⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL11497334 | 0.97 | — | — | |
| SCHEMBL4151529 | 0.97 | — | — | |
| Hydrochloric Acid SCHEMBL28048019 | 0.97 | — | — | |
| SCHEMBL31413042 | 0.97 | — | — | |
| SCHEMBL14027613 | 0.82 | — | — | |
| SCHEMBL12599022 | 0.79 | — | — | |
| Dimethyl Fumarate SCHEMBL29446943 | 0.79 | NFE2L2 (0.48) | — | |
| SCHEMBL7061371 | 0.78 | — | — | |
| SCHEMBL13933658 | 0.78 | — | — | |
| SCHEMBL9341805 | 0.74 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 374 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12479867-B2 | Processes for synthesizing unsymmetrical disiloxanes | DOW SILICONES CORPORATION (US) | 2025-11-25 | — | — | US | claimed |
| US-12331164-B2 | Curable siloxane resin composition | KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY (KR) | 2025-06-17 | — | — | US | claimed |
| CN-118374135-B | Antibacterial waterproof high polymer material for tablecloth and preparation method thereof | 东莞市悠悠美居家居制造有限公司 | 2024-12-17 | — | — | CN | claimed |
| CN-118571973-B | Gap reflective film for photovoltaic module, preparation method of gap reflective film and photovoltaic module | 同享（苏州）电子材料科技股份有限公司 | 2024-09-24 | — | — | CN | claimed |
| CN-118571973-A | Gap reflective film for photovoltaic module, preparation method of gap reflective film and photovoltaic module | 同享（苏州）电子材料科技股份有限公司 | 2024-08-30 | — | — | CN | claimed |
| CN-118374135-A | Antibacterial waterproof high polymer material for tablecloth and preparation method thereof | 东莞市悠悠美居家居制造有限公司 | 2024-07-23 | — | — | CN | claimed |
| CN-117965023-A | Puncture-resistant nylon film with high surface wetting tension and preparation method and application thereof | 昆山运城塑业有限公司 | 2024-05-03 | — | — | CN | claimed |
| CN-117586597-B | Aging-resistant polypropylene material and preparation method thereof | 苏州禾昌聚合材料股份有限公司 | 2024-03-29 | — | — | CN | claimed |
| CN-117586597-A | Aging-resistant polypropylene material and preparation method thereof | 苏州禾昌聚合材料股份有限公司 | 2024-02-23 | — | — | CN | claimed |
| CN-117024741-A | Preparation method of vinyl silicone oil | 浙江恒业成新材料有限公司 | 2023-11-10 | — | — | CN | claimed |
| US-20070173071-A1 | SiCOH dielectric | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2007-07-26 | — | — | US | claimed |
| EP-1716269-A2 | PROCESS FOR PRODUCING SIO2-CONTAINING INSULATING LAYERS ON CHIPS | Degussa GmbH (DE) | 2006-11-02 | — | — | EP | claimed |
| CN-1819180-A | Dielectric materialand method to make the same | IBM (US) | 2006-08-16 | — | — | CN | claimed |
| US-20060165891-A1 | SiCOH dielectric material with improved toughness and improved Si-C bonding, semiconductor device containing the same, and method to make the same | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2006-07-27 | — | — | US | claimed |
| CN-1782125-A | Method for forming dielectric film and dielectric film | IBM (US) | 2006-06-07 | — | — | CN | claimed |
| US-20060079099-A1 | Ultra low k plasma enhanced chemical vapor deposition processes using a single bifunctional precursor containing both a SiCOH matrix functionality and organic porogen functionality | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2006-04-13 | — | — | US | claimed |
| US-20050194619-A1 | SiCOH dielectric material with improved toughness and improved Si-C bonding, semiconductor device containing the same, and method to make the same | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2005-09-08 | — | — | US | claimed |
| WO-2005080629-A2 | SILICON COMPOUNDS FOR PRODUCING SiO2-CONTAINING INSULATING LAYERS ON CHIPS | DEGUSSA AG (DE) | 2005-09-01 | — | — | WO | claimed |
| EP-1200525-A1 | CURABLE COMPOSITIONS COMPRISING THE HYDROSILYLATION PRODUCT OF OLEFINIC GROUPS-CONTAINING POLYMERS AND ORGANOSILOXANE HYDRIDES, CURED COMPOSITIONS OBTAINABLE THEREFROM, AND METHODS OF MAKING SAME | 3M Innovative Properties Company (US) | 2002-05-02 | — | — | EP | claimed |
| WO-2001009250-A1 | CURABLE COMPOSITIONS COMPRISING THE HYDROSILYLATION PRODUCT OF OLEFINIC GROUPS-CONTAINING POLYMERS AND ORGANOSILOXANE HYDRIDES, CURED COMPOSITIONS OBTAINABLE THEREFROM, AND METHODS OF MAKING SAME | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2001-02-08 | — | — | WO | claimed |