SCHEMBL1263397

SCHEMBL1263397

O=C(OCCOC(=O)c1ccc(C(=O)O)c(C(=O)O)c1)c1ccc(C(=O)O)c(C(=O)O)c1

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CDC25A P30304 1/20 0.52
CDC25B P30305 1/20 0.52
HSD17B10 Q99714 1/20 0.52
TDP1 Q9NUW8 3/20 0.50
POLB P06746 3/20 0.50
L3MBTL1 Q9Y468 2/20 0.50
SERPINE1 P05121 3/20 0.46
KDM4E B2RXH2 2/20 0.46
ESR1 P03372 2/20 0.45
ESR2 Q92731 1/20 0.45
MEN1 O00255 1/20 0.44
KMT2A Q03164 1/20 0.44
NPC1 O15118 1/20 0.44
RAB9A P51151 1/20 0.44
LMNA P02545 1/20 0.43
ALDH1A1 P00352 2/20 0.42
CHRM1 P11229 1/20 0.42
TSHR P16473 1/20 0.42
SLC6A2 P23975 1/20 0.42
KDR P35968 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30306346 1.00 CDC25A (0.52) CDC25ACDC25BHSD17B10TDP1POLB
SCHEMBL12311661 0.92 CDC25A (0.45) CDC25ACDC25BHSD17B10TDP1POLB
SCHEMBL25407026 0.91 TDP1 (0.55) CDC25ACDC25BHSD17B10TDP1POLB
SCHEMBL30306344 0.91 TDP1 (0.55) CDC25ACDC25BHSD17B10TDP1POLB
SCHEMBL5437825 0.91 CDC25A (0.47) CDC25ACDC25BHSD17B10TDP1POLB
SCHEMBL15438302 0.90 CDC25A (0.46) CDC25ACDC25BHSD17B10TDP1POLB
SCHEMBL12311685 0.90 LMNA (0.59) CDC25ACDC25BHSD17B10TDP1POLB
SCHEMBL14012901 0.90 KDM4E (0.45) CDC25ACDC25BHSD17B10TDP1POLB
SCHEMBL10493877 0.89 SERPINE1 (0.45) CDC25ACDC25BHSD17B10TDP1POLB
SCHEMBL10939032 0.89 SERPINE1 (0.45) CDC25ACDC25BHSD17B10TDP1POLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 48 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2026105418-A1 METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER 三菱瓦斯化学株式会社 2026-05-21 WO disclosed
EP-4696736-A1 POLYIMIDE RESIN PRECURSOR, POLYIMIDE RESIN, AND POLYIMIDE FILM MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2026-02-18 EP disclosed
US-20250321481-A1 PHOTOSENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO LTD (JP) 2025-10-16 US disclosed
WO-2025121334-A1 POLYIMIDE RESIN 三菱瓦斯化学株式会社 2025-06-12 WO disclosed
WO-2025121335-A1 METHOD FOR PRODUCING POLYIMIDE VARNISH 三菱瓦斯化学株式会社 2025-06-12 WO disclosed
WO-2025121336-A1 POLYIMIDE RESIN 三菱瓦斯化学株式会社 2025-06-12 WO disclosed
WO-2025084154-A1 METHOD FOR PRODUCING POLYIMIDE RESIN 三菱瓦斯化学株式会社 2025-04-24 WO disclosed
WO-2025084155-A1 METHOD FOR PRODUCING POLYIMIDE RESIN 三菱瓦斯化学株式会社 2025-04-24 WO disclosed
WO-2025037571-A1 LAMINATE 三菱瓦斯化学株式会社 2025-02-20 WO disclosed
WO-2025037570-A1 LAMINATE 三菱瓦斯化学株式会社 2025-02-20 WO disclosed
US-20110037174-A1 METHOD OF MANUFACTURING SEMICONDUCTOR COMPONENT, AND SEMICONDUCTOR COMPONENT SUMITOMO BAKELITE CO., LTD. (JP) 2011-02-17 US disclosed
US-20100151333-A1 POLYAMIDE IMIDE FIBER, NON-WOVEN FABRIC COMPOSED OF THE FIBER, PROCESS FOR MANUFACTURE OF THE NON-WOVEN FABRIC, AND SEPARATOR FOR ELECTRONIC COMPONENT TOYOBO MC CORPORATION (JP) 2010-06-17 US disclosed
EP-1911864-A1 POLYAMIDE IMIDE FIBER, NON-WOVEN FABRIC COMPOSED OF THE FIBER, PROCESS FOR MANUFACTURE OF THE NON-WOVEN FABRIC, AND SEPARATOR FOR ELECTRONIC COMPONENT Toyo Boseki Kabushiki Kasisha (JP) 2008-04-16 EP disclosed
EP-1632794-A2 Radiation sensitive resin composition for forming microlens JSR Corporation (JP) 2006-03-08 EP disclosed
US-20060008735-A1 Radiation sensitive resin composition for forming microlens JSR CORPORATION (JP) 2006-01-12 US disclosed
US-6765071-B1 Composition of aromatic polyepisulfide,polyglycidyl ether and/or ester, and acid anhydride NIPPON STEEL CHEMICAL CO., LTD. (JP) 2004-07-20 US disclosed
EP-1270634-B1 RESIN COMPOSITION CONTAINING AROMATIC EPISULFIDE AND OPTICAL MATERIAL NIPPON STEEL CHEMICAL CO (JP) 2004-05-12 EP disclosed
EP-1270634-A1 RESIN COMPOSITION CONTAINING AROMATIC EPISULFIDE AND OPTICAL MATERIAL Nippon Steel Chemical Co., Ltd. (JP) 2003-01-02 EP disclosed
US-4255553-A COMPRISING A COMPOUND HAVING AT LEAST TWO EPOXY GROUPS, A POLYESTER OR ACRYLIC RESIN, AND A QUARTERNARY AMMONIUM CARBOXYLATE AS CATALYST TOYO BOSEKI KABUSHIKI KAISHA (JP) 1981-03-10 US disclosed
US-4056579-A Novel thermosetting resin composition and cured product therefrom HITACHI, LTD. (JA) 1977-11-01 US disclosed