SCHEMBL1225152

SCHEMBL1225152

COc1ccc([Si](Cl)(Cl)Cl)cc1

nearest known ligand 0.58

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA1 P00915 2/20 0.58
CA2 P00918 2/20 0.58
CA7 P43166 2/20 0.58
CA9 Q16790 2/20 0.58
CA12 O43570 1/20 0.58
CA14 Q9ULX7 1/20 0.58
ACHE P22303 1/20 0.48
ALDH1A1 P00352 4/20 0.46
MEN1 O00255 1/20 0.46
KMT2A Q03164 1/20 0.46
TDP1 Q9NUW8 4/20 0.46
MAPK1 P28482 4/20 0.46
KDM4E B2RXH2 2/20 0.44
MAPT P10636 2/20 0.44
NPSR1 Q6W5P4 2/20 0.44
L3MBTL1 Q9Y468 2/20 0.44
NPC1 O15118 1/20 0.44
GAA P10253 1/20 0.44
THRB P10828 1/20 0.44
RECQL P46063 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12816764 0.84 CA1 (0.58) CA1CA2CA7CA9CA12
SCHEMBL1200237 0.82 CA1 (0.55) CA1CA2CA7CA9CA12
SCHEMBL5305926 0.82 CA1 (0.55) CA1CA2CA7CA9CA12
SCHEMBL22472159 0.80 CA1 (0.52) CA1CA2CA7CA9CA12
SCHEMBL10476909 0.78 CA1 (0.50) CA1CA2CA7CA9CA12
SCHEMBL2544548 0.78 CA1 (0.65) CA1CA2CA7CA9CA12
SCHEMBL10319011 0.77 CA4 (0.54) CA1CA2CA7CA9CA12
SCHEMBL4733542 0.77 CA1 (0.48) CA1CA2CA7CA9CA12
SCHEMBL12817616 0.77 CA4 (0.54) CA1CA2CA7CA9CA12
SCHEMBL4933210 0.77 CA1 (0.48) CA1CA2CA7CA9CA12

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 54 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114402036-B Curable composition, cured product, and method for using curable composition 琳得科株式会社 2023-11-21 CN disclosed
CN-113574117-B Curable composition, cured product, and method for using curable composition 琳得科株式会社 2023-09-12 CN disclosed
CN-113574116-B Curable composition, cured product, and method for using curable composition 琳得科株式会社 2023-02-28 CN disclosed
CN-115151611-A Curable composition, cured product, and method for using curable composition 琳得科株式会社 2022-10-04 CN disclosed
CN-115124973-A Adhesive paste, method for using adhesive paste, and method for manufacturing semiconductor device 琳得科株式会社 2022-09-30 CN disclosed
WO-2022202846-A1 ADHESIVE PASTE, METHOD FOR USING ADHESIVE PASTE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE リンテック株式会社 2022-09-29 WO disclosed
WO-2022202845-A1 ADHESIVE PASTE, USAGE METHOD FOR ADHESIVE PASTE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE リンテック株式会社 2022-09-29 WO disclosed
WO-2022202119-A1 CURABLE COMPOSITION AND CURED OBJECT リンテック株式会社 2022-09-29 WO disclosed
WO-2022202844-A1 ADHESIVE PASTE, METHOD FOR USING ADHESIVE PASTE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE リンテック株式会社 2022-09-29 WO disclosed
CN-114402037-A Curable composition, cured product, and method for using curable composition 琳得科株式会社 2022-04-26 CN disclosed
EP-2546306-A1 CURABLE COMPOSITION, HARDENED MATERIAL, AND METHOD FOR USING CURABLE COMPOSITION LINTEC Corporation (JP) 2013-01-16 EP disclosed
CN-102124064-A Composition for forming silicon-containing resist underlayer film with onium group NISSAN CHEMICAL IND LTD 2011-07-13 CN disclosed
US-20110124812-A1 FIXING MATERIAL COMPRISING SILANE COMPOUND POLYMER AND PHOTONIC DEVICE SEALED BODY LINTEC CORPORATION (JP) 2011-05-26 US disclosed
US-20110054139-A1 ADHESIVE MAINLY COMPOSED OF POLYORGANOSILOXANE COMPOUND LINTEC CORPORATION (JP) 2011-03-03 US disclosed
US-20110034659-A1 MOLDING MATERIAL COMPOSED OF POLYORGANOSILOXANE COMPOUND, SEALING MATERIAL, AND SEALED OPTICAL DEVICE LINTEC CORPORATION (JP) 2011-02-10 US disclosed
US-20100007031-A1 AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2010-01-14 US disclosed
EP-2128897-A1 SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE Fujitsu Limited (JP) 2009-12-02 EP disclosed
EP-1999167-A2 ZIEGLER-NATTA CATALYST WITH IN SITU-GENERATED DONOR Novolen Technology Holdings, C.V. (NL) 2008-12-10 EP disclosed
WO-2007106348-A2 ZIEGLER-NATTA CATALYST WITH IN SITU-GENERATED DONOR NOVOLEN TECHNOLOGY HOLDINGS C.V. (NL) 2007-09-20 WO disclosed
US-20070213204-A1 Ziegler-Natta catalyst with in situ-generated donor NOVOLEN TECHNOLOGY HOLDINGS C.V. 2007-09-13 US disclosed