SCHEMBL1189329

SCHEMBL1189329

[Co].[Hf].[Ni]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3418287 0.82
SCHEMBL38517 0.82
SCHEMBL30596277 0.82
SCHEMBL6757709 0.82
SCHEMBL8361587 0.82
SCHEMBL3416083 0.82
SCHEMBL27918744 0.82
SCHEMBL31299184 0.82
SCHEMBL22261429 0.67
SCHEMBL2709874 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 51 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3231548-B1 METHODS OF BRAZING WIDE GAPS IN NICKEL BASE SUPERALLOYS WITHOUT SUBSTANTIAL DEGRADATION OF PROPERTIES SIEMENS ENERGY INC (US) 2020-08-19 EP disclosed
CN-107414224-B Method of brazing wide gaps in nickel-based superalloys without significant degradation of properties 西门子能源有限公司 2020-04-14 CN disclosed
US-9839980-B2 Methods of brazing wide gaps in nickel base superalloys without substantial degradation of properties SIEMENS ENERGY, INC. (US) 2017-12-12 US disclosed
CN-107414224-A The method of broad gap in solder brazing nickel-based superalloy without notable degradation characteristic 西门子能源有限公司 2017-12-01 CN disclosed
US-20170297147-A1 METHODS OF BRAZING WIDE GAPS IN NICKEL BASE SUPERALLOYS WITHOUT SUBSTANTIAL DEGREDATION OF PROPERTIES SIEMENS ENERGY, INC. 2017-10-19 US disclosed
EP-3231548-A1 METHODS OF BRAZING WIDE GAPS IN NICKEL BASE SUPERALLOYS WITHOUT SUBSTANTIAL DEGREDATION OF PROPERTIES Siemens Energy, Inc. (US) 2017-10-18 EP disclosed
US-9659758-B2 Coils utilized in vapor deposition applications and methods of production HONEYWELL INTERNATIONAL INC. (US) 2017-05-23 US disclosed
US-9279178-B2 Manufacturing design and processing methods and apparatus for sputtering targets HONEYWELL INTERNATIONAL INC. (US) 2016-03-08 US disclosed
US-8702919-B2 Target designs and related methods for coupled target assemblies, methods of production and uses thereof HONEYWELL INTERNATIONAL INC. (US) 2014-04-22 US disclosed
US-8398833-B2 Use of DC magnetron sputtering systems HONEYWELL INTERNATIONAL INC. (US) 2013-03-19 US disclosed
EP-1583852-A2 TARGET DESIGNS AND RELATED METHODS FOR ENHANCED COOLING AND REDUCED DEFLECTION AND DEFORMATION Honeywell International, Inc. (US) 2005-10-12 EP disclosed
WO-2004032184-A9 LOW TEMPERATURE SALICIDE FORMING MATERIALS AND SPUTTERING TARGETS FORMED THEREFROM HONEYWELL INT INC (US) 2004-10-21 WO disclosed
WO-2004066360-A2 APPARATUS AND METHODS FOR IONIZED DEPOSITION OF A FILM OR THIN LAYER HONEYWELL INTERNATIONAL INC (US) 2004-08-05 WO disclosed
WO-2004024979-A9 SENSOR SYSTEM AND METHODS USED TO DETECT MATERIAL WEAR AND SURFACE DETERIORATION HONEYWELL INT INC (US) 2004-07-15 WO disclosed
US-20040104110-A1 Topologically tailored sputtering targets LEE EAL H (US) 2004-06-03 US disclosed
WO-2004038059-A2 TARGET DESIGNS AND RELATED METHODS FOR ENHANCED COOLING AND REDUCED DEFLECTION AND DEFORMATION HONEYWELL INTERNATIONAL INC (US) 2004-05-06 WO disclosed
WO-2004032184-A2 LOW TEMPERATURE SALICIDE FORMING MATERIALS AND SPUTTERING TARGETS FORMED THEREFROM HONEYWELL INTERNATIONAL, INC. (US) 2004-04-15 WO disclosed
WO-2004024979-A1 SENSOR SYSTEM AND METHODS USED TO DETECT MATERIAL WEAR AND SURFACE DETERIORATION HONEYWELL INTERNATIONAL INC. (US) 2004-03-25 WO disclosed
EP-1370708-A1 TOPOLOGICALLY TAILORED SPUTTERING TARGETS Honeywell International, Inc. (US) 2003-12-17 EP disclosed
WO-2003000950-A1 TOPOLOGICALLY TAILORED SPUTTERING TARGETS HONEYWELL INTERNATIONAL INC. (US) 2003-01-03 WO disclosed