Procysteine

Procysteine

SCHEMBL1150486

CC1OC(=O)C(C)OC1=O.O=C1NC(C(=O)O)CS1

nearest known ligand 0.45

Full drug profile on Sugi Atlas →

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
HTT P42858 1/20 0.45
CTH P32929 1/20 0.43
GRIA2 P42262 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1150067 0.84 HTT (0.43) HTTCTH
Procysteine SCHEMBL9139321 0.84 HTT (0.53) HTTCTHGRIA2
Procysteine SCHEMBL83023 0.84
Procysteine SCHEMBL1134004 0.84
Procysteine SCHEMBL352387 0.84
Procysteine SCHEMBL4164380 0.82 HTT (0.52) HTTCTHGRIA2
Procysteine SCHEMBL10623235 0.82 HTT (0.52) HTTCTHGRIA2
Procysteine SCHEMBL8428864 0.82 HTT (0.52) HTTCTHGRIA2
Procysteine SCHEMBL20822405 0.74 HTT (0.45) HTTCTH
SCHEMBL12359033 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8309623-B2 Biodegradable copolymer and thermosensitive material INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2012-11-13 US disclosed
US-20110065829-A1 BIODEGRADABLE COPOLYMER AND THERMOSENSITIVE MATERIAL INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2011-03-17 US disclosed
US-7884142-B2 hydrophilic segment is endcapped polyoxyethylene glycol, hydrophilic segment is random polymer polymerized of lactone or cyclic C3-C6 molecule and lactic acid/glycolic acid, with no coupling agent between; polythioureas INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2011-02-08 US disclosed
US-20090247666-A1 BIODEGRADABLE COPOLYMER AND THERMOSENSITIVE MATERIAL INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2009-10-01 US disclosed