⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Fluoride SCHEMBL1260648 | 0.96 | TSHR (0.31) | — | |
| Fluoride SCHEMBL27680383 | 0.96 | TSHR (0.31) | — | |
| Fluoride Ion SCHEMBL1260645 | 0.96 | TSHR (0.31) | — | |
| Fluoride Ion SCHEMBL33106 | 0.96 | TSHR (0.31) | — | |
| Hydrogen Sulfide SCHEMBL28090943 | 0.92 | TSHR (0.33) | — | |
| SCHEMBL197824 | 0.92 | TSHR (0.33) | — | |
| SCHEMBL596385 | 0.88 | TSHR (0.31) | — | |
| Iodide SCHEMBL2796494 | 0.88 | TSHR (0.31) | — | |
| SCHEMBL2504316 | 0.88 | TSHR (0.31) | — | |
| SCHEMBL5327324 | 0.88 | TSHR (0.31) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7888301-B2 | Aqueous-based cleaning compounds/etchants strippingmixtures at a low temperature and neutral pH so as not to damage metal wiring and dielectrics; including a fluoride, organic amine, organic solvent, water and optionally, chelating agents and/or surfactants | ADVANCED TECHNOLOGY MATERIALS, INC. (US) | 2011-02-15 | — | — | US | claimed |
| EP-1689825-A4 | REMOVAL OF MEMS SACRIFICIAL LAYERS USING SUPERCRITICAL FLUID/CHEMICAL FORMULATIONS | ADVANCED TECH MATERIALS (US) | 2008-09-24 | — | — | EP | claimed |
| US-20080006305-A1 | Resist, Barc and Gap Fill Material Stripping Chemical and Method | TRUIST BANK, AS NOTES COLLATERAL AGENT | 2008-01-10 | — | — | US | claimed |
| US-7160815-B2 | Removal of MEMS sacrificial layers using supercritical fluid/chemical formulations | ADVANCED TECHNOLOGY MATERIALS, INC. (US) | 2007-01-09 | — | — | US | claimed |
| EP-1689825-A1 | REMOVAL OF MEMS SACRIFICIAL LAYERS USING SUPERCRITICAL FLUID/CHEMICAL FORMULATIONS | ADVANCED TECHNOLOGY MATERIALS, INC. (US) | 2006-08-16 | — | — | EP | claimed |
| WO-2005054405-A1 | REMOVAL OF MEMS SACRIFICIAL LAYERS USING SUPERCRITICAL FLUID/CHEMICAL FORMULATIONS | ADVANCED TECHNOLOGY MATERIALS, INC., (US) | 2005-06-16 | — | — | WO | claimed |
| US-20050118813-A1 | Removal of MEMS sacrificial layers using supercritical fluid/chemical formulations | ATMI, INC. | 2005-06-02 | — | — | US | claimed |
| JP-9286785-A | — | — | None | — | — | JP | disclosed |
| JP-H09286785-A | FLUORINE-CONTAINING DIOXOLANE, ORGANIC SOLVENT FOR ELECTROLYSIS, LITHIUM SECONDARY CELL AND ELECTRIC DOUBLE LAYER CAPACITOR | SANYO CHEM IND LTD | 1997-11-04 | — | — | JP | disclosed |