SCHEMBL1151807

SCHEMBL1151807

C=CCC(OC(=O)OC(CC=C)C1CO1)C1CO1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1151808 0.87 GRIK1 (0.30)
SCHEMBL5971861 0.86 TSHR (0.32)
SCHEMBL195062 0.82 ALDH1A1 (0.42)
SCHEMBL9482725 0.80 TP53 (0.41)
SCHEMBL10621320 0.80 HCAR2 (0.40)
SCHEMBL6466036 0.79
SCHEMBL9132176 0.78 CYP3A4 (0.44)
SCHEMBL3402458 0.78 TDP1 (0.35)
SCHEMBL9482730 0.76 TP53 (0.38)
Ethylene Glycol SCHEMBL5922937 0.76 ALDH1A1 (0.31)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20200254743-A1 MULTILAYER FILM AND TWO-LIQUID CURABLE COATING AGENT HARIMA CHEMICALS, INC. (JP) 2020-08-13 US disclosed
US-8538230-B2 Resin composition for production of clad layer, resin film for production of clad layer utilizing the resin composition, and optical waveguide and optical module each utilizing the resin composition or the resin film HITACHI CHEMICAL COMPANY, LTD. (JP) 2013-09-17 US disclosed
US-20110033161-A1 RESIN COMPOSITION FOR PRODUCTION OF CLAD LAYER, RESIN FILM FOR PRODUCTION OF CLAD LAYER UTILIZING THE RESIN COMPOSITION, AND OPTICAL WAVEGUIDE AND OPTICAL MODULE EACH UTILIZING THE RESIN COMPOSITION OR THE RESIN FILM HITACHI CHEMICAL COMPANY, LTD. (JP) 2011-02-10 US disclosed
EP-2239603-A1 RESIN COMPOSITION FOR PRODUCTION OF CLAD LAYER, RESIN FILM FOR PRODUCTION OF CLAD LAYER UTILIZING THE RESIN COMPOSITION, AND OPTICAL WAVEGUIDE AND OPTICAL MODULE EACH UTILIZING THE RESIN COMPOSITION OR THE RESIN FILM Hitachi Chemical Company, Ltd. (JP) 2010-10-13 EP disclosed
US-6309747-B1 Liquid curable resin composition for optical fibers DSM N.V. (NL) 2001-10-30 US disclosed
US-5804311-A GLASS FIBER COATED WITH A PROTECTIVE COATINGS ACRYLIC COPOLYMER OR ADDITION-CONDENSATION COPOLYMER; DURABILITY, FLEXIBILITY, ELONGATION, HEAT RESISTANCE DSM N.V. (NL) 1998-09-08 US disclosed
EP-0746530-B1 LIQUID CURABLE RESIN COMPOSITION FOR OPTICAL FIBERS DSM NV (NL) 1998-04-22 EP disclosed
WO-1997046495-A1 LIQUID CURABLE RESIN COMPOSITION AND BUNDLED OPTICAL FIBERS DSM N.V. (NL) 1997-12-11 WO disclosed
WO-1997014737-A1 LIQUID CURABLE RESIN COMPOSITION DSM N.V. (NL) 1997-04-24 WO disclosed
EP-0746530-A1 LIQUID CURABLE RESIN COMPOSITION FOR OPTICAL FIBERS DSM N.V. (NL) 1996-12-11 EP disclosed
WO-1995023120-A1 LIQUID CURABLE RESIN COMPOSITION FOR OPTICAL FIBERS DSM N.V. (NL) 1995-08-31 WO disclosed
US-5093386-A Acrylated polyurethanes; coatings for optical fibers STAMICARBON B.V. (NL) 1992-03-03 US disclosed