SCHEMBL1223974

SCHEMBL1223974

CCO[Si](Cl)(CCCCCl)OCC

nearest known ligand 0.36

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.36
ALDH1A1 P00352 1/20 0.36
TDP1 Q9NUW8 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1224130 0.93 TSHR (0.35) TSHRALDH1A1TDP1
SCHEMBL6048774 0.83 TSHR (0.33) TSHRALDH1A1
SCHEMBL2452686 0.82
SCHEMBL6048696 0.81 TSHR (0.38) TSHRALDH1A1
SCHEMBL6048703 0.81 TSHR (0.38) TSHRALDH1A1
SCHEMBL30001823 0.81 TSHR (0.38) TSHRALDH1A1
SCHEMBL26000123 0.81 TSHR (0.38) TSHRALDH1A1
SCHEMBL6048682 0.81 TSHR (0.38) TSHRALDH1A1
SCHEMBL6048822 0.80 TSHR (0.30) TSHRTDP1
SCHEMBL6064448 0.79

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-106574116-B Curable composition, cured product, method for using curable composition, and optical device 琳得科株式会社 2020-07-14 CN disclosed
EP-2963088-B1 CURABLE COMPOSITION, CURED PRODUCT, METHOD FOR USING CURABLE COMPOSITION, PHOTOELEMENT SEALING BODY AND METHOD FOR PRODUCING PHOTOELEMENT SEALING BODY LINTEC CORP (JP) 2020-06-10 EP disclosed
US-10266734-B2 Curable composition, cured product, method for using curable composition, and optical device LINTEC CORPORATION (JP) 2019-04-23 US disclosed
EP-3187547-B1 CURABLE COMPOSITION, CURED PRODUCT, METHOD FOR USING CURABLE COMPOSITION, AND OPTICAL DEVICE LINTEC CORP (JP) 2018-12-05 EP disclosed
US-9783715-B2 Curable composition, cured product, method for using curable composition, photoelement sealing body and method for producing photoelement sealing body LINTEC CORPORATION (JP) 2017-10-10 US disclosed
US-20170275513-A1 CURABLE COMPOSITION, CURED PRODUCT, METHOD FOR USING CURABLE COMPOSITION, AND OPTICAL DEVICE LINTEC CORPORATION (JP) 2017-09-28 US disclosed
EP-3187547-A1 CURABLE COMPOSITION, CURED PRODUCT, METHOD FOR USING CURABLE COMPOSITION, AND OPTICAL DEVICE Lintec Corporation (JP) 2017-07-05 EP disclosed
CN-104212409-B The main binding agent being made up of polyorganosiloxane compounds 琳得科株式会社 2016-08-24 CN disclosed
US-20160009970-A1 CURABLE COMPOSITION, CURED PRODUCT, METHOD FOR USING CURABLE COMPOSITION, PHOTOELEMENT SEALING BODY AND METHOD FOR PRODUCING PHOTOELEMENT SEALING BODY LINTEC CORPORATION (JP) 2016-01-14 US disclosed
EP-2963088-A1 CURABLE COMPOSITION, CURED PRODUCT, METHOD FOR USING CURABLE COMPOSITION, PHOTOELEMENT SEALING BODY AND METHOD FOR PRODUCING PHOTOELEMENT SEALING BODY Lintec Corporation (JP) 2016-01-06 EP disclosed
CN-104232016-A Adhesive mainly composed of polyorganosiloxane compound LINTEC CORP 2014-12-24 CN disclosed
CN-104212409-A Adhesive mainly composed of polyorganosiloxane compound LINTEC CORP 2014-12-17 CN disclosed
US-8703880-B2 Curable composition, cured product, and method for using of curable composition LINTEC CORPORATION (JP) 2014-04-22 US disclosed
US-8507044-B2 Molding material composed of polyorganosiloxane compound, sealing material, and sealed optical device LINTEC CORPORATION (JP) 2013-08-13 US disclosed
US-20130035455-A1 CURABLE COMPOSITION, CURED PRODUCT, AND METHOD FOR USING OF CURABLE COMPOSITION LINTEC CORPORATION (JP) 2013-02-07 US disclosed
US-8357261-B2 Adhesive mainly composed of polyorganosiloxane compound LINTEC CORPORATION (JP) 2013-01-22 US disclosed
EP-2546306-A1 CURABLE COMPOSITION, HARDENED MATERIAL, AND METHOD FOR USING CURABLE COMPOSITION LINTEC Corporation (JP) 2013-01-16 EP disclosed
US-20110054139-A1 ADHESIVE MAINLY COMPOSED OF POLYORGANOSILOXANE COMPOUND LINTEC CORPORATION (JP) 2011-03-03 US disclosed
US-20110034659-A1 MOLDING MATERIAL COMPOSED OF POLYORGANOSILOXANE COMPOUND, SEALING MATERIAL, AND SEALED OPTICAL DEVICE LINTEC CORPORATION (JP) 2011-02-10 US disclosed
CN-101965387-A Adhesive agent mainly composed of polyorganosiloxane compound LINTEC CORP 2011-02-02 CN disclosed