SCHEMBL1197865

SCHEMBL1197865

O=C(O)CCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCC(=O)O

nearest known ligand 1.00 ✓ in ChEMBL — recovers established targets

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ TSHR P16473 5/20 1.00
▸ LMNA P02545 3/20 1.00
▸ NFKB1 P19838 1/20 1.00
▸ PMP22 Q01453 1/20 1.00
▸ SLC22A6 Q4U2R8 2/20 0.77
▸ GPR84 Q9NQS5 8/20 0.75
▸ FFAR1 O14842 2/20 0.75
▸ FFAR4 Q5NUL3 2/20 0.75
▸ PPARG P37231 7/20 0.71
▸ PPARD Q03181 7/20 0.71
▸ PPARA Q07869 7/20 0.71
▸ HDAC11 Q96DB2 5/20 0.71
▸ ALDH1A1 P00352 3/20 0.71
▸ PTPN1 P18031 3/20 0.71
▸ TLR2 O60603 2/20 0.71
▸ TDP1 Q9NUW8 2/20 0.71
▸ MEN1 O00255 2/20 0.71
▸ FABP4 P15090 2/20 0.71
▸ ALOX15 P16050 2/20 0.71
▸ KMT2A Q03164 2/20 0.71

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Azelaic Acid SCHEMBL7203725 1.00 TSHR (1.00) TSHRLMNANFKB1PMP22SLC22A6
SCHEMBL3814949 1.00 TSHR (1.00) TSHRLMNANFKB1PMP22SLC22A6
Azelaic Acid SCHEMBL6462921 1.00 TSHR (1.00) TSHRLMNANFKB1PMP22SLC22A6
SCHEMBL3493631 1.00 TSHR (1.00) TSHRLMNANFKB1PMP22SLC22A6
SCHEMBL1235383 1.00 TSHR (1.00) TSHRLMNANFKB1PMP22SLC22A6
SCHEMBL25186232 1.00 TSHR (1.00) TSHRLMNANFKB1PMP22SLC22A6
Octanedioate SCHEMBL5799504 1.00 TSHR (1.00) TSHRLMNANFKB1PMP22SLC22A6
SCHEMBL21065467 1.00 TSHR (1.00) TSHRLMNANFKB1PMP22SLC22A6
Sebacic Acid SCHEMBL20500595 1.00 TSHR (1.00) TSHRLMNANFKB1PMP22SLC22A6
Pimelic Acid SCHEMBL2304128 1.00 TSHR (1.00) TSHRLMNANFKB1PMP22SLC22A6

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 40 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4169975-B1 PROCESS FOR PRODUCING RESIN EXPANDED BEADS JSP CORP (JP) 2023-12-20 — — EP disclosed
US-20230290550-A1 MAGNETIC RESIN COMPOSITION FOR INJECTION MOLDING, AND INJECTION MOLDED BODY FOR MAGNETIC SHIELDS TOYO INK SC HOLDINGS CO., LTD. (JP) 2023-09-14 — — US disclosed
WO-2023162647-A1 EXPANDABLE RESIN PARTICLES, PRODUCTION METHOD THEREFOR, EXPANDED PARTICLES, AND MOLDED FOAM 株式会社カネカ 2023-08-31 — — WO disclosed
WO-2023120301-A1 MAGNETIC RESIN COMPOSITION FOR INJECTION MOLDING, AND INJECTION-MOLDED ARTICLE FOR MAGNETIC SHIELD 東洋インキSCホールディングス株式会社 2023-06-29 — — WO disclosed
EP-4180485-A1 MAGNETIC RESIN COMPOSITION FOR INJECTION MOLDING, AND INJECTION MOLDED BODY FOR MAGNETIC SHIELDS Toyo Ink SC Holdings Co., Ltd. (JP) 2023-05-17 — — EP disclosed
EP-4169975-A1 PROCESS FOR PRODUCING RESIN EXPANDED BEADS JSP Corporation (JP) 2023-04-26 — — EP disclosed
CN-115873363-A Molded body and impact absorbing material 株式会社JSP 2023-03-31 — — CN disclosed
WO-2022220294-A1 PEST CONTROL COMPOSITION AND CONTROL METHOD 住友化学株式会社 2022-10-20 — — WO disclosed
WO-2022195937-A1 ADHESIVE FOR PROVISIONALLY FIXING ELECTRONIC COMPONENT TO SOLDER PRECOAT AND METHOD FOR PRODUCING ELECTRONIC COMPONENT MOUNTED SUBSTRATE パナソニックIPマネジメント株式会社 2022-09-22 — — WO disclosed
WO-2022185844-A1 METHOD FOR PRODUCING MODIFIED POLYSTYRENE RESIN PARTICLES, METHOD FOR PRODUCING EXPANDABLE MODIFIED POLYSTYRENE RESIN PARTICLES, AND USE THEREOF 株式会社カネカ 2022-09-09 — — WO disclosed
US-20050222331-A1 Block copolymer and composition thereof ASAHI KASEI CHEMICALS CORPORATION (JP) 2005-10-06 — — US disclosed
CN-1649923-A Block copolymer and composition thereof ASAHI CHEMICAL IND (JP) 2005-08-03 — — CN disclosed
EP-1498438-A1 BLOCK COPOLYMER AND COMPOSITION THEREOF Asahi Kasei Chemicals Corporation (JP) 2005-01-19 — — EP disclosed
US-20020150775-A1 DEGRADABLE LAMINATED BODY AND A METHOD FOR THE PREPARATION THEREOF UNYCK CO., LTD. (JP) 2002-10-17 — — US disclosed
US-20020136848-A1 LACTONE-CONTAINING RESIN COMPOSITION, MOLDED OBJECT THEREOF, AND FILM JAPAN ATOMIC ENERGY RESEARCH INSTITUTE (JP) 2002-09-26 — — US disclosed
US-20020094444-A1 BIODEGRADABLE POLYESTER RESIN COMPOSITION, BIODISINTEGRABLE RESIN COMPOSITION, AND MOLDED OBJECTS OF THESE DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2002-07-18 — — US disclosed
EP-1008629-A1 BIODEGRADABLE POLYESTER RESIN COMPOSITION, BIODISINTEGRABLE RESIN COMPOSITION, AND MOLDED OBJECTS OF THESE DAICEL CHEMICAL INDUSTRIES, Ltd. (JP) 2000-06-14 — — EP disclosed
EP-0987100-A2 A degradable laminated body and a method for the preparation thereof Daicel Chemical Industries, Ltd. (JP) 2000-03-22 — — EP disclosed
EP-0984039-A1 LACTONE-CONTAINING RESIN COMPOSITION, MOLDED OBJECT THEREOF, AND FILM DAICEL CHEMICAL INDUSTRIES, Ltd. (JP) 2000-03-08 — — EP disclosed
EP-0934918-A1 DEGRADABLE COAT BEARING GRANULAR COMPOSITIONS FOR AGRICULTURAL AND HORTICULTURAL USE, BIODEGRADABLE RESIN COMPOSITION, MOLDINGS AND FILMS OF THE SAME, PROCESS FOR THE PRODUCTION OF FILMS, AND DEGRADABLE TRASH BAGS DAICEL CHEMICAL INDUSTRIES, Ltd. (JP) 1999-08-11 — — EP disclosed
Send feedback