SCHEMBL20376445 | 0.80 | ALDH1A1 (0.31) | ALDH1A1 | |
| SCHEMBL6654058 | 0.80 | MAPT (0.36) | MAPTALDH1A1 | |
| SCHEMBL21203232 | 0.78 | MAPT (0.35) | MAPT | |
| SCHEMBL5009792 | 0.78 | MAPT (0.35) | MAPT | |
| SCHEMBL9755262 | 0.77 | MAPT (0.38) | MAPTALDH1A1 | |
| SCHEMBL115482 | 0.75 | MAPT (0.42) | MAPTALDH1A1 | |
| SCHEMBL8144963 | 0.74 | MAPT (0.43) | MAPT | |
| SCHEMBL5965821 | 0.74 | MAPT (0.32) | MAPTALDH1A1 | |
| SCHEMBL15081060 | 0.74 | MAPT (0.32) | MAPT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 59 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12359125-B2 | Silicon etchant composition, pattern formation method and manufacturing method of array substrate using the etchant composition, and array substrate manufactured therefrom | DONGWOO FINE-CHEM CO., LTD. (KR) | 2025-07-15 | — | — | US | claimed |
| US-20250026960-A1 | POLISHING SLURRY COMPOSITION | KCTECH CO.,LTD. (KR) | 2025-01-23 | — | — | US | claimed |
| CN-118339245-A | Polishing slurry composition | 凯斯科技股份有限公司 | 2024-07-12 | — | — | CN | claimed |
| CN-114231288-B | Silicon etching liquid composition, pattern forming method, array substrate manufacturing method, and array substrate | 东友精细化工有限公司 | 2023-12-26 | — | — | CN | claimed |
| WO-2023121037-A1 | POLISHING SLURRY COMPOSITION | 주식회사 케이씨텍 | 2023-06-29 | — | — | WO | claimed |
| CN-111492024-B | Polishing slurry composition for STI process | 斯科技股份有限公司 | 2022-12-30 | — | — | CN | claimed |
| US-11384255-B2 | Polishing slurry composition for STI process | KCTECH CO., LTD. (KR) | 2022-07-12 | — | — | US | claimed |
| CN-114231288-A | Silicon etching liquid composition, pattern forming method, array substrate manufacturing method, and array substrate | 东友精细化工有限公司 | 2022-03-25 | — | — | CN | claimed |
| US-20220073819-A1 | SILICON ETCHANT COMPOSITION, PATTERN FORMATION METHOD AND MANUFACTURING METHOD OF ARRAY SUBSTRATE USING THE ETCHANT COMPOSITION, AND ARRAY SUBSTRATE MANUFACTURED THEREFROM | DONGWOO FINE-CHEM CO., LTD. (KR) | 2022-03-10 | — | — | US | claimed |
| US-20210163785-A1 | POLISHING SLURRY COMPOSITION FOR STI PROCESS | KCTECH CO., LTD. (KR) | 2021-06-03 | — | — | US | claimed |
| US-20210079262-A1 | POLISHING SLURRY COMPOSITION FOR STI PROCESS | KCTECH CO., LTD. (KR) | 2021-03-18 | — | — | US | claimed |
| CN-111511856-A | Polishing slurry composition for STI process | 斯科技股份有限公司 | 2020-08-07 | — | — | CN | claimed |
| CN-111492024-A | Polishing slurry composition for STI process | 斯科技股份有限公司 | 2020-08-04 | — | — | CN | claimed |
| US-20190316003-A1 | SLURRY COMPOSITION FOR POLISHING HIGH STEPPED REGION | KCTECH CO., LTD. (KR) | 2019-10-17 | — | — | US | claimed |
| US-20110124195-A1 | Chemical Mechanical Polishing Composition Containing Polysilicon Polish Finisher | TECHNO SEMICHEM CO., LTD. (KR) | 2011-05-26 | — | — | US | claimed |
| US-20110045741-A1 | Auto-Stopping Abrasive Composition for Polishing High Step Height Oxide Layer | TECHNO SEMICHEM CO., LTD. (KR) | 2011-02-24 | — | — | US | claimed |
| WO-2006115393-A1 | AUTO-STOPPING ABRASIVE COMPOSITION FOR POLISHING HIGH STEP HEIGHT OXIDE LAYER | TECHNO SEMICHEM CO., LTD. (KR) | 2006-11-02 | — | — | WO | claimed |
| US-20250236792-A1 | ETCHANT COMPOSITION FOR ETCHING SILICON AND METHOD OF FORMING PATTERN USING THE SAME | DONGWOO FINE-CHEM CO., LTD. (KR) | 2025-07-24 | — | — | US | disclosed |
| EP-1629103-A2 | PLANT FATTY ACID AMIDE HYDROLASES | The Samuel Roberts Noble Foundation, Inc. (US) | 2006-03-01 | — | — | EP | disclosed |
| WO-2005001100-A2 | PLANT FATTY ACID AMIDE HYDROLASES | THE SAMUEL ROBERTS NOBLE FOUNDATION, INC. (US) | 2005-01-06 | — | — | WO | disclosed |