⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8407129 | 0.88 | DNM1 (0.33) | — | |
| SCHEMBL10592748 | 0.81 | DNM1 (0.32) | — | |
| SCHEMBL5494565 | 0.81 | — | — | |
| SCHEMBL14602388 | 0.81 | DNM1 (0.38) | — | |
| SCHEMBL21647895 | 0.77 | — | — | |
| SCHEMBL3820995 | 0.76 | DNM1 (0.32) | — | |
| SCHEMBL129400 | 0.76 | DNM1 (0.33) | — | |
| SCHEMBL3389608 | 0.74 | CYP1A2 (0.31) | — | |
| SCHEMBL302202 | 0.74 | — | — | |
| SCHEMBL357384 | 0.73 | DNM1 (0.33) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 102 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2949719-B1 | ADHESIVE COMPOSITION | TORAY INDUSTRIES (JP) | 2022-11-09 | — | — | EP | claimed |
| US-20240381529-A1 | METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGE, PREPREG, AND APPLICATION FOR PREPREG | RESONAC CORPORATION (JP) | 2024-11-14 | — | — | US | disclosed |
| US-20230331946-A1 | METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGE, PREPREG, AND SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGE | RESONAC CORPORATION (JP) | 2023-10-19 | — | — | US | disclosed |
| WO-2023042305-A1 | METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGE, PREPREG, AND APPLICATION FOR PREPREG | 株式会社レゾナック | 2023-03-23 | — | — | WO | disclosed |
| EP-2949719-B1 | ADHESIVE COMPOSITION | TORAY INDUSTRIES (JP) | 2022-11-09 | — | — | EP | disclosed |
| US-20220289976-A1 | THERMOSETTING RESIN COMPOSITION, THERMOSETTING RESIN SHEET, ELECTRONIC COMPONENT, AND ELECTRONIC DEVICE | TORAY INDUSTRIES, INC. (JP) | 2022-09-15 | — | — | US | disclosed |
| WO-2022059167-A1 | METHOD FOR PRODUCING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGES, PREPREG, AND SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGES | 昭和電工マテリアルズ株式会社 | 2022-03-24 | — | — | WO | disclosed |
| WO-2022059716-A1 | METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGE, PREPREG, AND SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGE | 昭和電工マテリアルズ株式会社 | 2022-03-24 | — | — | WO | disclosed |
| US-20220019146-A1 | FILM FORMING MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR FILM FORMATION FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, AND METHOD FOR FORMING PATTERN | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2022-01-20 | — | — | US | disclosed |
| US-20210405529-A1 | FILM FORMING MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR FILM FORMATION FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, AND METHOD FOR FORMING PATTERN | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2021-12-30 | — | — | US | disclosed |
| US-20070260035-A1 | Polyimide Resin, Laminate Film, Metal Layer-Bearing Laminate Film, and Semiconductor Device | TORAY INDUSTRIES, INC. (JP) | 2007-11-08 | — | — | US | disclosed |
| US-20070225438-A1 | Resin Paste for Die Bonding | HITACHI CHEMICAL CO., LTD. (JP) | 2007-09-27 | — | — | US | disclosed |
| US-20070169886-A1 | Heat-resistant resin laminated film, multilayer film with metal layer including same and semiconductor device | TORAY INDUSTRIES, INC. (JP) | 2007-07-26 | — | — | US | disclosed |
| EP-1788380-A1 | METHOD OF ESTIMATING DISSOLUTION RATE OF POLYIMIDE, PROCESS FOR PRODUCING POLYIMIDE AND POLYIMIDE OBTAINED USING THE METHODS | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2007-05-23 | — | — | EP | disclosed |
| US-20070098995-A1 | Adhesive film and process for preparing the same as well as adhesive sheet and semiconductor device | HITACHI CHEMICAL CO., LTD. (JP) | 2007-05-03 | — | — | US | disclosed |
| EP-1739114-A1 | POLYIMIDE RESIN, MULTILAYER FILM, MULTILAYER FILM WITH METAL LAYER, AND SEMICONDUCTOR DEVICE | TORAY INDUSTRIES, INC. (JP) | 2007-01-03 | — | — | EP | disclosed |
| EP-1721740-A1 | HEAT-RESISTANT RESIN LAMINATED FILM, MULTILAYER FILM WITH METAL LAYER INCLUDING SAME, AND SEMICONDUCTOR DEVICE | TORAY INDUSTRIES, INC. (JP) | 2006-11-15 | — | — | EP | disclosed |
| US-5300364-A | Metal-clad laminates and method for producing same | CHISSO CORPORATION (JP) | 1994-04-05 | — | — | US | disclosed |
| EP-0498898-A1 | FLEXIBLE PRINTED CIRCUIT BOARD AND ITS MANUFACTURING | CHISSO CORPORATION (JP) | 1992-08-19 | — | — | EP | disclosed |
| EP-0496334-A1 | A flexible base laminated with metal on both the surfaces and a process for producing same | CHISSO CORPORATION (JP) | 1992-07-29 | — | — | EP | disclosed |