SCHEMBL1199974

SCHEMBL1199974

CC(CCC=O)C(CO)(CO)CO

nearest known ligand 0.32

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
DPP4 P27487 1/20 0.32
ALDH1A1 P00352 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1888569 0.76
SCHEMBL1887613 0.76 TSHR (0.47) ALDH1A1
Fluoride SCHEMBL29105260 0.74
SCHEMBL252158 0.73 ALDH1A1 (0.35) ALDH1A1
SCHEMBL28573456 0.72 DPP4 (0.52) DPP4ALDH1A1
SCHEMBL5412610 0.70 TSHR (0.43) DPP4ALDH1A1
SCHEMBL9862232 0.69 DPP4 (0.36) DPP4ALDH1A1
SCHEMBL27896224 0.69 DPP4 (0.42) DPP4ALDH1A1
SCHEMBL6887964 0.69
SCHEMBL17316227 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 710 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3474952-B1 COMPOSITIONS CONTAINING LATEX PARTICLES AND UV ABSORBERS ROHM & HAAS (US) 2021-07-28 EP claimed
US-20190133913-A1 COMPOSITIONS CONTAINING LATEX PARTICLES AND UV ABSORBERS ROHM & HAAS (US) 2019-05-09 US claimed
EP-3474952-A1 COMPOSITIONS CONTAINING LATEX PARTICLES AND UV ABSORBERS Rohm and Haas Company (US) 2019-05-01 EP claimed
WO-2017222570-A1 COMPOSITIONS CONTAINING LATEX PARTICLES AND UV ABSORBERS ROHM AND HAAS COMPANY (US) 2017-12-28 WO claimed
US-6855480-B2 Photoresist composition SHIPLEY COMPANY, L.L.C. (US) 2005-02-15 US claimed
US-20030091926-A1 Glass transition temperature above room temperature; tack free SHIPLEY COMPANY, L.L.C. 2003-05-15 US claimed
US-20030059709-A1 Photoresist composition SHIPLEY COMPANY, L.L.C. 2003-03-27 US claimed
EP-1251399-A2 Photoresist composition Shipley Company LLC (US) 2002-10-23 EP claimed
EP-1098223-A1 Dry film photopolymerizable compositions Shipley Company LLC (US) 2001-05-09 EP claimed
US-20230265311-A1 Cure-on-Demand Coatings BOARD OF SUPERVISORS OF LOUISIANA STATE UNIVERSITY AND AGRICULTURAL AND MECHANICAL COLLEGE (US) 2023-08-24 US disclosed
CN-111596526-B Photosensitive resin composition and photosensitive resin laminate 旭化成株式会社 2023-07-25 CN disclosed
CN-109983595-B Composition for organic electronic device encapsulant and encapsulant formed using the same 莫门蒂夫性能材料韩国株式会社 2023-04-04 CN disclosed
EP-3522241-B1 COMPOSITION FOR ORGANIC ELECTRONIC ELEMENT ENCAPSULANT, AND ENCAPSULANT FORMED USING SAME MOMENTIVE PERFORMANCE MAT KOREA CO LTD (KR) 2023-03-22 EP disclosed
CN-115524922-A Photosensitive resin composition 旭化成株式会社 2022-12-27 CN disclosed
US-4195997-A COLD FLOW RESISTANCE E. I. DU PONT DE NEMOURS AND COMPANY (US) 1980-04-01 US disclosed
US-4177074-A HIGH AND LOW MOLECULAR WEIGHT POLYMERS CONTAINING CARBOXYL GROUPS E. I. DU PONT DE NEMOURS AND COMPANY (US) 1979-12-04 US disclosed
US-4127436-A PHOTORESIST E. I. DU PONT DE NEMOURS AND COMPANY (US) 1978-11-28 US disclosed
US-4054483-A Additives process for producing plated holes in printed circuit elements E. I. DU PONT DE NEMOURS AND COMPANY (US) 1977-10-18 US disclosed
US-4054479-A Additive process for producing printed circuit elements using a self-supported photosensitive sheet E. I. DU PONT DE NEMOURS AND COMPANY (US) 1977-10-18 US disclosed
US-3984244-A Process for laminating a channeled photosensitive layer on an irregular surface E. I. DU PONT DE NEMOURS AND COMPANY (US) 1976-10-05 US disclosed