Known targets — ChEMBL curated mechanism
MMP1MMP13MMP7MMP8polrplArplBrplCrplDrplErplFrplJrplKrplLrplMrplNrplOrplPrplQrplRrplSrplTrplUrplVrplWrplXrplYrpmArpmBrpmCrpmDrpmErpmFrpmGrpmHrpmIrpmJrpsArpsBrpsCrpsDrpsErpsFrpsGrpsHrpsIrpsJrpsKrpsLrpsMrpsNrpsOrpsPrpsQrpsRrpsSrpsTrpsUykgMykgO
The experimentally established mechanism targets of Alcohol. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 18)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | DNM1 | Q05193 | 3/20 | 0.46 |
| ▸ | GGPS1 | O95749 | 3/20 | 0.39 |
| ▸ | LMNA | P02545 | 3/20 | 0.39 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.39 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.39 |
| ▸ | MEN1 | O00255 | 1/20 | 0.39 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.39 |
| ▸ | TSHR | P16473 | 1/20 | 0.39 |
| ▸ | SPHK1 | Q9NYA1 | 2/20 | 0.38 |
| ▸ | CA12 | O43570 | 1/20 | 0.38 |
| ▸ | CA1 | P00915 | 1/20 | 0.38 |
| ▸ | CA2 | P00918 | 1/20 | 0.38 |
| ▸ | CA9 | Q16790 | 1/20 | 0.38 |
| ▸ | S1PR2 | O95136 | 1/20 | 0.37 |
| ▸ | S1PR1 | P21453 | 1/20 | 0.37 |
| ▸ | S1PR3 | Q99500 | 1/20 | 0.37 |
| ▸ | S1PR5 | Q9H228 | 1/20 | 0.37 |
| ▸ | CETP | P11597 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1403920 | 0.96 | DNM1 (0.50) | DNM1GGPS1TSHRSPHK1CA12 | |
| SCHEMBL8766777 | 0.96 | DNM1 (0.50) | DNM1GGPS1TSHRSPHK1CA12 | |
| SCHEMBL1036020 | 0.96 | DNM1 (0.50) | DNM1GGPS1TSHRSPHK1CA12 | |
| SCHEMBL28217320 | 0.96 | DNM1 (0.50) | DNM1GGPS1TSHRSPHK1CA12 | |
| Hydrochloric Acid SCHEMBL28187535 | 0.93 | DNM1 (0.52) | DNM1GGPS1SPHK1CA12CA1 | |
| Hydrochloric Acid SCHEMBL8057248 | 0.93 | DNM1 (0.52) | DNM1GGPS1SPHK1CA12CA1 | |
| Hydrochloric Acid SCHEMBL28919676 | 0.93 | DNM1 (0.52) | DNM1GGPS1SPHK1CA12CA1 | |
| Hydrochloric Acid SCHEMBL28013671 | 0.93 | DNM1 (0.52) | DNM1GGPS1SPHK1CA12CA1 | |
| Hydrochloric Acid SCHEMBL28268950 | 0.91 | DNM1 (0.50) | DNM1GGPS1SPHK1CA12CA1 | |
| SCHEMBL1040028 | 0.86 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7959886-B2 | Mixed-layered phyllosilicate and process for producing the same | NATIONAL INSTITUTE FOR MATERIALS SCIENCE (JP) | 2011-06-14 | — | — | US | disclosed |
| US-7888416-B2 | Method for production of organic-inorganic complex, organic-inorganic complex, and polymeric composite material | NATIONAL INSTITUTE FOR MATERIALS SCIENCE (JP) | 2011-02-15 | — | — | US | disclosed |
| EP-2248855-A1 | PROCESS FOR PRODUCING RESIN COMPOSITION WITH PARTIAL-DISCHARGE RESISTANCE, RESIN COMPOSITION WITH PARTIAL-DISCHARGE RESISTANCE, AND INSULATING MATERIAL WITH PARTIAL-DISCHARGE RESISTANCE | Kabushiki Kaisha Toshiba (JP) | 2010-11-10 | — | — | EP | disclosed |
| US-20090266585-A1 | Flame-Retardant Composition for Solder Resist and Cured Product Thereof | SHOWDA DENKO K.K. (JP) | 2009-10-29 | — | — | US | disclosed |
| US-20090233107-A1 | MIXED-LAYERED PHYLLOSILICATE AND PROCESS FOR PRODUCING THE SAME | NATIONAL INSTITUTE FOR MATERIALS SCIENCE (JP) | 2009-09-17 | — | — | US | disclosed |
| US-20090227715-A1 | METHOD FOR PRODUCTION OF ORGANIC-INORGANIC COMPLEX, ORGANIC-INORGANIC COMPLEX, AND POLYMERIC COMPOSITE MATERIAL | NATIONAL INSTITUTE FOR MATERIALS SCIENCE (JP) | 2009-09-10 | — | — | US | disclosed |
| EP-2058366-A1 | CASTING RESIN COMPOSITION, INSULATING MATERIAL USING THE SAME, AND INSULATING STRUCTURE | Kabushiki Kaisha Toshiba (JP) | 2009-05-13 | — | — | EP | disclosed |
| EP-1241039-B1 | Tank joint parts and a process for manufacturing an annular molded product of resins | TOKAI RUBBER IND LTD (JP) | 2004-08-11 | — | — | EP | disclosed |
| US-6676165-B2 | Tank joint parts and a process for manufacturing an annular molded product of resins | TOKAI RUBBER INDUSTRIES, LTD. (JP) | 2004-01-13 | — | — | US | disclosed |
| US-20020167163-A1 | Tank joint parts and a process for manufacturing an annular molded product of resins | SUMITOMO RIKO COMPANY LIMITED (JP) | 2002-11-14 | — | — | US | disclosed |
| EP-1241039-A1 | Tank joint parts and a process for manufacturing an annular molded product of resins | Tokai Rubber Industries, Ltd. (JP) | 2002-09-18 | — | — | EP | disclosed |
| EP-0995591-A1 | Adhesive resin-silicate composite and multi-layer product thereof | SHOWA DENKO KABUSHIKI KAISHA (JP) | 2000-04-26 | — | — | EP | disclosed |