⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL14981946 | 0.98 | — | — | |
| SCHEMBL17167322 | 0.89 | — | — | |
| SCHEMBL15033459 | 0.88 | — | — | |
| SCHEMBL17878198 | 0.87 | — | — | |
| SCHEMBL12245429 | 0.86 | — | — | |
| SCHEMBL1002365 | 0.82 | — | — | |
| SCHEMBL1702620 | 0.79 | — | — | |
| SCHEMBL15745730 | 0.79 | — | — | |
| SCHEMBL19220476 | 0.79 | — | — | |
| SCHEMBL2487948 | 0.79 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-9593240-B2 | Thermosetting resin composition | JNC CORPORATION (JP) | 2017-03-14 | — | — | US | disclosed |
| US-20160264779-A1 | THERMOSETTING RESIN COMPOSITION | JNC CORPORATION (JP) | 2016-09-15 | — | — | US | disclosed |
| US-8987358-B2 | Compound including organopolysiloxane or silsesquioxane skeleton having isocyanuric skeleton, epoxy group and SiH group, thermosetting resin composition containing the compound as adhesion-imparting agent, hardened material and sealing agent for optical semiconductor | JNC CORPORATION (JP) | 2015-03-24 | — | — | US | disclosed |
| US-8912132-B2 | Thermally conductive silicone grease composition | DOW CORNING TORAY CO., LTD. (JP) | 2014-12-16 | — | — | US | disclosed |
| US-20140148536-A1 | COMPOUND INCLUDING ORGANOPOLYSILOXANE OR SILSESQUIOXANE SKELETON HAVING ISOCYANURIC SKELETON, EPOXY GROUP AND SIH GROUP, THERMOSETTING RESIN COMPOSITION CONTAINING THE COMPOUND AS ADHESION-IMPARTING AGENT, HARDENED MATERIAL AND SEALING AGENT FOR OPTICAL SEMICONDUCTOR | JNC CORPORATION (JP) | 2014-05-29 | — | — | US | disclosed |
| US-20130137613-A1 | Thermally Conductive Silicone Grease Composition | DOW CORNING TORAY CO., LTD. (JP) | 2013-05-30 | — | — | US | disclosed |
| US-20110189462-A1 | ENCAPSULATED PHOTOCHROMIC DYES | POLYCORE OPTICAL PTE LTD (SG) | 2011-08-04 | — | — | US | disclosed |
| US-20100305293-A1 | Star silicone resins | O'LENICK KEVIN ANTHONY | 2010-12-02 | — | — | US | disclosed |
| US-20090281266-A1 | Star silicone resins | O'LENICK KEVIN ANTHONY | 2009-11-12 | — | — | US | disclosed |