Predicted protein targets (top 6)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.56 |
| ▸ | EPHX1 | P07099 | 1/20 | 0.38 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.32 |
| ▸ | ENPP2 | Q13822 | 10/20 | 0.31 |
| ▸ | LPAR2 | Q9HBW0 | 7/20 | 0.31 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8671828 | 0.84 | ALDH1A1 (0.50) | ALDH1A1EPHX1TDP1 | |
| SCHEMBL6050812 | 0.83 | ALDH1A1 (0.63) | ALDH1A1EPHX1SMN1; SMN2ENPP2LPAR2 | |
| SCHEMBL17255663 | 0.82 | EPHX1 (0.62) | ALDH1A1EPHX1 | |
| SCHEMBL13883684 | 0.81 | ALDH1A1 (0.54) | ALDH1A1EPHX1ENPP2LPAR2 | |
| SCHEMBL2450938 | 0.79 | — | — | |
| SCHEMBL27936182 | 0.79 | ALDH1A1 (0.38) | ALDH1A1EPHX1ENPP2LPAR2 | |
| SCHEMBL28143219 | 0.77 | ALDH1A1 (0.60) | ALDH1A1EPHX1SMN1; SMN2ENPP2LPAR2 | |
| SCHEMBL5340594 | 0.75 | ALDH1A1 (0.68) | ALDH1A1EPHX1SMN1; SMN2TDP1 | |
| SCHEMBL33715 | 0.75 | ALDH1A1 (0.68) | ALDH1A1EPHX1SMN1; SMN2TDP1 | |
| SCHEMBL7517505 | 0.75 | ALDH1A1 (0.68) | ALDH1A1EPHX1SMN1; SMN2TDP1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 76 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118053799-A | Method for manufacturing semiconductor device | 株式会社力森诺科 | 2024-05-17 | — | — | CN | disclosed |
| CN-117957494-A | Resin composition, light-shielding film, and substrate with partition wall | 东丽株式会社 | 2024-04-30 | — | — | CN | disclosed |
| CN-117157733-A | Method for manufacturing semiconductor device and dicing die-bonding integrated film | 株式会社力森诺科 | 2023-12-01 | — | — | CN | disclosed |
| CN-116802559-A | Photosensitive resin composition, cured film, electronic component, antenna element, semiconductor package, and compound | 东丽株式会社 | 2023-09-22 | — | — | CN | disclosed |
| US-20230197630-A1 | METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, RESIN COMPOSITION FOR TEMPORARY PROTECTION, AND RESIN FILM FOR TEMPORARY PROTECTION | RESONAC CORPORATION (JP) | 2023-06-22 | — | — | US | disclosed |
| WO-2023047592-A1 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 株式会社レゾナック | 2023-03-30 | — | — | WO | disclosed |
| CN-115668457-A | Method for producing electronic component, resin composition for temporary protection, and resin film for temporary protection | 昭和电工材料株式会社 | 2023-01-31 | — | — | CN | disclosed |
| WO-2022255321-A1 | INTEGRATED DICING/DIE BONDING FILM AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | 昭和電工マテリアルズ株式会社 | 2022-12-08 | — | — | WO | disclosed |
| WO-2022255322-A1 | METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND DICING-DIE BONDING INTEGRATED FILM | 昭和電工マテリアルズ株式会社 | 2022-12-08 | — | — | WO | disclosed |
| CN-112292431-B | Crystal cutting and crystal bonding integrated film and pressure-sensitive adhesive film used by same | 昭和电工材料株式会社 | 2022-09-02 | — | — | CN | disclosed |
| CN-1455933-A | Composite particle for dielectrics, ultramicro particulate composite resin particle, composition for forming dielectrics and use thereof | JSR CORP (JP) | 2003-11-12 | — | — | CN | disclosed |
| US-20030151032-A1 | Composite particle for dielectrics, ultramicroparticulate composite resin particle, composition for forming dielectrics and use thereof | JSR CORPORATION (JP) | 2003-08-14 | — | — | US | disclosed |
| US-20030068574-A1 | Radiation sensitive resin composition, rib, rib forming method and display element | JSR CORPORATION (JP) | 2003-04-10 | — | — | US | disclosed |
| EP-1296186-A1 | Radiation sensitive resin composition, rib, rib forming method and display element | JSR Corporation (JP) | 2003-03-26 | — | — | EP | disclosed |
| EP-0880075-B1 | Radiation sensitive resin composition | JSR CORP (JP) | 2001-10-17 | — | — | EP | disclosed |
| US-6299785-B1 | Electrode formation process | JSR CORPORATION (JP) | 2001-10-09 | — | — | US | disclosed |
| US-6168908-B1 | COATING AN ALKALI-SOLUBLE THERMOSETTING RESIN ON A SUBSTRATE, AND BAKING IT, COATING A RADIATION SENSITIVE RESIN ON THE COATED FILM, AND BAKING, EXPOSING THE RADIATION SENSITIVE FILM TO A RADIATION THROUGH A MASK AND BAKING, DEVELOPING | JSR CORPORATION (JP) | 2001-01-02 | — | — | US | disclosed |
| US-5958648-A | Radiation sensitive resin composition | JSR CORPORATION (JP) | 1999-09-28 | — | — | US | disclosed |
| EP-0908780-A1 | Process for forming a cured film of a thermosetting resin | JSR Corporation (JP) | 1999-04-14 | — | — | EP | disclosed |
| EP-0880075-A1 | Radiation sensitive resin composition | JSR Corporation (JP) | 1998-11-25 | — | — | EP | disclosed |