SCHEMBL1148010

SCHEMBL1148010

C=CN(C=C)CC(=O)O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5180442 0.87
SCHEMBL15080934 0.81 TDP1 (0.32)
SCHEMBL3806335 0.77 TDP1 (0.41)
SCHEMBL23653782 0.74
SCHEMBL8998478 0.73
SCHEMBL10349774 0.72
SCHEMBL8765339 0.72
SCHEMBL3491755 0.72 TDP1 (0.38)
SCHEMBL8076843 0.72
SCHEMBL8768371 0.72

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240329480-A1 Dynamic Glass Element Using Reversible Metal Electrodeposition Electrolytes with Tunable PH with High Opacity and Excellent Resting Stability and Electrolytes Useful Therefore The Board of Regents of the Nevada System of Higher Education on Behalf of the Univ of Nevada (US) 2024-10-03 US disclosed
WO-2022221094-A1 DYNAMIC GLASS ELEMENT USING REVERSIBLE METAL ELECTRODEPOSITION ELECTROLYTES WITH TUNABLE PH WITH HIGH OPACITY AND EXCELLENT RESTING STABILITY AND ELECTROLYTES USEFUL THEREFORE THE BOARD OF REGENTS OF THE NEVADA SYSTEM OF HIGHER EDUCATION, ON BEHALF OF THE UNIVERSITY OF NEVADA, RENO (US) 2022-10-20 WO disclosed
US-20180305400-A1 STABILIZED COMPOUNDS HAVING SECONDARY STRUCTURE MOTIFS PRESIDENT AND FELLOWS OF HARVARD COLLEGE (US) 2018-10-25 US disclosed
US-9951099-B2 Stabilized compounds having secondary structure motifs PRESIDENT AND FELLOWS OF HARVARD COLLEGE (US) 2018-04-24 US disclosed
US-20170088581-A1 STABILIZED COMPOUNDS HAVING SECONDARY STRUCTURE MOTIFS PRESIDENT AND FELLOWS OF HARVARD COLLEGE (US) 2017-03-30 US disclosed
US-9505801-B2 Stabilized compounds having secondary structure motifs PRESIDENT AND FELLOWS OF HARVARD COLLEGE (US) 2016-11-29 US disclosed
US-8895699-B2 Stabilized compounds having secondary structure motifs PRESIDENT AND FELLOWS OF HARVARD COLLEGE (US) 2014-11-25 US disclosed
US-20140162339-A1 Stabilized Compounds Having Secondary Structure Motifs PRESIDENT AND FELLOWS OF HARVARD COLLEGE (US) 2014-06-12 US disclosed
US-20130211046-A1 Stabilized Compounds Having Secondary Structure Motifs PRESIDENT AND FELLOWS OF HARVARD COLLEGE (US) 2013-08-15 US disclosed
US-8324428-B2 Stabilized compounds having secondary structure motifs PRESIDENT AND FELLOWS OF HARVARD COLLEGE (US) 2012-12-04 US disclosed
US-20110028753-A1 Stabilized Compounds Having Secondary Structure Motifs PRESIDENT AND FELLOWS OF HARVARD COLLEGE (US) 2011-02-03 US disclosed
US-7786072-B2 synthesizing a peptide from a selected number of natural or non-natural amino acids; stabilized p53 donor helical peptides PRESIDENT AND FELLOWS OF HARVARD COLLEGE (US) 2010-08-31 US disclosed
CN-100549155-C Remove the composition that residue is used in the semiconductor production EKC TECHNOLOGY INC (US) 2009-10-14 CN disclosed
CN-100341992-C Composition and method for removing residues from semiconductor manufacturing EKC TECHNOLOGY INC (US) 2007-10-10 CN disclosed
US-7192713-B1 synthesizing a peptide from a selected number of natural or non-natural amino acids; stabilized p53 donor helical peptides PRESIDENT AND FELLOWS OF HARVARD COLLEGE (US) 2007-03-20 US disclosed
CN-1721516-A Semiconductor process residue removal composition EKC TECHNOLOGY INC (US) 2006-01-18 CN disclosed
US-20060008848-A1 synthesizing a peptide from a selected number of natural or non-natural amino acids; stabilized p53 donor helical peptides NATIONAL INSTITUTES OF HEALTH (NIH), U.S. DEPT. OF HEALTH AND HUMAN SERVICES (DHHS), U.S. GOVERNMENT 2006-01-12 US disclosed
CN-1465687-A Composition and method for removing residues from semiconductor manufacturing EKC������˾ 2004-01-07 CN disclosed