Predicted protein targets (top 12)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.64 |
| ▸ | HIF1A | Q16665 | 4/20 | 0.64 |
| ▸ | TP53 | P04637 | 3/20 | 0.64 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.64 |
| ▸ | MAPK1 | P28482 | 2/20 | 0.64 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.64 |
| ▸ | THRB | P10828 | 2/20 | 0.44 |
| ▸ | TSHR | P16473 | 8/20 | 0.43 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.43 |
| ▸ | HPGD | P15428 | 1/20 | 0.39 |
| ▸ | ADRA2A | P08913 | 1/20 | 0.30 |
| ▸ | ADRA1A | P35348 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL233528 | 0.93 | ALDH1A1 (0.56) | ALDH1A1HIF1ATP53CYP3A4MAPK1 | |
| SCHEMBL14341614 | 0.92 | ALDH1A1 (0.60) | ALDH1A1HIF1ATP53CYP3A4MAPK1 | |
| SCHEMBL12264264 | 0.91 | ALDH1A1 (0.55) | ALDH1A1HIF1ATP53CYP3A4MAPK1 | |
| SCHEMBL13415045 | 0.91 | ALDH1A1 (0.55) | ALDH1A1HIF1ATP53CYP3A4MAPK1 | |
| SCHEMBL13143870 | 0.91 | ALDH1A1 (0.55) | ALDH1A1HIF1ATP53CYP3A4MAPK1 | |
| SCHEMBL24195723 | 0.90 | ALDH1A1 (0.58) | ALDH1A1HIF1ATP53CYP3A4MAPK1 | |
| SCHEMBL16308966 | 0.90 | ALDH1A1 (0.58) | ALDH1A1HIF1ATP53CYP3A4MAPK1 | |
| SCHEMBL27055803 | 0.90 | ALDH1A1 (0.58) | ALDH1A1HIF1ATP53CYP3A4MAPK1 | |
| SCHEMBL27055806 | 0.90 | ALDH1A1 (0.58) | ALDH1A1HIF1ATP53CYP3A4MAPK1 | |
| SCHEMBL27055807 | 0.90 | ALDH1A1 (0.58) | ALDH1A1HIF1ATP53CYP3A4MAPK1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-108350203-B | Black resin composition, polyimide with black resin cured film, and method for producing same | 株式会社钟化 | 2021-07-06 | — | — | CN | disclosed |
| US-10822465-B2 | Black resin composition, polyimide with black resin cured film and production method therefor, and flexible printed wiring board using black resin cured film | KANEKA CORPORATION (JP) | 2020-11-03 | — | — | US | disclosed |
| US-20180319945-A1 | BLACK RESIN COMPOSITION, POLYIMIDE WITH BLACK RESIN CURED FILM AND PRODUCTION METHOD THEREFOR, AND FLEXIBLE PRINTED WIRING BOARD USING BLACK RESIN CURED FILM | KANEKA CORPORATION (JP) | 2018-11-08 | — | — | US | disclosed |
| US-9458279-B2 | Resin composition and use thereof | KANEKA CORPORATION (JP) | 2016-10-04 | — | — | US | disclosed |
| CN-102650829-B | Colored curable resin composition | SUMITOMO CHEMICAL CO., LTD. (JP) | 2016-04-27 | — | — | CN | disclosed |
| US-9267004-B2 | Polyimide precursor composition and use thereof | KANEKA CORPORATION (JP) | 2016-02-23 | — | — | US | disclosed |
| US-9237645-B2 | Flexible printed circuit integrated with conductive layer | KANEKA CORPORATION (JP) | 2016-01-12 | — | — | US | disclosed |
| US-9204528-B2 | Flexible printed circuit integrated with stiffener | KANEKA CORPORATION (JP) | 2015-12-01 | — | — | US | disclosed |
| US-9072177-B2 | Conductive layer integrated FPC | KANEKA CORPORATION (JP) | 2015-06-30 | — | — | US | disclosed |
| US-20140158412-A1 | NOVEL CONDUCTIVE LAYER INTEGRATED FPC | KANEKA CORPORATION (JP) | 2014-06-12 | — | — | US | disclosed |
| US-20140054081-A1 | NOVEL FLEXIBLE PRINTED CIRCUIT INTEGRATED WITH CONDUCTIVE LAYER | KANEKA CORPORATION (JP) | 2014-02-27 | — | — | US | disclosed |
| US-20140048314-A1 | FLEXIBLE PRINTED CIRCUIT INTEGRATED WITH REINFORCING PLATE | KANEKA CORPORATION (JP) | 2014-02-20 | — | — | US | disclosed |
| US-8538230-B2 | Resin composition for production of clad layer, resin film for production of clad layer utilizing the resin composition, and optical waveguide and optical module each utilizing the resin composition or the resin film | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2013-09-17 | — | — | US | disclosed |
| US-20110083884-A1 | NOVEL POLYIMIDE PRECURSOR COMPOSITION AND USE THEREOF | KANEKA CORPORATION (JP) | 2011-04-14 | — | — | US | disclosed |
| US-20110061915-A1 | NOVEL RESIN COMPOSITION AND USE THEREOF | KANEKA CORPORATION (JP) | 2011-03-17 | — | — | US | disclosed |
| US-20110033161-A1 | RESIN COMPOSITION FOR PRODUCTION OF CLAD LAYER, RESIN FILM FOR PRODUCTION OF CLAD LAYER UTILIZING THE RESIN COMPOSITION, AND OPTICAL WAVEGUIDE AND OPTICAL MODULE EACH UTILIZING THE RESIN COMPOSITION OR THE RESIN FILM | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2011-02-10 | — | — | US | disclosed |
| EP-2239603-A1 | RESIN COMPOSITION FOR PRODUCTION OF CLAD LAYER, RESIN FILM FOR PRODUCTION OF CLAD LAYER UTILIZING THE RESIN COMPOSITION, AND OPTICAL WAVEGUIDE AND OPTICAL MODULE EACH UTILIZING THE RESIN COMPOSITION OR THE RESIN FILM | Hitachi Chemical Company, Ltd. (JP) | 2010-10-13 | — | — | EP | disclosed |
| US-20100132989-A1 | NOVEL POLYIMIDE PRECURSOR COMPOSITION AND USE THEREOF | KANEKA CORPORATION (JP) | 2010-06-03 | — | — | US | disclosed |