SCHEMBL12801059

SCHEMBL12801059

CCn1c2ccc(C(C)=N)cc2c2cc(C(=O)c3ccccc3C)ccc21

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 4/20 0.50
HTT P42858 2/20 0.50
KDM4E B2RXH2 6/20 0.47
LMNA P02545 3/20 0.47
MAPT P10636 3/20 0.47
HPGD P15428 4/20 0.47
MEN1 O00255 1/20 0.47
KMT2A Q03164 1/20 0.47
SMN1; SMN2 Q16637 1/20 0.47
TUBB4A P04350 1/20 0.44
TUBB P07437 1/20 0.44
TUBA3C P0DPH7 1/20 0.44
TUBA1B P68363 1/20 0.44
TUBA4A P68366 1/20 0.44
TUBB4B P68371 1/20 0.44
TUBB3 Q13509 1/20 0.44
TUBB2A Q13885 1/20 0.44
TUBB8 Q3ZCM7 1/20 0.44
TUBA3E Q6PEY2 1/20 0.44
TUBA1A Q71U36 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL24494726 0.92 ALDH1A1 (0.57) ALDH1A1HTTKDM4ELMNAMAPT
SCHEMBL29503094 0.90 ALDH1A1 (0.52) ALDH1A1HTTKDM4ELMNAMAPT
SCHEMBL625638 0.90 ALDH1A1 (0.52) ALDH1A1HTTKDM4ELMNAMAPT
SCHEMBL29353002 0.90 ALDH1A1 (0.52) ALDH1A1HTTKDM4ELMNAMAPT
SCHEMBL30832750 0.89 KDM4E (0.57) ALDH1A1HTTKDM4ELMNAMAPT
SCHEMBL3417160 0.89 KDM4E (0.57) ALDH1A1HTTKDM4ELMNAMAPT
SCHEMBL29370263 0.89 KDM4E (0.57) ALDH1A1HTTKDM4ELMNAMAPT
SCHEMBL12196941 0.88 ALDH1A1 (0.52) ALDH1A1HTTKDM4ELMNAMAPT
SCHEMBL29503079 0.86 ALDH1A1 (0.51) ALDH1A1HTTKDM4ELMNAMAPT
SCHEMBL27767001 0.86 ALDH1A1 (0.51) ALDH1A1HTTKDM4ELMNAMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117242108-A Thermosetting composition, resin film, prepreg, metal foil-clad laminate, and printed wiring board 日油株式会社 2023-12-15 CN disclosed
EP-3622511-B1 HOLOGRAPHIC MEDIUM CONTAINING A PHOTOPOLYMERIC COATING FOR HOLOGRAPHIC EXPOSURE AND A LACQUER LAYER WITH HIGH RESISTANCE COVESTRO INTELLECTUAL PROPERTY GMBH & CO KG (DE) 2022-04-27 EP disclosed
EP-3622512-B1 FILM STRUCTURE COMPRISING A PHOTOPOLYMER COATING FOR HOLOGRAPHIC EXPOSURE AND A LACQUER LAYER WITH HIGH RESISTANCE COVESTRO INTELLECTUAL PROPERTY GMBH & CO KG (DE) 2022-04-27 EP disclosed
US-20200298539-A1 PLASTIC PRODUCT INCLUDING SYNTHETIC POLYMER FILM SHARP KABUSHIKI KAISHA (JP) 2020-09-24 US disclosed
EP-3401910-A1 HOLOGRAPHIC MEDIUM CONTAINING A PHOTOPOLYMERIC COATING FOR HOLOGRAPHIC EXPOSURE AND A LACQUER LAYER WITH HIGH RESISTANCE Covestro Deutschland AG (DE) 2018-11-14 EP disclosed
EP-3401909-A1 FILM STRUCTURE COMPRISING A PHOTOPOLYMER COATING FOR HOLOGRAPHIC EXPOSURE AND A LACQUER LAYER WITH HIGH RESISTANCE Covestro Deutschland AG (DE) 2018-11-14 EP disclosed
EP-2891685-A1 DISPERSION COMPOSITION, AND CURABLE COMPOSITION, TRANSPARENT FILM, MICROLENS AND SOLID-STATE IMAGING ELEMENT USING SAME FUJIFILM Corporation (JP) 2015-07-08 EP disclosed
WO-2011040626-A1 BLACK CURABLE COMPOSITION FOR WAFER LEVEL LENS AND WAFER LEVEL LENS FUJIFILM CORPORATION (JP) 2011-04-07 WO disclosed