SCHEMBL127832

SCHEMBL127832

CC1(C[O])CO1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9178457 0.76
SCHEMBL25215916 0.75
SCHEMBL9541055 0.73
SCHEMBL16223306 0.73 KCNA4 (0.38)
SCHEMBL18593003 0.72
SCHEMBL78830 0.69
SCHEMBL13367175 0.69
SCHEMBL2708067 0.69
SCHEMBL9339560 0.69
SCHEMBL12727871 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0094436-A1 N-GLYCIDYL-SUBSTITUTED AMIDE COMPOUNDS MITSUI TOATSU CHEMICALS, Inc. (JP) 1983-11-23 EP claimed
JP-59215311-A None JP disclosed
JP-59016883-A None JP disclosed
EP-4378928-A1 NAPHTHALENE DITHIOL AND DERIVATIVE THEREOF, AND PRODUCTION METHODS AND USES FOR SAME SUGAI CHEMICAL INDUSTRY CO., LTD. (JP) 2024-06-05 EP disclosed
US-8729192-B2 Epoxy resin composition, cured article thereof, novel epoxy resin, novel phenol resin and semiconductor-encapsulating material DIC CORPORATION (JP) 2014-05-20 US disclosed
EP-1992653-B1 EPOXY RESIN COMPOSITION, HARDENING PRODUCT THEREOF, NOVEL EPOXY RESIN, NOVEL PHENOLIC RESIN AND SEMICONDUCTOR SEALING MATERIAL DAINIPPON INK & CHEMICALS (JP) 2012-12-26 EP disclosed
EP-1992655-B9 METHOD OF PRODUCING PHENOL RESIN AND METHOD OF PRODUCING EPOXY RESIN DAINIPPON INK & CHEMICALS (JP) 2012-03-07 EP disclosed
US-8084567-B2 Epoxy resin composition and cured article thereof, novel epoxy resin and production method thereof, and novel phenol resin DAINIPPON INK & CHEMICALS, INC. (JP) 2011-12-27 US disclosed
US-7718741-B2 Epoxy resin composition and cured article thereof, novel epoxy resin and production method thereof, and novel phenol resin DAINIPPON INK AND CHEMICALS, INC. (JP) 2010-05-18 US disclosed
US-20100062361-A1 LIQUID DEVELOPING AGENT AND PROCESS FOR PRODUCING THE SAME IWASE KOJI 2010-03-11 US disclosed
US-20060166126-A1 Liquid developer SAKATA INX CORP. 2006-07-27 US disclosed
US-6037405-A NOVOLAK RESIN MODIFIED WITH HYDROXYALKYLESTER GROUPS; PAINTS, COATINGS; STORAGE STABILITY, ANTIAGGLOMERANTS SAKATA INX CORP. (JP) 2000-03-14 US disclosed
EP-0781820-B1 Pigment dispersion and offset printing ink composition using the same SAKATA INX CORP (JP) 1999-09-08 EP disclosed
US-5847028-A Pigment dispersion and offset printing ink composition using the same SAKATA INX CORP. (JP) 1998-12-08 US disclosed
EP-0781820-A2 Pigment dispersion and offset printing ink composition using the same SAKATA INX CORPORATION (JP) 1997-07-02 EP disclosed
EP-0150842-B1 HALOGEN-SUBSTITUTED GLYCIDYL ETHER COMPOUND AND PREPARATION PROCESS THEREOF MITSUI TOATSU CHEMICALS, Inc. (JP) 1990-06-27 EP disclosed
EP-0150842-A2 Halogen-substituted Glycidyl ether compound and preparation process thereof MITSUI TOATSU CHEMICALS, Inc. (JP) 1985-08-07 EP disclosed
JP-S59215311-A CURABLE COMPOSITION MITSUI TOATSU CHEM INC 1984-12-05 JP disclosed
JP-S5916883-A N-2-METHYLGLYCIDYL SUBSTITUTED AMIDE MITSUI TOATSU CHEM INC 1984-01-28 JP disclosed
EP-0094436-A1 N-GLYCIDYL-SUBSTITUTED AMIDE COMPOUNDS MITSUI TOATSU CHEMICALS, Inc. (JP) 1983-11-23 EP disclosed