⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Fluoride SCHEMBL5890423 | 1.00 | — | — | |
| Fluoride SCHEMBL1260469 | 1.00 | TSHR (0.36) | — | |
| SCHEMBL10948468 | 0.95 | — | — | |
| SCHEMBL26908 | 0.95 | — | — | |
| Water SCHEMBL675388 | 0.90 | — | — | |
| SCHEMBL11772865 | 0.90 | — | — | |
| SCHEMBL10749779 | 0.90 | — | — | |
| Phosphine SCHEMBL7553985 | 0.90 | — | — | |
| Hydrochloric Acid SCHEMBL8653125 | 0.90 | TSHR (0.36) | — | |
| Bromide SCHEMBL592841 | 0.90 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7888301-B2 | Aqueous-based cleaning compounds/etchants strippingmixtures at a low temperature and neutral pH so as not to damage metal wiring and dielectrics; including a fluoride, organic amine, organic solvent, water and optionally, chelating agents and/or surfactants | ADVANCED TECHNOLOGY MATERIALS, INC. (US) | 2011-02-15 | — | — | US | claimed |
| EP-1689825-A4 | REMOVAL OF MEMS SACRIFICIAL LAYERS USING SUPERCRITICAL FLUID/CHEMICAL FORMULATIONS | ADVANCED TECH MATERIALS (US) | 2008-09-24 | — | — | EP | claimed |
| US-20080006305-A1 | Resist, Barc and Gap Fill Material Stripping Chemical and Method | TRUIST BANK, AS NOTES COLLATERAL AGENT | 2008-01-10 | — | — | US | claimed |
| US-7160815-B2 | Removal of MEMS sacrificial layers using supercritical fluid/chemical formulations | ADVANCED TECHNOLOGY MATERIALS, INC. (US) | 2007-01-09 | — | — | US | claimed |
| WO-2006110645-A2 | FLUORIDE LIQUID CLEANERS WITH POLAR AND NON-POLAR SOLVENT MIXTURES FOR CLEANING LOW-K-CONTAINING MICROELECTRONIC DEVICES | ADVANCED TECHNOLOGY MATERIALS, INC. (US) | 2006-10-19 | — | — | WO | claimed |
| EP-1689825-A1 | REMOVAL OF MEMS SACRIFICIAL LAYERS USING SUPERCRITICAL FLUID/CHEMICAL FORMULATIONS | ADVANCED TECHNOLOGY MATERIALS, INC. (US) | 2006-08-16 | — | — | EP | claimed |
| WO-2005054405-A1 | REMOVAL OF MEMS SACRIFICIAL LAYERS USING SUPERCRITICAL FLUID/CHEMICAL FORMULATIONS | ADVANCED TECHNOLOGY MATERIALS, INC., (US) | 2005-06-16 | — | — | WO | claimed |
| US-20050118813-A1 | Removal of MEMS sacrificial layers using supercritical fluid/chemical formulations | ATMI, INC. | 2005-06-02 | — | — | US | claimed |
| US-8062429-B2 | Methods of cleaning semiconductor devices at the back end of line using amidoxime compositions | EKC TECHNOLOGY, INC. (US) | 2011-11-22 | — | — | US | disclosed |
| US-20100105595-A1 | COMPOSITION COMPRISING CHELATING AGENTS CONTAINING AMIDOXIME COMPOUNDS | EKC TECHNOLOGY, INC. | 2010-04-29 | — | — | US | disclosed |
| US-20100043823-A1 | METHODS OF CLEANING SEMICONDUCTOR DEVICES AT THE BACK END OF LINE USING AMIDOXIME COMOSITIONS | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2010-02-25 | — | — | US | disclosed |
| WO-2009085072-A1 | COMPOSITION COMPRISING CHELATING AGENTS CONTAINING AMIDOXIME COMPOUNDS | EKC TECHNOLOGY, INC (US) | 2009-07-09 | — | — | WO | disclosed |
| US-20090137191-A1 | COPPER CMP POLISHING PAD CLEANING COMPOSITION COMPRISING OF AMIDOXIME COMPOUNDS | EKC TECHNOLOGY, INC. | 2009-05-28 | — | — | US | disclosed |
| US-20090133716-A1 | METHODS OF POST CHEMICAL MECHANICAL POLISHING AND WAFER CLEANING USING AMIDOXIME COMPOSITIONS | EKC TECHNOLOGY, INC. | 2009-05-28 | — | — | US | disclosed |
| WO-2009058274-A1 | CHEMICAL MECHANICAL POLISHING AND WAFER CLEANING COMPOSITION COMPRISING AMIDOXIME COMPOUNDS AND ASSOCIATED METHOD FOR USE | EKC TECHNOLOGY, INC. (US) | 2009-05-07 | — | — | WO | disclosed |
| WO-2009058272-A1 | COPPER CMP POLISHING PAD CLEANING COMPOSITION COMPRISING OF AMIDOXIME COMPOUNDS | EKC TECHNOLOGY, INC. (US) | 2009-05-07 | — | — | WO | disclosed |
| WO-2009058275-A1 | METHODS OF POST CHEMICAL MECHANICAL POLISHING AND WAFER CLEANING USING AMIDOXIME COMPOSITIONS | EKC TECHNOLOGY, INC. (US) | 2009-05-07 | — | — | WO | disclosed |
| WO-2009058288-A1 | AMIDOXIME COMPOUNDS AS CHELATING AGENTS IN SEMICONDUCTOR PROCESSES | EKC TECHNOLOGY, INC. (US) | 2009-05-07 | — | — | WO | disclosed |
| WO-2009058278-A1 | METHODS OF CLEANING SEMICONDUCTOR DEVICES AT THE BACK END OF LINE USING AMIDOXIME COMPOSITIONS | EKC TECHNOLOGY, INC (US) | 2009-05-07 | — | — | WO | disclosed |
| US-20090107520-A1 | AMIDOXIME COMPOUNDS AS CHELATING AGENTS IN SEMICONDUCTOR PROCESSES | EKC TECHNOLOGY, INC. | 2009-04-30 | — | — | US | disclosed |