Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.40 |
| ▸ | TP53 | P04637 | 3/20 | 0.40 |
| ▸ | TSHR | P16473 | 3/20 | 0.40 |
| ▸ | MAPT | P10636 | 2/20 | 0.40 |
| ▸ | HPGD | P15428 | 2/20 | 0.40 |
| ▸ | MEN1 | O00255 | 2/20 | 0.40 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.40 |
| ▸ | HIF1A | Q16665 | 2/20 | 0.40 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.40 |
| ▸ | PPARG | P37231 | 1/20 | 0.40 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.39 |
| ▸ | PKM | P14618 | 2/20 | 0.38 |
| ▸ | LMNA | P02545 | 1/20 | 0.38 |
| ▸ | GAA | P10253 | 1/20 | 0.38 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.35 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.35 |
| ▸ | GLA | P06280 | 1/20 | 0.32 |
| ▸ | NPC1 | O15118 | 1/20 | 0.31 |
| ▸ | CASP3 | P42574 | 1/20 | 0.31 |
| ▸ | RAB9A | P51151 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2718908 | 0.91 | TDP1 (0.46) | ALDH1A1TP53TSHRMAPTHPGD | |
| SCHEMBL2729993 | 0.85 | MCHR1 (0.32) | — | |
| SCHEMBL2825828 | 0.83 | HRH3 (0.33) | NPC1CASP3RAB9ASENP8NLRP3 | |
| SCHEMBL2717657 | 0.83 | ALDH1A1 (0.40) | ALDH1A1TP53TSHRMAPTHPGD | |
| SCHEMBL15161895 | 0.82 | TP53 (0.38) | ALDH1A1TP53TSHRMAPTHPGD | |
| SCHEMBL2720090 | 0.81 | TSHR (0.36) | ALDH1A1TP53TSHRMAPTHPGD | |
| SCHEMBL15993655 | 0.80 | ALDH1A1 (0.55) | ALDH1A1TP53TSHRMAPTHPGD | |
| SCHEMBL2720292 | 0.80 | ALDH1A1 (0.42) | ALDH1A1TP53TSHRMAPTHPGD | |
| SCHEMBL2718089 | 0.80 | ALDH1A1 (0.37) | ALDH1A1TP53TSHRMAPTHPGD | |
| SCHEMBL2718269 | 0.80 | ALDH1A1 (0.37) | ALDH1A1TP53TSHRMAPTHPGD |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2692526-B1 | MULTILAYER RESIN SHEET, RESIN SHEET LAMINATE, CURED MULTILAYER RESIN SHEET AND METHOD FOR PRODUCING SAME, MULTILAYER RESIN SHEET WITH METAL FOIL, AND SEMICONDUCTOR DEVICE | HITACHI CHEMICAL CO LTD (JP) | 2020-10-28 | — | — | EP | disclosed |
| US-20200216324-A1 | COMPLEX OF LAMELLAR INORGANIC COMPOUND AND ORGANIC COMPOUND AND METHOD OF PRODUCING THEREOF, DELAMINATED LAMELLAR INORGANIC COMPOUND AND METHOD OF PRODUCING THEREOF, INSULATING RESIN COMPOSITION, RESIN SHEET, INSULATOR, RESIN SHEET CURED PRODUCT, AND HEAT DISSIPATING MEMBER | HITACHI CHEMICAL COMPANY, LTD. | 2020-07-09 | — | — | US | disclosed |
| EP-3015487-B1 | RESIN COMPOSITION, RESIN SHEET, CURED RESIN SHEET, RESIN SHEET STRUCTURE, CURED RESIN SHEET STRUCTURE, METHOD FOR PRODUCING CURED RESIN SHEET STRUCTURE, SEMICONDUCTOR DEVICE, AND LED DEVICE | HITACHI CHEMICAL CO LTD (JP) | 2018-04-04 | — | — | EP | disclosed |
| US-20180044191-A1 | COMPLEX OF LAMELLAR INORGANIC COMPOUND AND ORGANIC COMPOUND AND METHOD OF PRODUCING THEREOF, DELAMINATED LAMELLAR INORGANIC COMPOUND AND METHOD OF PRODUCING THEREOF, INSULATING RESIN COMPOSITION, RESIN SHEET, INSULATOR, RESIN SHEET CURED PRODUCT, AND HEAT DISSIPATING MEMBER | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2018-02-15 | — | — | US | disclosed |
| US-20180009979-A1 | RESIN COMPOSITION, RESIN SHEET, AND CURED RESIN MATERIAL AND METHOD FOR PRODUCING THE SAME | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2018-01-11 | — | — | US | disclosed |
| EP-3266745-A1 | COMPLEX BETWEEN LAMELLAR INORGANIC COMPOUND AND ORGANIC COMPOUND AND METHOD FOR PRODUCING SAME, EXFOLIATED LAMELLAR INORGANIC COMPOUND AND METHOD FOR PRODUCING SAME, INSULATING RESIN COMPOSITION, RESIN SHEET, INSULATOR, RESIN SHEET CURED ARTICLE, AND THERMAL DISSIPATION MEMBER | Hitachi Chemical Company, Ltd. (JP) | 2018-01-10 | — | — | EP | disclosed |
