Fluoride Ion

Fluoride Ion

SCHEMBL126103

[F-].[F-].[F-].[F-].[F-].[F-].[Sb+3].c1ccc([S+](c2ccccc2)c2ccccc2)cc1

nearest known ligand 0.37

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Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 4/20 0.37
TSHR P16473 5/20 0.33
NOS3 P29474 2/20 0.33
NOS1 P29475 2/20 0.33
TDP1 Q9NUW8 4/20 0.32
CA1 P00915 2/20 0.32
CA2 P00918 2/20 0.32
CA9 Q16790 2/20 0.32
CA12 O43570 1/20 0.32
GLA P06280 1/20 0.32
CA3 P07451 1/20 0.32
CA4 P22748 1/20 0.32
CA14 Q9ULX7 1/20 0.32
LMNA P02545 1/20 0.32
ALOX12 P18054 1/20 0.32
ACHE P22303 1/20 0.32
CA7 P43166 1/20 0.32
HSD17B10 Q99714 2/20 0.30
MAPT P10636 1/20 0.30
HPGD P15428 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Fluoride Ion SCHEMBL11224895 1.00 ALDH1A1 (0.37) ALDH1A1TSHRNOS3NOS1TDP1
SCHEMBL2058662 0.96 ALDH1A1 (0.38) ALDH1A1TSHRTDP1CA1CA2
Fluoride Ion SCHEMBL10907293 0.96 ALDH1A1 (0.39) ALDH1A1TSHRNOS3NOS1TDP1
Fluoride Ion SCHEMBL10437963 0.96 ALDH1A1 (0.39) ALDH1A1TSHRNOS3NOS1TDP1
Fluoride Ion SCHEMBL126102 0.93 ALDH1A1 (0.37) ALDH1A1TSHRNOS3NOS1TDP1
Fluoride Ion SCHEMBL11224900 0.93 ALDH1A1 (0.37) ALDH1A1TSHRNOS3NOS1TDP1
Hydrochloric Acid SCHEMBL7520467 0.93 ALDH1A1 (0.35) ALDH1A1TSHRTDP1CA1CA2
Fluoride Ion SCHEMBL11224891 0.93 ALDH1A1 (0.37) ALDH1A1TSHRNOS3NOS1TDP1
Fluoride SCHEMBL10437961 0.93 ALDH1A1 (0.37) ALDH1A1TSHRNOS3NOS1TDP1
Fluoride Ion SCHEMBL126104 0.93 ALDH1A1 (0.37) ALDH1A1TSHRNOS3NOS1TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 139 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-1987005540-A1 SHRINKAGE-RESISTANT ULTRAVIOLET-CURING COATINGS DESOTO, INC. (US) 1987-09-24 WO claimed
US-4657779-A MIXTURES OF EPOXIES AND HYDROXY-CONTAINING ACRYLATES WITH A PHOTOSENSITIVE DIFUNCTIONAL CATALYST DESOTO, INC. (US) 1987-04-14 US claimed
WO-2024122416-A1 METHOD FOR PRODUCING LAMINATED BODY WITH HARD COAT LAYER 東亞合成株式会社 2024-06-13 WO disclosed
US-20240158904-A1 UNDERCOAT AGENT COMPOSITION FOR LAYERING INORGANIC MATERIAL LAYER, CURED PRODUCT THEREOF AND PRODUCTION METHOD THEREOF TOAGOSEI CO., LTD. (JP) 2024-05-16 US disclosed
US-11971659-B2 Photoresist composition and method of forming photoresist pattern TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) 2024-04-30 US disclosed
US-11966162-B2 Photoresist composition and method of manufacturing a semiconductor device TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2024-04-23 US disclosed
US-20240126170-A1 METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND PHOTORESIST COMPOSITION TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2024-04-18 US disclosed
US-11934101-B2 Photoresist composition and method of forming photoresist pattern TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2024-03-19 US disclosed
US-20240087890-A1 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2024-03-14 US disclosed
CN-117420728-A Method for manufacturing semiconductor device and photoresist composition 台湾积体电路制造股份有限公司 2024-01-19 CN disclosed
US-20230408918-A1 PHOTORESIST COMPOSITION AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2023-12-21 US disclosed
EP-1026211-A1 COATING COMPOSITION AND METHOD FOR APPLYING THE SAME KANSAI PAINT CO., LTD. (JP) 2000-08-09 EP disclosed
EP-0687697-B1 A carbonate group-modified epoxy resin and thermosetting compositions of resins containing hydroxyalkyl carbonate groups DAICEL CHEM (JP) 2000-05-03 EP disclosed
US-5733982-A CURABLE COMPOSITIONS DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1998-03-31 US disclosed
US-5556927-A FILMS, COATINGS, REACTION OF EPOXY RESIN OR LACTONE MODIFIED EPOXY RESIN WITH CYCLIC CARBONATE DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1996-09-17 US disclosed
EP-0687697-A2 A carbonate group-modified epoxy resin and thermosetting compositions of resins containing hydroxyalkyl carbonate groups DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1995-12-20 EP disclosed
US-5393642-A Ionic modification of organic resins and photoresists to produce photoactive etch resistant compositions THE UNIVERSITY OF NORTH CAROLINA AT CHARLOTTE (US) 1995-02-28 US disclosed
US-5248734-A Aromatization of a substituted polycyclohexadiene polymer CORNELL RESEARCH FOUNDATION, INC. (US) 1993-09-28 US disclosed
WO-1987005540-A1 SHRINKAGE-RESISTANT ULTRAVIOLET-CURING COATINGS DESOTO, INC. (US) 1987-09-24 WO disclosed
US-4657779-A MIXTURES OF EPOXIES AND HYDROXY-CONTAINING ACRYLATES WITH A PHOTOSENSITIVE DIFUNCTIONAL CATALYST DESOTO, INC. (US) 1987-04-14 US disclosed