⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL51917 | 0.85 | — | — | |
| SCHEMBL10800832 | 0.84 | — | — | |
| SCHEMBL10907528 | 0.83 | — | — | |
| SCHEMBL28298366 | 0.82 | ALDH1A1 (0.38) | — | |
| SCHEMBL27968046 | 0.80 | ALDH1A1 (0.41) | — | |
| SCHEMBL4309009 | 0.77 | — | — | |
| SCHEMBL14515194 | 0.77 | — | — | |
| SCHEMBL18597295 | 0.74 | ALDH1A1 (0.39) | — | |
| SCHEMBL17900418 | 0.74 | ALDH1A1 (0.39) | — | |
| SCHEMBL51199 | 0.74 | CYP1A2 (0.35) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 99 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-104024318-B | Curable compositions based on the nitrile rubber containing epoxide group | 朗盛德国有限责任公司 | 2016-10-26 | — | — | CN | claimed |
| CN-118053799-A | Method for manufacturing semiconductor device | 株式会社力森诺科 | 2024-05-17 | — | — | CN | disclosed |
| CN-117957494-A | Resin composition, light-shielding film, and substrate with partition wall | 东丽株式会社 | 2024-04-30 | — | — | CN | disclosed |
| CN-117157733-A | Method for manufacturing semiconductor device and dicing die-bonding integrated film | 株式会社力森诺科 | 2023-12-01 | — | — | CN | disclosed |
| US-11822243-B2 | Negative-type photosensitive resin composition, cured film, element and display device provided with cured film, and production method therefor | TORAY INDUSTRIES, INC. (JP) | 2023-11-21 | — | — | US | disclosed |
| CN-116802559-A | Photosensitive resin composition, cured film, electronic component, antenna element, semiconductor package, and compound | 东丽株式会社 | 2023-09-22 | — | — | CN | disclosed |
| US-20230197630-A1 | METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, RESIN COMPOSITION FOR TEMPORARY PROTECTION, AND RESIN FILM FOR TEMPORARY PROTECTION | RESONAC CORPORATION (JP) | 2023-06-22 | — | — | US | disclosed |
| WO-2023048016-A1 | RESIN COMPOSITION, LIGHT-SHIELDING FILM, AND SUBSTRATE WITH PARTITIONING WALL | 東レ株式会社 | 2023-03-30 | — | — | WO | disclosed |
| WO-2023047592-A1 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 株式会社レゾナック | 2023-03-30 | — | — | WO | disclosed |
| CN-115668457-A | Method for producing electronic component, resin composition for temporary protection, and resin film for temporary protection | 昭和电工材料株式会社 | 2023-01-31 | — | — | CN | disclosed |
| CN-1409132-A | Spacer plate for ink jet colour filter | JSR CORP (JP) | 2003-04-09 | — | — | CN | disclosed |
| EP-1296186-A1 | Radiation sensitive resin composition, rib, rib forming method and display element | JSR Corporation (JP) | 2003-03-26 | — | — | EP | disclosed |
| US-6335143-B1 | Resist composition containing specific cross-linking agent | WAKO PURE CHEMICAL INDUSTRIES LTD. (JP) | 2002-01-01 | — | — | US | disclosed |
| EP-0880075-B1 | Radiation sensitive resin composition | JSR CORP (JP) | 2001-10-17 | — | — | EP | disclosed |
| US-6299785-B1 | Electrode formation process | JSR CORPORATION (JP) | 2001-10-09 | — | — | US | disclosed |
| US-6168908-B1 | COATING AN ALKALI-SOLUBLE THERMOSETTING RESIN ON A SUBSTRATE, AND BAKING IT, COATING A RADIATION SENSITIVE RESIN ON THE COATED FILM, AND BAKING, EXPOSING THE RADIATION SENSITIVE FILM TO A RADIATION THROUGH A MASK AND BAKING, DEVELOPING | JSR CORPORATION (JP) | 2001-01-02 | — | — | US | disclosed |
| US-5958648-A | Radiation sensitive resin composition | JSR CORPORATION (JP) | 1999-09-28 | — | — | US | disclosed |
| EP-0908780-A1 | Process for forming a cured film of a thermosetting resin | JSR Corporation (JP) | 1999-04-14 | — | — | EP | disclosed |
| EP-0887706-A1 | Resist composition containing specific cross-linking agent | WAKO PURE CHEMICAL INDUSTRIES, LTD (JP) | 1998-12-30 | — | — | EP | disclosed |
| EP-0880075-A1 | Radiation sensitive resin composition | JSR Corporation (JP) | 1998-11-25 | — | — | EP | disclosed |