⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Hydrogen Peroxide SCHEMBL8917323 | 0.97 | CA2 (0.53) | — | |
| SCHEMBL1401190 | 0.82 | CA2 (0.69) | — | |
| SCHEMBL931357 | 0.82 | CA2 (0.69) | — | |
| Ammonia Solution, Strong SCHEMBL9413597 | 0.79 | CA2 (0.64) | — | |
| SCHEMBL381483 | 0.79 | CA2 (0.64) | — | |
| Sulfuric Acid SCHEMBL29180545 | 0.79 | CA2 (0.64) | — | |
| SCHEMBL12544457 | 0.79 | CA2 (0.64) | — | |
| Ammonia Solution, Strong SCHEMBL6677032 | 0.79 | CA2 (0.64) | — | |
| SCHEMBL15966879 | 0.79 | CA2 (0.64) | — | |
| SCHEMBL632874 | 0.79 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-10854614-B2 | Semiconductor device and method of manufacturing the same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2020-12-01 | — | — | US | claimed |
| CN-110010604-A | Semiconductor devices and its manufacturing method | 三星电子株式会社 | 2019-07-12 | — | — | CN | claimed |
| US-20190198506-A1 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2019-06-27 | — | — | US | claimed |
| US-10854614-B2 | Semiconductor device and method of manufacturing the same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2020-12-01 | — | — | US | disclosed |
| US-20190198506-A1 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2019-06-27 | — | — | US | disclosed |
| US-9725326-B2 | Hydrophilic silica as filler for silicone rubber formulations | EVONIK DEGUSSA GMBH (DE) | 2017-08-08 | — | — | US | disclosed |
| US-9540247-B2 | Higly dispersible silica for using in rubber | EVONIK DEGUSSA GMBH (DE) | 2017-01-10 | — | — | US | disclosed |
| US-8986442-B2 | Specially precipitated silicic acids for rubber applications | EVONIK DEGUSSA GMBH (DE) | 2015-03-24 | — | — | US | disclosed |
| US-8658816-B2 | Precipitated silicas as a reinforcing filler for elastomer mixtures | EVONIK DEGUSSA GMBH (DE) | 2014-02-25 | — | — | US | disclosed |
| US-20130251616-A1 | HIGLY DISPERSIBLE SILICA FOR USING IN RUBBER | EVONIK OPERATIONS GMBH (DE) | 2013-09-26 | — | — | US | disclosed |
| US-8007751-B2 | Precipitated silicas with a high pH and their use in applications as defoamers having optimum silanol group density and a process for preparing precipitated silicas and to their use, particularly in defoamer formulations | EVONIK DEGUSSA GMBH (DE) | 2011-08-30 | — | — | US | disclosed |
| US-20110021801-A1 | PRECIPITATED SILICAS AS A REINFORCING FILLER FOR ELASTOMER MIXTURES | EVONIK DEGUSSA GMBH (DE) | 2011-01-27 | — | — | US | disclosed |
| US-20070299203-A1 | HYDROPHILIC SILICA FOR SEALANTS | DEGUSSA GMBH (DE) | 2007-12-27 | — | — | US | disclosed |