⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Imidazole SCHEMBL28746204 | 1.00 | ALDH1A1 (0.93) | — | |
| Imidazole SCHEMBL30413984 | 1.00 | ALDH1A1 (0.93) | — | |
| Imidazole SCHEMBL28080061 | 0.97 | — | — | |
| Imidazole SCHEMBL30382963 | 0.96 | — | — | |
| Imidazole SCHEMBL2635292 | 0.96 | — | — | |
| Imidazole SCHEMBL28744226 | 0.96 | ALDH1A1 (1.00) | — | |
| Imidazole SCHEMBL2684565 | 0.96 | ALDH1A1 (1.00) | — | |
| Imidazole SCHEMBL1331382 | 0.96 | — | — | |
| Imidazole SCHEMBL897 | 0.96 | — | — | |
| Imidazole SCHEMBL1331920 | 0.96 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 467 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2025098869-A1 | AN AQUEOUS BASIC DEPOSITION COMPOSITION FOR THE ELECTROLESS DEPOSITION OF A METAL ON A SURFACE OF A SUBSTRATE | Atotech Deutschland GmbH & Co. KG (DE) | 2025-05-15 | — | — | WO | claimed |
| CN-119882373-A | IC carrier plate film removing agent and preparation and use methods thereof | 昆山市板明电子科技有限公司 | 2025-04-25 | — | — | CN | claimed |
| CN-116178758-A | Preparation method of composite board with fireproof function for evacuation platform | 江苏亚冠轨道交通科技有限公司 | 2023-05-30 | — | — | CN | claimed |
| CN-114974663-A | Conductive agent and preparation method thereof, conductive paste and preparation method thereof, and solar cell | 深圳市首骋新材料科技有限公司 | 2022-08-30 | — | — | CN | claimed |
| CN-112322013-B | Polycarbonate composite material and preparation method thereof | 广东金发科技有限公司 | 2022-08-09 | — | — | CN | claimed |
| CN-114539961-A | Single-component motor adhesive capable of being stored stably at normal temperature and rapidly cured at medium temperature and preparation method thereof | 湖北回天新材料股份有限公司 | 2022-05-27 | — | — | CN | claimed |
| CN-111892749-B | Boron nitride high-thermal-conductivity insulating filler with imidazole-copper complex adsorbed on surface, insulating and heat-dissipating epoxy resin composition and preparation method thereof | 浙江荣泰科技企业有限公司 | 2022-03-22 | — | — | CN | claimed |
| CN-110684202-B | Two-dimensional layered imidazole copper C60Material, preparation method and application thereof | 汕头大学 | 2021-11-02 | — | — | CN | claimed |
| CN-112663063-A | Tin stripping liquid and method for recycling tin stripping liquid after application | 广东臻鼎环境科技有限公司 | 2021-04-16 | — | — | CN | claimed |
| CN-112322013-A | Polycarbonate composite material and preparation method thereof | 广东金发科技有限公司 | 2021-02-05 | — | — | CN | claimed |
| CN-111892749-A | Boron nitride high-thermal-conductivity insulating filler with imidazole-copper complex adsorbed on surface, insulating and heat-dissipating epoxy resin composition and preparation method thereof | 浙江荣泰科技企业有限公司 | 2020-11-06 | — | — | CN | claimed |
| CN-111793342-A | Polycarbonate composition and preparation method thereof | 金发科技股份有限公司 | 2020-10-20 | — | — | CN | claimed |
| CN-110684202-A | Two-dimensional layered imidazole copper C60Material, preparation method and application thereof | 汕头大学 | 2020-01-14 | — | — | CN | claimed |
| CN-105536871-B | A kind of imidazoles copper catalyst, preparation method and application | 聊城大学 | 2017-10-31 | — | — | CN | claimed |
| US-9082680-B2 | Joint structures having organic preservative films | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2015-07-14 | — | — | US | claimed |
| US-20130000978-A1 | Joint Structures Having Organic Preservative Films | SAMSUNG ELECTRONICS CO., LTD. | 2013-01-03 | — | — | US | claimed |
| US-4339448-A | Imidazole-copper complex compounds and fungicides containing them | BASF AKTIENGESELLSCHAFT (DE) | 1982-07-13 | — | — | US | claimed |
| EP-0010723-B1 | COPPER COMPLEXES OF IMIDAZOLE, THEIR PREPARATION AND FUNGICIDES CONTAINING THEM | BASF Aktiengesellschaft (DE) | 1981-07-29 | — | — | EP | claimed |
| JP-63274054-A | — | — | None | — | — | JP | disclosed |
| US-4282159-A | Preparation of alkylene oxides | WISCONSIN ALUMNI RESEARCH FOUNDATION (US) | 1981-08-04 | — | — | US | disclosed |