Predicted protein targets (top 4)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | GABRR1 | P24046 | 1/20 | 0.32 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.31 |
| ▸ | LMNA | P02545 | 1/20 | 0.31 |
| ▸ | POLB | P06746 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL19093191 | 0.74 | — | — | |
| SCHEMBL20378185 | 0.74 | — | — | |
| SCHEMBL5487626 | 0.74 | — | — | |
| SCHEMBL20378167 | 0.72 | — | — | |
| SCHEMBL9711305 | 0.67 | GABRR1 (0.33) | GABRR1ALDH1A1LMNAPOLB | |
| SCHEMBL11530682 | 0.65 | ALDH1A1 (0.42) | GABRR1ALDH1A1LMNAPOLB | |
| SCHEMBL28207403 | 0.64 | POLB (0.39) | GABRR1ALDH1A1LMNAPOLB | |
| SCHEMBL9094289 | 0.64 | POLB (0.33) | POLB | |
| SCHEMBL9240190 | 0.63 | GABRR1 (0.33) | GABRR1ALDH1A1LMNAPOLB | |
| SCHEMBL10710380 | 0.63 | ALDH1A1 (0.32) | ALDH1A1LMNAPOLB |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 64 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4401112-A1 | SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS | University of Tsukuba (JP) | 2024-07-17 | — | — | EP | disclosed |
| WO-2024116572-A1 | IMIDE GROUP-CONTAINING RESIN | 東洋紡エムシー株式会社 | 2024-06-06 | — | — | WO | disclosed |
| WO-2024116571-A1 | ADHESIVE COMPOSITION | 東洋紡エムシー株式会社 | 2024-06-06 | — | — | WO | disclosed |
| CN-117916856-A | Semiconductor device and method for manufacturing semiconductor device | 国立大学法人筑波大学 | 2024-04-19 | — | — | CN | disclosed |
| CN-117500895-A | Adhesive composition, adhesive sheet, electromagnetic wave shielding material, laminate, and printed wiring board | 东洋纺MC株式会社 | 2024-02-02 | — | — | CN | disclosed |
| CN-113286835-B | Adhesive composition containing dimeric alcohol copolymerized polyimide polyurethane resin | 东洋纺MC株式会社 | 2023-09-29 | — | — | CN | disclosed |
| WO-2023157732-A1 | POLYAMIDIMIDE RESIN, POLYAMIDIMIDE FIBERS, NON-WOVEN FABRIC AND ELECTRONIC COMPONENT SEPARATOR | 東洋紡株式会社 | 2023-08-24 | — | — | WO | disclosed |
| WO-2023037774-A1 | SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS | 国立大学法人 筑波大学 | 2023-03-16 | — | — | WO | disclosed |
| WO-2023282318-A1 | ADHESIVE COMPOSITION, ADHESIVE SHEET, ELECTROMAGNETIC-WAVE SHIELDING MATERIAL, LAMINATE, AND PRINTED WIRING BOARD | 東洋紡株式会社 | 2023-01-12 | — | — | WO | disclosed |
| CN-112534019-B | Adhesive composition using resin having imide bond and phosphorus compound | 东洋纺株式会社 | 2022-11-25 | — | — | CN | disclosed |
| US-20050048297-A1 | Polyimide metal laminate | MITSUI CHEMICALS, INC. (JP) | 2005-03-03 | — | — | US | disclosed |
| EP-0896014-B1 | SOLUBLE POLYIMIDE RESIN, PROCESS FOR PREPARING THE SAME, AND POLYIMIDE RESIN SOLUTION COMPOSITION | MARUZEN PETROCHEM CO LTD (JP) | 2004-11-17 | — | — | EP | disclosed |
| US-6734276-B2 | RANDOM COPOLYMER WITH UNITS DERIVED FROM PYROMELLITIC ACID, P-PHENYLENEDIAMINE, AND AT LEAST ONE OF M-PHENYLENEDIAMINE, BIS(P-AMINOPHENYL) ETHER, AND DIAMINOMETHYLNORBORNANE; LINEAR EXPANSION COEFFICIENT; SHRINKAGE INHIBITION | MITSUI CHEMICALS, INC. (JP) | 2004-05-11 | — | — | US | disclosed |
| US-6710160-B2 | VARNISH HAVING IMPROVED SMOOTHNESS, THERMAL RESISTANCE, MELT FLOWABILITY, OPTICAL PROPERTIES AND CHEMICAL RESISTANCE; DIELECTRICS | MITSUI CHEMICALS, INC. (JP) | 2004-03-23 | — | — | US | disclosed |
| EP-1321487-A1 | POLYAMIC ACID, POLYIMIDE, PROCESS FOR PRODUCING THESE, AND FILM OF THE POLYIMIDE | Mitsui Chemicals, Inc. (JP) | 2003-06-25 | — | — | EP | disclosed |
| US-20030013838-A1 | Novel polyimide and circuit substrate comprising the same | MITSUI CHEMICALS, INC. (JP) | 2003-01-16 | — | — | US | disclosed |
| US-20020188090-A1 | Polyamic acid, polyimide, process for producing these, and film of the polyimide | MITSUI CHEMICALS, INC. (JP) | 2002-12-12 | — | — | US | disclosed |
| EP-1236756-A1 | NOVEL POLYIMIDE AND CIRCUIT SUBSTRATE COMPRISING THE SAME | Mitsui Chemicals, Inc. (JP) | 2002-09-04 | — | — | EP | disclosed |
| US-6100365-A | Soluble polyimide resin, process for preparing the same, and polyimide resin solution composition | MARUZEN PETROCHEMICAL CO., LTD. (JP) | 2000-08-08 | — | — | US | disclosed |
| EP-0896014-A1 | SOLUBLE POLYIMIDE RESIN, PROCESS FOR PREPARING THE SAME, AND POLYIMIDE RESIN SOLUTION COMPOSITION | MARUZEN PETROCHEMICAL CO., LTD. (JP) | 1999-02-10 | — | — | EP | disclosed |