SCHEMBL1230385

SCHEMBL1230385

COC(C)[O-].COC(C)[O-].COC(C)[O-].[Al+3]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5973894 0.91
SCHEMBL7718956 0.91
SCHEMBL2788788 0.91
Potassium Ion SCHEMBL7978867 0.91
SCHEMBL5973848 0.91
SCHEMBL5975205 0.91
SCHEMBL17261593 0.91
SCHEMBL19532 0.91
SCHEMBL5973746 0.91
SCHEMBL2788653 0.91

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240392175-A1 THERMALLY CONDUCTIVE SILICONE COMPOSITION AND METHOD FOR PRODUCING GAP FILLER USING SAID COMPOSITION WACKER CHEMIE AG (DE) 2024-11-28 US disclosed
EP-4410899-A1 THERMALLY CONDUCTIVE SILICONE COMPOSITION AND METHOD FOR PRODUCING GAP FILLER USING SAID COMPOSITION Wacker Chemie AG (DE) 2024-08-07 EP disclosed
EP-1746135-B1 CURABLE COMPOSITION KANEKA CORP (JP) 2019-05-29 EP disclosed
US-20150299550-A1 THERMALLY CONDUCTIVE RESIN COMPOSITION PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2015-10-22 US disclosed
US-20140231700-A1 THERMOCONDUCTIVE RESIN COMPOSITION PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2014-08-21 US disclosed
US-8759584-B2 Synthesis of biguanidines and triazines, and biguanidino-aluminium complexes as intermediates BAYER CROPSCIENCE AG (DE) 2014-06-24 US disclosed
EP-2231679-B1 SYNTHESIS OF BIGUANIDINES AND TRIAZINES, AND BIGUANIDINO-ALUMINIUM COMPLEXES AS INTERMEDIATES BAYER CROPSCIENCE AG (DE) 2011-11-16 EP disclosed
US-7973108-B2 Curable composition KANEKA CORPORATION (JP) 2011-07-05 US disclosed
WO-2011072056-A2 CURE RATE CONTROL FOR ALKOXYSILYL-END-BLOCKED POLYMERS DOW CORNING COPORATION (US) 2011-06-16 WO disclosed
US-7910681-B2 Curable composition having improved adhesion KANEKA CORPORATION (JP) 2011-03-22 US disclosed
US-20100305317-A1 SYNTHESIS OF BIGUANIDINES AND TRIAZINES, AND BIGUANIDINO-ALUMINIUM COMPLEXES AS INTERMEDIATES BAYER CROPSCIENCE AG (DE) 2010-12-02 US disclosed
EP-2231679-A1 SYNTHESIS OF BIGUANIDINES AND TRIAZINES, AND BIGUANIDINO-ALUMINIUM COMPLEXES AS INTERMEDIATES Bayer CropScience AG (DE) 2010-09-29 EP disclosed
WO-2009077059-A1 SYNTHESIS OF BIGUANIDINES AND TRIAZINES, AND BIGUANIDINO-ALUMINIUM COMPLEXES AS INTERMEDIATES BAYER CROPSCIENCE AG (DE) 2009-06-25 WO disclosed
EP-2070934-A1 Synthesis of biguanidines and triazines, and biguanidino-aluminium complexes as intermediates Bayer CropScience AG (DE) 2009-06-17 EP disclosed
US-20080319152-A1 Curable Composition KANEKA CORPORATION (JP) 2008-12-25 US disclosed
US-20080194773-A1 Polysiloxane from silanetriol group, a titanium, aluminum or a zirconium catalyst, and a low molecular weight compound containing a hydrolyzable silicon group; sealants, adhesives KANEKA CORPORATION (JP) 2008-08-14 US disclosed
US-20080076878-A1 Organic polymer having a silane tiol group, a titanium, aluminum or a zirconium catalyst, and a low molecular weight compound containing a hydrolyzable silicon group; sealants, adhesives KANEKA CORPORATION (JP) 2008-03-27 US disclosed
EP-1746135-A1 CURABLE COMPOSITION Kaneka Corporation (JP) 2007-01-24 EP disclosed
EP-1746133-A1 CURABLE COMPOSITION IMPROVED IN ADHESIVENESS Kaneka Corporation (JP) 2007-01-24 EP disclosed
US-6177030-B1 OVERCOATING PHOSPHOR WITH METAL OXIDE AND COUPLING AGENT KONICA CORPORATION (JP) 2001-01-23 US disclosed