Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | SOAT1 | P35610 | 2/20 | 0.56 |
| ▸ | SOAT2 | O75908 | 1/20 | 0.56 |
| ▸ | PSMB11 | A5LHX3 | 1/20 | 0.54 |
| ▸ | PSMA7 | O14818 | 1/20 | 0.54 |
| ▸ | PSMB1 | P20618 | 1/20 | 0.54 |
| ▸ | PSMA1 | P25786 | 1/20 | 0.54 |
| ▸ | PSMA2 | P25787 | 1/20 | 0.54 |
| ▸ | PSMA3 | P25788 | 1/20 | 0.54 |
| ▸ | PSMA4 | P25789 | 1/20 | 0.54 |
| ▸ | PSMB8 | P28062 | 1/20 | 0.54 |
| ▸ | PSMB9 | P28065 | 1/20 | 0.54 |
| ▸ | PSMA5 | P28066 | 1/20 | 0.54 |
| ▸ | PSMB4 | P28070 | 1/20 | 0.54 |
| ▸ | PSMB6 | P28072 | 1/20 | 0.54 |
| ▸ | PSMB5 | P28074 | 1/20 | 0.54 |
| ▸ | PSMB10 | P40306 | 1/20 | 0.54 |
| ▸ | PSMB3 | P49720 | 1/20 | 0.54 |
| ▸ | PSMB2 | P49721 | 1/20 | 0.54 |
| ▸ | PSMA6 | P60900 | 1/20 | 0.54 |
| ▸ | PSMA8 | Q8TAA3 | 1/20 | 0.54 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL17612180 | 1.00 | SOAT1 (0.56) | SOAT1SOAT2PSMB11PSMA7PSMB1 | |
| SCHEMBL10491566 | 0.99 | SOAT1 (0.54) | SOAT1SOAT2PSMB11PSMA7PSMB1 | |
| Potassium SCHEMBL31403449 | 0.99 | SOAT1 (0.54) | SOAT1SOAT2PSMB11PSMA7PSMB1 | |
| SCHEMBL31403451 | 0.91 | KMT2A (0.49) | KMT2AMEN1FAAHLMNAPOLB | |
| Potassium SCHEMBL31403450 | 0.90 | KMT2A (0.48) | KMT2AMEN1FAAHLMNAPOLB | |
| SCHEMBL28757288 | 0.83 | SOAT1 (0.56) | SOAT1SOAT2PSMB11PSMA7PSMB1 | |
| SCHEMBL13227316 | 0.80 | KMT2A (0.55) | SOAT1KMT2AMEN1FAAHLMNA | |
| SCHEMBL9873967 | 0.79 | CNR1 (0.59) | SOAT1SOAT2PSMB11PSMA7PSMB1 | |
| SCHEMBL9873961 | 0.79 | CNR1 (0.59) | SOAT1SOAT2PSMB11PSMA7PSMB1 | |
| SCHEMBL8993787 | 0.79 | SOAT2 (0.64) | SOAT1SOAT2PSMB11PSMA7PSMB1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 29 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20220371241-A1 | METHOD FOR PRODUCING METAL-POLYMER COMPOSITES | ARKEMA FRANCE (FR) | 2022-11-24 | — | — | US | claimed |
| EP-3748046-A1 | METHOD FOR PRODUCING METAL-POLYMER COMPOSITES | ARKEMA FRANCE (FR) | 2020-12-09 | — | — | EP | claimed |
| US-20220380538-A1 | CURABLE COMPOSITION INCLUDING POLYPHENYLENE ETHER, DRY FILM, PREPREG, CURED PRODUCT, LAMINATED BOARD, AND ELECTRONIC COMPONENT | TAIYO HOLDINGS CO., LTD. (JP) | 2022-12-01 | — | — | US | disclosed |
| US-20220371241-A1 | METHOD FOR PRODUCING METAL-POLYMER COMPOSITES | ARKEMA FRANCE (FR) | 2022-11-24 | — | — | US | disclosed |
| US-20220372633-A1 | METHOD FOR CHEMICAL POLISH FOR METAL PIECES | ARKEMA FRANCE (FR) | 2022-11-24 | — | — | US | disclosed |
| CN-114502652-A | Curable composition containing polyphenylene ether, dry film, preform, cured product, laminate, and electronic component | 太阳控股株式会社 | 2022-05-13 | — | — | CN | disclosed |
| EP-3305519-B1 | METAL RESIN COMPOSITE | KANEKA CORP (JP) | 2021-06-30 | — | — | EP | disclosed |
| WO-2021065964-A1 | CURABLE COMPOSITION CONTAINING POLYPHENYLENE ETHER; DRY FILM; PREPREG; CURED PRODUCT; LAMINATE PLATE; AND ELECTRONIC COMPONENT | 太陽ホールディングス株式会社 | 2021-04-08 | — | — | WO | disclosed |
| EP-3770301-A1 | METHOD FOR CHEMICAL POLISH FOR METAL PIECES | ARKEMA FRANCE (FR) | 2021-01-27 | — | — | EP | disclosed |
| EP-3748046-A1 | METHOD FOR PRODUCING METAL-POLYMER COMPOSITES | ARKEMA FRANCE (FR) | 2020-12-09 | — | — | EP | disclosed |
| US-20190338119-A1 | RESIN COMPOSITION FOR BONDING METAL, PRODUCTION FORMED BY BONDING METAL WITH RESIN COMPOSITION, AND MANUFACTURING METHOD THEREOF | TORAY INDUSTRIES INC. (JP) | 2019-11-07 | — | — | US | disclosed |
| EP-2689910-A1 | COMPOSITE OF METAL AND THERMOPLASTIC RESIN | Ube Industries, Ltd. (JP) | 2014-01-29 | — | — | EP | disclosed |
| US-8394503-B2 | Resin-metal bonded article and method for producing the same | TOADENKA CORPORATION (JP) | 2013-03-12 | — | — | US | disclosed |
| US-20110033711-A1 | RESIN-METAL BONDED ARTICLE AND METHOD FOR PRODUCING THE SAME | DENSO CORPORATION (JP) | 2011-02-10 | — | — | US | disclosed |
| US-20100279108-A1 | RESIN- METAL BONDED BODY AND METHOD FOR PRODUCING THE SAME | DENSO CORPORATION (JP) | 2010-11-04 | — | — | US | disclosed |
| EP-2224036-A1 | RESIN-METAL BONDED ARTICLE AND METHOD FOR PRODUCING THE SAME | DENSO CORPORATION (JP) | 2010-09-01 | — | — | EP | disclosed |
| EP-2221398-A1 | RESIN-METAL BONDED BODY AND METHOD FOR PRODUCING THE SAME | Toadenka Corporation (JP) | 2010-08-25 | — | — | EP | disclosed |
| WO-2009077840-A2 | RESIN-BONDING ALUMINUM MEMBER AND METHOD OF PRODUCING THE SAME | TOYOTA JIDOSHA KABUSHIKI KAISHA (DE) | 2009-06-25 | — | — | WO | disclosed |
| US-6445567-B1 | Cap member for electrical double layer capacitor container | HONDA GIKEN KOGYO KABUSHIKI KAISHA (JP) | 2002-09-03 | — | — | US | disclosed |
| US-20020105776-A1 | CAP MEMBER FOR ELECTRICAL DOUBLE LAYER CAPACITOR CONTAINER | HONDA GIKEN KOGYO KABUSHIKI KAISHA | 2002-08-08 | — | — | US | disclosed |