SCHEMBL12797948

SCHEMBL12797948

CC1(C)C2CC3OC3C1C2

nearest known ligand 0.31

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
▸ ALDH1A1 P00352 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15079303 0.77 — —
SCHEMBL8068708 0.76 ALDH1A1 (0.32) ALDH1A1
SCHEMBL8264730 0.76 ALDH1A1 (0.32) ALDH1A1
SCHEMBL16519087 0.76 ALDH1A1 (0.32) ALDH1A1
SCHEMBL13995290 0.73 — —
SCHEMBL15978646 0.73 — —
SCHEMBL15203160 0.73 — —
SCHEMBL19688919 0.69 — —
SCHEMBL19678630 0.69 — —
SCHEMBL13815186 0.67 ANPEP (0.33) —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11709290-B2 Heat curable epoxy compositions and transparent heat-cured coatings with durable adhesion prepared therefrom ESSILOR INTERNATIONAL (FR) 2023-07-25 — — US disclosed
US-20230167233-A1 UPCYCLING OF POLYSTYRENE REINFORCED 3D PRINTABLE PHOTOPOLYMER NANOCOMPOSITES AND RING OPENING COPOLYMERIZATION UNIV OHIO (US) 2023-06-01 — — US disclosed
US-20230167233-A1 UPCYCLING OF POLYSTYRENE REINFORCED 3D PRINTABLE PHOTOPOLYMER NANOCOMPOSITES AND RING OPENING COPOLYMERIZATION UNIV OHIO (US) 2023-06-01 — — US disclosed
US-11242431-B2 Heat-curable hybrid epoxy functional composition and transparent heat-cured caustic-resistant coatings prepared therefrom ESSILOR INTERNATIONAL (FR) 2022-02-08 — — US disclosed
US-20210349240-A1 Heat Curable Epoxy Compositions and Transparent Heat-Cured Coatings with Durable Adhesion Prepared Therefrom ESSILOR INTERNATIONAL (FR) 2021-11-11 — — US disclosed
US-20210002415-A1 HEAT-CURABLE HYBRID EPOXY FUNCTIONAL COMPOSITION AND TRANSPARENT HEAT-CURED ABRASION-RESISTANT COATINGS PREPARED THEREFROM ESSILOR INTERNATIONAL (FR) 2021-01-07 — — US disclosed
US-20190345286-A1 Heat-Curable Hybrid Epoxy Functional Composition and Transparent Heat-Cured Caustic-Resistant Coatings Prepared Therefrom ESSILOR INTERNATIONAL (FR) 2019-11-14 — — US disclosed
US-8278401-B2 Radiation or thermally curable barrier sealants HENKEL AG & CO. KGAA (DE) 2012-10-02 — — US disclosed
US-7902305-B2 Waterproof; adhesive bonding strength after curing; polyoxazolines; electrooptics HENKEL AG & CO. KGAA (DE) 2011-03-08 — — US disclosed
US-20100164368-A1 RADIATION- OR THERMALLY-CURABLE BARRIER SEALANTS NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CO (DE) 2010-07-01 — — US disclosed
US-20080296159-A1 RADIATION-OR THERMALLY-CURABLE OXETANE BARRIER SEALANTS HENKEL CORPORATION (US) 2008-12-04 — — US disclosed
WO-2007111606-A1 RADIATION-OR THERMALLY-CURABLE BARRIER SEALANTS NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION (US) 2007-10-04 — — WO disclosed
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