SCHEMBL1277958

SCHEMBL1277958

CC(C)O[Ti]OC(C)C.COC(=O)CC(C)=O.COC(=O)CC(C)=O

nearest known ligand 0.62

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
MGAM O43451 1/20 0.62
GAA P10253 1/20 0.62
SI P14410 1/20 0.62
MGAM2 Q2M2H8 1/20 0.62
TSHR P16473 5/20 0.37
HSD17B10 Q99714 1/20 0.34
KDM4E B2RXH2 1/20 0.32
LMNA P02545 1/20 0.32
ALDH1A1 P00352 3/20 0.31
TDP1 Q9NUW8 1/20 0.31
CA12 O43570 1/20 0.30
CA7 P43166 1/20 0.30
CA9 Q16790 1/20 0.30
CA14 Q9ULX7 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28374616 1.00 MGAM (0.62) MGAMGAASIMGAM2TSHR
SCHEMBL9064427 0.87 MGAM (0.40) MGAMGAASIMGAM2TSHR
SCHEMBL398895 0.87 MGAM (0.40) MGAMGAASIMGAM2TSHR
SCHEMBL4580100 0.84 MGAM (0.41) MGAMGAASIMGAM2TSHR
SCHEMBL28370473 0.82 GAA (0.50) MGAMGAASIMGAM2TSHR
SCHEMBL453462 0.82 GAA (0.50) MGAMGAASIMGAM2TSHR
Isobutane SCHEMBL27834435 0.82 MGAM (0.83) MGAMGAASIMGAM2TSHR
SCHEMBL1360788 0.81 GAA (0.39) MGAMGAASIMGAM2CA7
Acetoacetic Acid SCHEMBL27710791 0.81 KDM4E (0.37) MGAMGAASIMGAM2TSHR
Isopropyl Alcohol SCHEMBL28337143 0.80 MGAM (0.79) MGAMGAASIMGAM2TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 58 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11845869-B2 Method for producing thixotropic curable silicone composition DOW SILICONES CORPORATION (US) 2023-12-19 US disclosed
EP-3514822-B1 METHOD FOR MANUFACTURING FIELD EFFECT TRANSISTOR AND METHOD FOR MANUFACTURING WIRELESS COMMUNICATION DEVICE TORAY INDUSTRIES (JP) 2023-04-26 EP disclosed
US-20220267531-A1 METHOD FOR PRODUCING THIXOTROPIC CURABLE SILICONE COMPOSITION DOW TORAY CO., LTD. (JP) 2022-08-25 US disclosed
US-20210257570-A1 PHOTOELECTRIC CONVERSION ELEMENT AND METHOD OF PRODUCING PHOTOELECTRIC CONVERSION ELEMENT SHARP KABUSHIKI KAISHA (JP) 2021-08-19 US disclosed
US-11094899-B2 Method for manufacturing field effect transistor and method for manufacturing wireless communication device TORAY INDUSTRIES, INC. 2021-08-17 US disclosed
EP-3367402-B1 CAPACITOR, METHOD FOR MANUFACTURING SAME, AND WIRELESS COMMUNICATION DEVICE USING SAME TORAY INDUSTRIES (JP) 2021-07-07 EP disclosed
EP-3401366-B1 SILICONE COMPOSITION BASED ON BOTH CONDENSATION CURING REACTION AND ORGANIC-PEROXIDE CURING REACTION SHINETSU CHEMICAL CO (JP) 2020-08-26 EP disclosed
US-10689515-B2 Silicone composition based on both condensation/curing reaction and organic-peroxide curing reaction SHIN-ETSU CHEMICAL CO., LTD. (JP) 2020-06-23 US disclosed
US-10636866-B2 Capacitor, method for manufacturing same, and wireless communication device using same TORAY INDUSTRIES, INC. (JP) 2020-04-28 US disclosed
US-10490748-B2 Rectifying element, method for producing same, and wireless communication device TORAY INDUSTRIES, INC. (JP) 2019-11-26 US disclosed
WO-2010076893-A1 CURABLE ORGANOPOLYSILOXANE COMPOSITION AND POROUS CURED ORGANOPOLYSILOXANE MATERIAL DOW CORNING TORAY CO., LTD. (JP) 2010-07-08 WO disclosed
US-20100081757-A1 COMPOSITIONS CONSISTING OF PARTIALLY SILYL-TERMINATED POLYMERS HENKEL AG & CO. KGAA (DE) 2010-04-01 US disclosed
US-20080300365-A1 FLUORINE-CONTAINING RESIN COMPOSITION INHIBITING CORROSIVENESS DAIKIN INDUSTRIES, LTD. (JP) 2008-12-04 US disclosed
WO-2007135875-A1 SILICONE-CONTAINING THERMOPLASTIC FLUORORESIN COMPOSITION, ARTICLE MOLDED THEREFROM, AND PROCESS FOR PREPARING SILICONE-CONTAINING THERMOPLASTIC FLUORORESIN COMPOSITION DAIKIN INDUSTRIES, LTD. (JP) 2007-11-29 WO disclosed
EP-1227133-B1 Room temperature curable silicone rubber composition DOW CORNING TORAY SILICONE (JP) 2004-03-24 EP disclosed
US-6566443-B2 Nonsagging and extrudable; adherence to a variety of substrates DOW CORNING TORAY SILICONE CO., LTD. (JP) 2003-05-20 US disclosed
US-20020143100-A1 Room temperature curable silicone rubber composition DOW CORNING TORAY SILICONE COMPANY, LTD. (JP) 2002-10-03 US disclosed
EP-1227133-A1 Room temperature curable silicone rubber composition Dow Corning Toray Silicone Company, Ltd. (JP) 2002-07-31 EP disclosed
EP-0671663-B1 Electrophotographic photoreceptor KONISHIROKU PHOTO IND (JP) 1998-08-12 EP disclosed
US-5623030-A Curable composition and process for producing molded articles using the same KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1997-04-22 US disclosed