SCHEMBL1152044

SCHEMBL1152044

C=C(C)C(=O)OCCOC(=O)C1CCC(C(=O)O)CC1

nearest known ligand 0.47

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
THRB P10828 1/20 0.47
TSHR P16473 3/20 0.42
ALDH1A1 P00352 2/20 0.41
PPM1B O75688 2/20 0.36
PTPN1 P18031 2/20 0.36
PPP1CC P36873 2/20 0.36
POLB P06746 1/20 0.36
APEX1 P27695 1/20 0.36
HTT P42858 1/20 0.36
TDP1 Q9NUW8 1/20 0.36
PLG P00747 1/20 0.35
PLAT P00750 1/20 0.35
LMNA P02545 1/20 0.35
CA1 P00915 2/20 0.34
CA2 P00918 2/20 0.34
MAPT P10636 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21868789 0.95 THRB (0.44) THRBTSHRALDH1A1PPM1BPTPN1
SCHEMBL17763330 0.94 TSHR (0.51) THRBTSHRALDH1A1PPM1BPTPN1
SCHEMBL16243824 0.94 TSHR (0.47) THRBTSHRALDH1A1PPM1BPTPN1
SCHEMBL17763329 0.94 TSHR (0.51) THRBTSHRALDH1A1PPM1BPTPN1
SCHEMBL2785959 0.93 THRB (0.53) THRBTSHRALDH1A1PPM1BPTPN1
SCHEMBL17763326 0.92 TSHR (0.54) THRBTSHRALDH1A1PPM1BPTPN1
SCHEMBL17763324 0.92 TSHR (0.54) THRBTSHRALDH1A1PPM1BPTPN1
SCHEMBL17763327 0.92 TSHR (0.54) THRBTSHRALDH1A1PPM1BPTPN1
SCHEMBL17763325 0.92 TSHR (0.54) THRBTSHRALDH1A1PPM1BPTPN1
SCHEMBL21868818 0.91 THRB (0.47) THRBTSHRALDH1A1PPM1BPTPN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20160280829-A1 RESIN COMPOSITION FOR FORMING OPTICAL WAVEGUIDE, RESIN FILM FOR FORMING OPTICAL WAVEGUIDE, AND OPTICAL WAVEGUIDE USING THE SAME HITACHI CHEMICAL COMPANY, LTD. (JP) 2016-09-29 US disclosed
US-20160209743-A1 PHOTOSENSITIVE RESIN COMPOSITION FOR FORMING MEMBER HAVING CURVED SHAPE, PHOTOSENSITIVE RESIN FILM FOR FORMING MEMBER HAVING CURVED SHAPE USING SAID COMPOSITION, AND LENS MEMBER MANUFACTRED USING SAID COMPOSITION OR SAID FILM HITACHI CHEMICAL COMPANY, LTD. (JP) 2016-07-21 US disclosed
US-9177819-B2 Method for manufacturing silicon substrate having textured structure TOKUYAMA CORPORATION (JP) 2015-11-03 US disclosed
US-20140349485-A1 METHOD FOR MANUFACTURING SILICON SUBSTRATE HAVING TEXTURED STRUCTURE TOKUYAMA CORPORATION a corporation 2014-11-27 US disclosed
US-8604096-B2 Photosensitive resin composition, photosensitive resin varnish, photosensitive resin film, and photosensitive resin cured product HITACHI CHEMICAL COMPANY, LTD. (JP) 2013-12-10 US disclosed
US-8573765-B2 Active radiation curable ink composition, ink composition for inkjet recording, printed matter, and method of producing molded article of printed matter FUJIFILM CORPORATION (JP) 2013-11-05 US disclosed
US-20120270963-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN VARNISH, PHOTOSENSITIVE RESIN FILM, AND PHOTOSENSITIVE RESIN CURED PRODUCT HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-10-25 US disclosed
US-20110241264-A1 ACTIVE RADIATION CURABLE INK COMPOSITION, INK COMPOSITION FOR INKJET RECORDING, PRINTED MATTER, AND METHOD OF PRODUCING MOLDED ARTICLE OF PRINTED MATTER FUJIFILM CORPORATION (JP) 2011-10-06 US disclosed
US-20110241264-A1 ACTIVE RADIATION CURABLE INK COMPOSITION, INK COMPOSITION FOR INKJET RECORDING, PRINTED MATTER, AND METHOD OF PRODUCING MOLDED ARTICLE OF PRINTED MATTER FUJIFILM CORPORATION (JP) 2011-10-06 US disclosed
US-20110033161-A1 RESIN COMPOSITION FOR PRODUCTION OF CLAD LAYER, RESIN FILM FOR PRODUCTION OF CLAD LAYER UTILIZING THE RESIN COMPOSITION, AND OPTICAL WAVEGUIDE AND OPTICAL MODULE EACH UTILIZING THE RESIN COMPOSITION OR THE RESIN FILM HITACHI CHEMICAL COMPANY, LTD. (JP) 2011-02-10 US disclosed
EP-2239603-A1 RESIN COMPOSITION FOR PRODUCTION OF CLAD LAYER, RESIN FILM FOR PRODUCTION OF CLAD LAYER UTILIZING THE RESIN COMPOSITION, AND OPTICAL WAVEGUIDE AND OPTICAL MODULE EACH UTILIZING THE RESIN COMPOSITION OR THE RESIN FILM Hitachi Chemical Company, Ltd. (JP) 2010-10-13 EP disclosed
EP-2182410-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PHOTOSENSITIVE RESIN PRODUCT, PHOTOSENSITIVE RESIN FILM, CURED PHOTOSENSITIVE RESIN FILM PRODUCT, AND OPTICAL WAVEGUIDE PRODUCED BY USING THOSE PRODUCTS Hitachi Chemical Company, Ltd. (JP) 2010-05-05 EP disclosed