SCHEMBL1172292

SCHEMBL1172292

CCCCC[N+](C)(CCC)CCC

nearest known ligand 0.57

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
DNM1 Q05193 10/20 0.57
SLC22A1 O15245 2/20 0.56
SLC22A2 O15244 1/20 0.56
HTT P42858 2/20 0.55
LSS P48449 1/20 0.50
KMT2A Q03164 1/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3314068 1.00 DNM1 (0.57) DNM1SLC22A1SLC22A2HTTLSS
SCHEMBL26306429 0.97 DNM1 (0.62) DNM1SLC22A1HTTLSS
SCHEMBL17345005 0.97 DNM1 (0.62) DNM1SLC22A1HTTLSS
SCHEMBL26306438 0.97 DNM1 (0.62) DNM1SLC22A1HTTLSS
SCHEMBL2334047 0.97 DNM1 (0.62) DNM1SLC22A1HTTLSS
SCHEMBL3309633 0.97 DNM1 (0.62) DNM1SLC22A1HTTLSS
SCHEMBL3308106 0.97 DNM1 (0.57) DNM1SLC22A1SLC22A2HTTLSS
SCHEMBL3311711 0.97 DNM1 (0.62) DNM1SLC22A1HTTLSS
SCHEMBL3304006 0.97 DNM1 (0.62) DNM1SLC22A1HTTLSS
SCHEMBL26306423 0.97 DNM1 (0.62) DNM1SLC22A1HTTLSS

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 200 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2863452-A1 Battery separation layer comprising a quaternary ammonium fluorinated salt coating material Samsung SDI Co., Ltd. (KR) 2015-04-22 EP claimed
WO-2025079717-A1 POLYESTER FILM HAVING RESIN THIN FILM LAYER 東洋紡株式会社 2025-04-17 WO disclosed
WO-2025079681-A1 WHITE POLYESTER FILM 東洋紡株式会社 2025-04-17 WO disclosed
WO-2025079674-A1 THERMOPLASTIC RESIN COMPOSITION 東洋紡株式会社 2025-04-17 WO disclosed
WO-2025079719-A1 COPOLYESTER FILM AND HEAT-SHRINKABLE POLYESTER FILM 東洋紡株式会社 2025-04-17 WO disclosed
WO-2025079727-A1 LAMINATE HAVING POLYESTER FILM AND FUNCTIONAL LAYER 東洋紡株式会社 2025-04-17 WO disclosed
WO-2025079679-A1 POLYESTER FILM, METHOD FOR PRODUCING SAME, AND RESIN COMPOSITION 東洋紡株式会社 2025-04-17 WO disclosed
EP-4536395-A1 CLAY COMPOSITE SUPPORT-ACTIVATORS AND CATALYST COMPOSITIONS Formosa Plastics Corporation, U.S.A. (US) 2025-04-16 EP disclosed
CN-114716944-B Surface protective film 日东电工株式会社 2025-02-25 CN disclosed
CN-119159883-A Laminate, image display member, method for manufacturing image display member, mobile electronic device, and method for manufacturing mobile electronic device 日东电工株式会社 2024-12-20 CN disclosed
EP-1702967-A1 Pressure-sensitive adhesive compositions, pressure-sensitive adhesive sheets and surface protecting films Nitto Denko Corporation (JP) 2006-09-20 EP disclosed
US-20060188711-A1 Pressure-sensitive adhesive compositions, pressure-sensitive adhesive sheets, and double-sided pressure- sensitive adhesive tapes NITTO DENKO CORPORATION (JP) 2006-08-24 US disclosed
EP-1693430-A2 Pressure-sensitive adhesive compositions, pressure-sensitive adhesive sheets, and double-sided pressure-sensitive adhesive tapes Nitto Denko Corporation (JP) 2006-08-23 EP disclosed
US-20060024494-A1 Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheets, and surface protecting film NITTO DENKO CORPORATION (JP) 2006-02-02 US disclosed
EP-1621596-A2 Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheets, and surface protecting film Nitto Denko Corporation (JP) 2006-02-01 EP disclosed
EP-1602698-A1 Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheet and surface protecting film Nitto Denko Corporation (JP) 2005-12-07 EP disclosed
US-20050266238-A1 Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheet and surface protecting film NITTO DENKO CORPORATION (JP) 2005-12-01 US disclosed
EP-1582573-A2 Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheets and surface protecting film Nitto Denko Corporation (JP) 2005-10-05 EP disclosed
CN-1667071-A Adhesive composition, adhesive sheets and surface protective film NITTO DENKO CORP (JP) 2005-09-14 CN disclosed
US-20050197450-A1 Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheets and surface protecting film NITTO DENKO CORPORATION (JP) 2005-09-08 US disclosed