SCHEMBL1195866

SCHEMBL1195866

O=C(C(Cc1ccccc1)Cc1ccccc1)C(Cc1ccccc1)Cc1ccccc1

nearest known ligand 0.74

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
▸ CYP1A2 P05177 1/20 0.74
▸ CPA1 P15085 7/20 0.63
▸ CPA3 P15088 3/20 0.63
▸ FOLH1 Q04609 2/20 0.63
▸ CPB1 P15086 1/20 0.63
▸ CPB2 Q96IY4 1/20 0.63
▸ SLC1A3 P43003 1/20 0.57
▸ SLC1A2 P43004 1/20 0.57
▸ SLC1A1 P43005 1/20 0.57
▸ ALPI P09923 1/20 0.56
▸ PKM P14618 1/20 0.56
▸ PTGS1 P23219 1/20 0.56
▸ XIAP P98170 1/20 0.56
▸ SLC7A5 Q01650 1/20 0.56
▸ MDM2 Q00987 1/20 0.54
▸ MME P08473 1/20 0.53
▸ NAALAD2 Q9Y3Q0 1/20 0.52

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4886609 0.87 CYP1A2 (0.69) CYP1A2CPA1CPA3FOLH1CPB1
SCHEMBL4664822 0.85 CYP1A2 (1.00) CYP1A2CPA1CPA3FOLH1CPB1
SCHEMBL5710051 0.83 CYP1A2 (0.59) CYP1A2CPA1CPA3FOLH1CPB1
SCHEMBL7439697 0.83 CYP1A2 (0.86) CYP1A2CPA1CPA3FOLH1CPB1
SCHEMBL9622038 0.83 CYP1A2 (0.86) CYP1A2CPA1CPA3FOLH1CPB1
SCHEMBL7432418 0.83 CYP1A2 (0.86) CYP1A2CPA1CPA3FOLH1CPB1
SCHEMBL27291058 0.83 CYP1A2 (0.95) CYP1A2CPA1CPA3FOLH1CPB1
SCHEMBL9875948 0.83 CYP1A2 (0.95) CYP1A2CPA1CPA3FOLH1CPB1
SCHEMBL22115491 0.83 CYP1A2 (0.95) CYP1A2CPA1CPA3FOLH1CPB1
SCHEMBL6724759 0.81 CYP1A2 (0.83) CYP1A2CPA1CPA3FOLH1CPB1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119613746-A Directably modified hexabenzo-metal organic framework, and preparation method and application thereof 南开大学 2025-03-14 — — CN claimed
CN-113817140-B Dendritic polymer and preparation method thereof 中电科芯片技术(集团)有限公司 2024-07-02 — — CN claimed
CN-115160102-B Preparation method of gem dihalide 上海珂华生物科技有限公司 2024-02-06 — — CN claimed
CN-119912687-A Resin composition, additive thereof, cured film and electronic device 华为技术有限公司 2025-05-02 — — CN disclosed
CN-119912689-A Resin, resin composition and cured film 华为技术有限公司 2025-05-02 — — CN disclosed
CN-119613746-A Directably modified hexabenzo-metal organic framework, and preparation method and application thereof 南开大学 2025-03-14 — — CN disclosed
CN-113817140-B Dendritic polymer and preparation method thereof 中电科芯片技术(集团)有限公司 2024-07-02 — — CN disclosed
CN-115160102-B Preparation method of gem dihalide 上海珂华生物科技有限公司 2024-02-06 — — CN disclosed
CN-117008415-A Photosensitive resin film, method for producing the same, and photosensitive resin plate 中国印钞造币集团有限公司 2023-11-07 — — CN disclosed
CN-116947591-A Organic compound, organic light-emitting element, display device, imaging device, electronic device, illumination device, and moving object 佳能株式会社 2023-10-27 — — CN disclosed
CN-105246940-B Optical semiconductor sealing solidification compound 株式会社大赛璐 2018-09-04 — — CN disclosed
CN-107382642-A The preparation method of the arylprop ketene compound of α, β diphenyl 1 温州大学 2017-11-24 — — CN disclosed
US-9685597-B2 Curable composition for sealing optical semiconductor DAICEL CORPORATION (JP) 2017-06-20 — — US disclosed
US-20160126431-A1 CURABLE COMPOSITION FOR SEALING OPTICAL SEMICONDUCTOR DAICEL CORPORATION (JP) 2016-05-05 — — US disclosed
EP-3006481-A1 CURABLE COMPOSITION FOR SEALING OPTICAL SEMICONDUCTOR Daicel Corporation (JP) 2016-04-13 — — EP disclosed
CN-105246940-A Curable composition for sealing optical semiconductor DAICEL CORP 2016-01-13 — — CN disclosed
US-7888397-B1 Poly(phenylene)-based anion exchange membrane SANDIA CORPORATION (US) 2011-02-15 — — US disclosed
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