| US-9745411-B2 | Resin composition, resin sheet, cured resin sheet, resin sheet structure, cured resin sheet structure, method for producing cured resin sheet structure, semiconductor device, and LED device | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2017-08-29 | — | — | US | disclosed |
| US-20160177024-A1 | RESIN COMPOSITION, RESIN SHEET, CURED RESIN SHEET, RESIN SHEET STRUCTURE, CURED RESIN SHEET STRUCTURE, METHOD FOR PRODUCING CURED RESIN SHEET STRUCTURE, SEMICONDUCTOR DEVICE, AND LED DEVICE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2016-06-23 | — | — | US | disclosed |
| EP-3015487-A1 | RESIN COMPOSITION, RESIN SHEET, CURED RESIN SHEET, RESIN SHEET STRUCTURE, CURED RESIN SHEET STRUCTURE, METHOD FOR PRODUCING CURED RESIN SHEET STRUCTURE, SEMICONDUCTOR DEVICE, AND LED DEVICE | Hitachi Chemical Co., Ltd. (JP) | 2016-05-04 | — | — | EP | disclosed |
| US-20140283972-A1 | RESIN COMPOSITION, RESIN SHEET, AND CURED RESIN MATERIAL AND METHOD FOR PRODUCING THE SAME | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2014-09-25 | — | — | US | disclosed |
| US-20140248504-A1 | RESIN COMPOSITION, RESIN SHEET, CURED RESIN SHEET, RESIN-ADHERED METAL FOIL AND HEAT DISSIPATION DEVICE | HITACHI CHEMICAL COMPANY, LTD. | 2014-09-04 | — | — | US | disclosed |
| US-20140079913-A1 | MULTILAYER RESIN SHEET, RESIN SHEET LAMINATE, CURED MULTILAYER RESIN SHEET AND METHOD FOR PRODUCING SAME, MULTILAYER RESIN SHEET WITH METAL FOIL, AND SEMICONDUCTOR DEVICE | HITACHI CHEMICAL CO.,LTD (JP) | 2014-03-20 | — | — | US | disclosed |
| EP-2692526-A1 | MULTILAYER RESIN SHEET, RESIN SHEET LAMINATE, CURED MULTILAYER RESIN SHEET AND METHOD FOR PRODUCING SAME, MULTILAYER RESIN SHEET WITH METAL FOIL, AND SEMICONDUCTOR DEVICE | Hitachi Chemical Company, Ltd. (JP) | 2014-02-05 | — | — | EP | disclosed |
| EP-2626205-A1 | MULTILAYER RESIN SHEET AND PROCESS FOR PRODUCTION THEREOF, RESIN SHEET LAMINATE AND PROCESS FOR PRODUCTION THEREOF, CURED MULTILAYER RESIN SHEET, METAL-FOIL-CLADDED MULTILAYER RESIN SHEET, AND SEMICONDUCTOR DEVICE | Hitachi Chemical Co., Ltd. (JP) | 2013-08-14 | — | — | EP | disclosed |
| US-20130189514-A1 | MULTILAYER RESIN SHEET AND PROCESS FOR PRODUCTION THEREOF, RESIN SHEET LAMINATE AND PROCESS FOR PRODUCTION THEREOF, CURED MULTILAYER RESIN SHEET, METAL-FOIL-CLADDED MULTILAYER RESIN SHEET, AND SEMICONDUCTOR DEVICE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2013-07-25 | — | — | US | disclosed |
| US-20120251830-A1 | RESIN COMPOSITION, RESIN SHEET, AND CURED RESIN MATERIAL AND METHOD FOR PRODUCING THE SAME | HITACHI CHEMICAL COMPANY, LTD (JP) | 2012-10-04 | — | — | US | disclosed |
| US-20120244351-A1 | MULTILAYER RESIN SHEET AND METHOD FOR PRODUCING THE SAME, METHOD FOR PRODUCING CURED MULTILAYER RESIN SHEET, AND HIGHLY THERMALLY CONDUCTIVE RESIN SHEET LAMINATE AND METHOD FOR PRODUCING THE SAME | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-09-27 | — | — | US | disclosed |
| EP-2484724-A1 | MULTILAYER RESIN SHEET AND METHOD FOR PRODUCING SAME, METHOD FOR PRODUCING MULTILAYER RESIN SHEET CURED PRODUCT, AND HIGHLY THERMALLY CONDUCTIVE RESIN SHEET LAMINATE AND METHOD FOR PRODUCING SAME | Hitachi Chemical Company, Ltd. (JP) | 2012-08-08 | — | — | EP | disclosed |