SCHEMBL1230320

SCHEMBL1230320

CCCC[O-].CCCC[O-].CC[O-].[Al+3]

nearest known ligand 0.43

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
TSHR P16473 4/20 0.43
LMNA P02545 1/20 0.43
THRB P10828 1/20 0.40
CES1 P23141 6/20 0.35
CES2 O00748 5/20 0.35
ALDH1A1 P00352 3/20 0.33
TDP1 Q9NUW8 1/20 0.33
SLC22A1 O15245 2/20 0.32
SLC22A2 O15244 1/20 0.32
SMN1; SMN2 Q16637 1/20 0.32
LSS P48449 1/20 0.30
CA1 P00915 1/20 0.30
DNM1 Q05193 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1229985 1.00 TSHR (0.43) TSHRLMNATHRBCES1CES2
SCHEMBL4425224 0.96 TSHR (0.40) TSHRLMNATHRBCES1CES2
SCHEMBL28510902 0.96 TSHR (0.46) TSHRLMNATHRBCES1CES2
SCHEMBL28907 0.96 TSHR (0.46) TSHRLMNATHRBCES1CES2
SCHEMBL1228550 0.92 TSHR (0.43) TSHRLMNATHRBCES1CES2
SCHEMBL1229359 0.92 TSHR (0.43) TSHRLMNATHRBCES1CES2
SCHEMBL1228584 0.92 TSHR (0.43) TSHRLMNATHRBCES1CES2
Potassium Ion SCHEMBL17085518 0.92 TSHR (0.43) TSHRLMNATHRBCES1CES2
SCHEMBL1230281 0.92 TSHR (0.43) TSHRLMNATHRBCES1CES2
SCHEMBL162467 0.92

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240392175-A1 THERMALLY CONDUCTIVE SILICONE COMPOSITION AND METHOD FOR PRODUCING GAP FILLER USING SAID COMPOSITION WACKER CHEMIE AG (DE) 2024-11-28 US disclosed
EP-4410899-A1 THERMALLY CONDUCTIVE SILICONE COMPOSITION AND METHOD FOR PRODUCING GAP FILLER USING SAID COMPOSITION Wacker Chemie AG (DE) 2024-08-07 EP disclosed
WO-2023053760-A1 THERMALLY CONDUCTIVE SILICONE COMPOSITION AND METHOD FOR PRODUCING GAP FILLER USING SAID COMPOSITION 旭化成ワッカーシリコーン株式会社 2023-04-06 WO disclosed
CN-111303720-B Zinc-containing coating composition for automobile ball joint assembly and application thereof 绍兴顺泰机械科技有限公司 2021-09-10 CN disclosed
CN-111303721-B Aluminum-containing coating and preparation method thereof 绍兴顺泰机械科技有限公司 2021-09-10 CN disclosed
CN-111205692-B Magnesium-containing coating and preparation method thereof 绍兴顺泰机械科技有限公司 2021-09-10 CN disclosed
CN-111205691-B Aluminum-containing coating composition for automobile ball joint assembly and application thereof 绍兴顺泰机械科技有限公司 2021-09-10 CN disclosed
CN-111205724-B Magnesium-containing coating composition for automobile ball joint assembly and application thereof 绍兴顺泰机械科技有限公司 2021-09-10 CN disclosed
CN-111299096-A Zinc-containing coating and preparation method thereof 绍兴顺泰机械科技有限公司 2020-06-19 CN disclosed
CN-111303720-A Zinc-containing coating composition for automobile ball joint assembly and application thereof 绍兴顺泰机械科技有限公司 2020-06-19 CN disclosed
WO-2011072056-A2 CURE RATE CONTROL FOR ALKOXYSILYL-END-BLOCKED POLYMERS DOW CORNING COPORATION (US) 2011-06-16 WO disclosed
US-7910681-B2 Curable composition having improved adhesion KANEKA CORPORATION (JP) 2011-03-22 US disclosed
US-7893170-B2 Curable composition having improved curability and adhesion KANEKA CORPORATION (JP) 2011-02-22 US disclosed
US-20080319152-A1 Curable Composition KANEKA CORPORATION (JP) 2008-12-25 US disclosed
US-20080194773-A1 Polysiloxane from silanetriol group, a titanium, aluminum or a zirconium catalyst, and a low molecular weight compound containing a hydrolyzable silicon group; sealants, adhesives KANEKA CORPORATION (JP) 2008-08-14 US disclosed
US-20080076878-A1 Organic polymer having a silane tiol group, a titanium, aluminum or a zirconium catalyst, and a low molecular weight compound containing a hydrolyzable silicon group; sealants, adhesives KANEKA CORPORATION (JP) 2008-03-27 US disclosed
EP-1746135-A1 CURABLE COMPOSITION Kaneka Corporation (JP) 2007-01-24 EP disclosed
EP-1746134-A1 CURABLE COMPOSITION WITH IMPROVED CURABILITY AND ADHESIVENESS Kaneka Corporation (JP) 2007-01-24 EP disclosed
EP-1746133-A1 CURABLE COMPOSITION IMPROVED IN ADHESIVENESS Kaneka Corporation (JP) 2007-01-24 EP disclosed
US-4628127-A Heterogeneous catalytic alkylation ETHYL CORPORATION (US) 1986-12-09 US disclosed