Predicted protein targets (top 6)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | NAAA | Q02083 | 4/20 | 0.51 |
| ▸ | EPHX2 | P34913 | 2/20 | 0.49 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.47 |
| ▸ | EPHX1 | P07099 | 1/20 | 0.46 |
| ▸ | PPARG | P37231 | 3/20 | 0.46 |
| ▸ | PRKCA | P17252 | 1/20 | 0.44 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30977763 | 1.00 | NAAA (0.51) | NAAAEPHX2ALDH1A1EPHX1PPARG | |
| SCHEMBL26846117 | 1.00 | NAAA (0.51) | NAAAEPHX2ALDH1A1EPHX1PPARG | |
| SCHEMBL2059827 | 1.00 | NAAA (0.51) | NAAAEPHX2ALDH1A1EPHX1PPARG | |
| SCHEMBL6049453 | 1.00 | NAAA (0.51) | NAAAEPHX2ALDH1A1EPHX1PPARG | |
| SCHEMBL21569213 | 1.00 | NAAA (0.51) | NAAAEPHX2ALDH1A1EPHX1PPARG | |
| SCHEMBL5710073 | 1.00 | NAAA (0.51) | NAAAEPHX2ALDH1A1EPHX1PPARG | |
| SCHEMBL28824165 | 0.98 | NAAA (0.50) | NAAAEPHX2ALDH1A1EPHX1PPARG | |
| SCHEMBL28458353 | 0.98 | NAAA (0.50) | NAAAEPHX2ALDH1A1EPHX1PPARG | |
| SCHEMBL2253748 | 0.98 | NAAA (0.50) | NAAAEPHX2ALDH1A1EPHX1PPARG | |
| SCHEMBL18924835 | 0.98 | NAAA (0.50) | NAAAEPHX2ALDH1A1EPHX1PPARG |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-111387182-B | Preparation for preventing and treating storage pests and using method thereof | 安徽华安种业有限责任公司 | 2022-04-12 | — | — | CN | claimed |
| CN-111387182-A | Preparation for preventing and treating storage pests and using method thereof | 安徽省农业科学院水稻研究所 | 2020-07-10 | — | — | CN | claimed |
| US-20240383035-A1 | ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT | RESONAC CORPORATION (JP) | 2024-11-21 | — | — | US | disclosed |
| US-12070800-B2 | Electronic component and method for manufacturing electronic component | RESONAC CORPORATION (JP) | 2024-08-27 | — | — | US | disclosed |
| EP-3597331-B1 | METAL PASTE FOR JOINTS, ASSEMBLY, PRODUCTION METHOD FOR ASSEMBLY, SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE | RESONAC CORP (JP) | 2024-02-21 | — | — | EP | disclosed |
| EP-3703140-B1 | METHOD FOR MANUFACTURING THERMOELECTRIC CONVERSION MODULE, THERMOELECTRIC CONVERSION MODULE, AND BINDER FOR THERMOELECTRIC CONVERSION MODULE | RESONAC CORP (JP) | 2023-11-22 | — | — | EP | disclosed |
| EP-3569329-B1 | COPPER PASTE FOR PRESSURELESS BONDING, BONDED BODY AND SEMICONDUCTOR DEVICE | RESONAC CORP (JP) | 2023-11-01 | — | — | EP | disclosed |
| US-11575076-B2 | Method for manufacturing thermoelectric conversion module, thermoelectric conversion module, and binder for thermoelectric conversion module | SHOWA DENKO MATERIALS CO., LTD. (JP) | 2023-02-07 | — | — | US | disclosed |
| US-11532588-B2 | Copper paste for pressureless bonding, bonded body and semiconductor device | SHOWA DENKO MATERIALS CO., LTD. (JP) | 2022-12-20 | — | — | US | disclosed |
| US-11462502-B2 | Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device | SHOWA DENKO MATERIALS CO., LTD. (JP) | 2022-10-04 | — | — | US | disclosed |
| US-11370066-B2 | Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device | SHOWA DENKO MATERIALS CO., LTD. (JP) | 2022-06-28 | — | — | US | disclosed |
| US-20200295248-A1 | METHOD FOR MANUFACTURING THERMOELECTRIC CONVERSION MODULE, THERMOELECTRIC CONVERSION MODULE, AND BINDER FOR THERMOELECTRIC CONVERSION MODULE | RESONAC CORPORATION (JP) | 2020-09-17 | — | — | US | disclosed |
| EP-3703140-A1 | METHOD FOR MANUFACTURING THERMOELECTRIC CONVERSION MODULE, THERMOELECTRIC CONVERSION MODULE, AND BINDER FOR THERMOELECTRIC CONVERSION MODULE | Hitachi Chemical Co., Ltd. (JP) | 2020-09-02 | — | — | EP | disclosed |
| CN-111387182-A | Preparation for preventing and treating storage pests and using method thereof | 安徽省农业科学院水稻研究所 | 2020-07-10 | — | — | CN | disclosed |
| US-20200130109-A1 | METAL PASTE FOR JOINTS, ASSEMBLY, PRODUCTION METHOD FOR ASSEMBLY, SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE | RESONAC CORPORATION (JP) | 2020-04-30 | — | — | US | disclosed |
| US-20200075528-A1 | METAL PASTE FOR JOINTS, ASSEMBLY, PRODUCTION METHOD FOR ASSEMBLY, SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE | RESONAC CORPORATION (JP) | 2020-03-05 | — | — | US | disclosed |
| US-20190355690-A1 | COPPER PASTE FOR PRESSURELESS BONDING, BONDED BODY AND SEMICONDUCTOR DEVICE | RESONAC CORPORATION (JP) | 2019-11-21 | — | — | US | disclosed |
| EP-3569329-A1 | COPPER PASTE FOR PRESSURELESS BONDING, BONDED BODY AND SEMICONDUCTOR DEVICE | Hitachi Chemical Company, Ltd. (JP) | 2019-11-20 | — | — | EP | disclosed |
| US-9632222-B2 | Method for manufacturing a color filter, color filter and solid-state imaging device | FUJIFILM CORPORATION (JP) | 2017-04-25 | — | — | US | disclosed |
| US-4098817-A | OXIDATION OF CYCLOALIPHATIC COMPOUNDS | PETRO-TEX CHEMICAL CORPORATION (US) | 1978-07-04 | — | — | US | disclosed |