⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL57959 | 0.61 | — | — | |
| Fluoride SCHEMBL8364541 | 0.55 | — | — | |
| SCHEMBL2796978 | 0.55 | — | — | |
| Bromide SCHEMBL7593228 | 0.55 | — | — | |
| SCHEMBL5984039 | 0.50 | — | — | |
| SCHEMBL9464188 | 0.50 | — | — | |
| SCHEMBL3897134 | 0.50 | — | — | |
| SCHEMBL3250023 | 0.50 | — | — | |
| SCHEMBL2739835 | 0.50 | — | — | |
| SCHEMBL9168705 | 0.50 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20170210899-A1 | SILICONE-BASED ENCAPSULATING MATERIAL COMPOSITION AND SEMICONDUCTOR LIGHT-EMITTING DEVICE | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2017-07-27 | — | — | US | disclosed |
| US-9536635-B2 | Insulated wire construction for fire safety cable | WIRE HOLDINGS LLC (US) | 2017-01-03 | — | — | US | disclosed |
| US-20150060106-A1 | INSULATED WIRE CONSTRUCTION FOR FIRE SAFETY CABLE | WIRE HOLDINGS LLC, dba RADIX WIRE (US) | 2015-03-05 | — | — | US | disclosed |
| US-8062547-B2 | CMP slurry, preparation method thereof and method of polishing substrate using the same | K.C. TECH CO., LTD. (KR) | 2011-11-22 | — | — | US | disclosed |
| US-20100301257-A1 | MONODISPERSE SUBMICRON POLYMER PARTICLES | INVITROGEN DYNAL AS (US) | 2010-12-02 | — | — | US | disclosed |
| US-20070075291-A1 | CMP Slurry, Preparation Method Thereof and Method of Polishing Substrate Using the Same | KCTECH CO., LTD. (KR) | 2007-04-05 | — | — | US | disclosed |