SCHEMBL128036

SCHEMBL128036

Cc1cc(-c2ccccc2)c(C)c(C)c1C

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ESR2 Q92731 1/20 0.47
CYP2A6 P11509 1/20 0.45
CYP2B6 P20813 1/20 0.45
SQOR Q9Y6N5 1/20 0.44
ALDH1A1 P00352 4/20 0.44
KDM4E B2RXH2 2/20 0.44
MEN1 O00255 1/20 0.44
POLB P06746 1/20 0.44
MAPT P10636 1/20 0.44
PKM P14618 1/20 0.44
RAB9A P51151 1/20 0.44
KMT2A Q03164 1/20 0.44
BACE1 P56817 1/20 0.42
PTGS1 P23219 1/20 0.42
PDCD1 Q15116 1/20 0.41
CD274 Q9NZQ7 1/20 0.41
PSMB5 P28074 2/20 0.38
AKT1 P31749 1/20 0.38
AKT2 P31751 1/20 0.38
ADORA3 P0DMS8 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28273634 0.98 ESR2 (0.45) ESR2CYP2A6CYP2B6SQORALDH1A1
Water SCHEMBL1538411 0.98 ESR2 (0.45) ESR2CYP2A6CYP2B6SQORALDH1A1
SCHEMBL30954899 0.98 ESR2 (0.45) ESR2CYP2A6CYP2B6SQORALDH1A1
SCHEMBL28533212 0.98 ESR2 (0.45) ESR2CYP2A6CYP2B6SQORALDH1A1
SCHEMBL28805622 0.98 ESR2 (0.45) ESR2CYP2A6CYP2B6SQORALDH1A1
Water SCHEMBL3331289 0.98 ESR2 (0.45) ESR2CYP2A6CYP2B6SQORALDH1A1
Hydrogen Peroxide SCHEMBL28104708 0.98 ESR2 (0.50) ESR2CYP2A6CYP2B6SQORALDH1A1
Ammonia Solution, Strong SCHEMBL15862223 0.98 ESR2 (0.45) ESR2CYP2A6CYP2B6SQORALDH1A1
Biphenyl SCHEMBL18106197 0.98 ESR2 (0.45) ESR2CYP2A6CYP2B6SQORALDH1A1
Biphenyl SCHEMBL27656465 0.98 ESR2 (0.45) ESR2CYP2A6CYP2B6SQORALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 3356 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260001259-A1 TECHNOLOGY FOR PREPARING HIGH-TEMPERATURE-RESISTANT EPOXY ENERGY STORAGE FILM BASED ON LIQUID CRYSTALLINE ORDERED STRUCTURE XI’AN UNIVERSITY OF ARCHITECTURE AND TECHNOLOGY (CN) 2026-01-01 US claimed
CN-120158247-A High-heat-conductivity low-moisture-absorption epoxy composition and preparation method thereof 江苏科麦特科技发展有限公司 2025-06-17 CN claimed
CN-120158091-A Resin composition, metal foil-clad laminate and printed circuit board 广东生益科技股份有限公司 2025-06-17 CN claimed
CN-119905691-A Chemical prelithiation reagent for sulfide solid-state battery, and preparation method and application thereof 北京恩力动力技术有限公司 2025-04-29 CN claimed
CN-119775721-A Halogen-free epoxy resin composition, prepreg comprising same, metal foil-clad laminate and printed circuit board 江西生益科技有限公司 2025-04-08 CN claimed
CN-119752117-A Halogen-free flame-retardant resin composition, prepreg containing same, metal foil-clad laminate and printed circuit board 江西生益科技有限公司 2025-04-04 CN claimed
CN-119752108-A Black halogen-free resin composition, prepreg, metal foil-clad laminate and printed circuit board 江西生益科技有限公司 2025-04-04 CN claimed
CN-119708405-A Preparation method and application of environment-friendly acidic color fixing agent 广东炬盛新材料科技有限公司 2025-03-28 CN claimed
CN-119684655-A Preparation technology of high-temperature-resistant epoxy energy storage film based on liquid crystal ordered structure 西安建筑科技大学 2025-03-25 CN claimed
CN-119455318-A Self-induction fire extinguishing material, fire extinguishing rope and application 福建中程锐铂电力科技有限公司 2025-02-18 CN claimed
US-6548620-B2 Obtained by reacting 4,4'-dihydroxy-3,3',5,5'-tetramethylbiphenyl and an epihalohydrin in the presence of alkali metal compound; useful in electrical and electronic fields JAPAN EPOXY RESINS CO., LTD. (JP) 2003-04-15 US claimed
CN-1361191-A Crystalline epoxy, its producing method and solidifiable composition containing the same NIPPON EPOXY CO LTD (JP) 2002-07-31 CN claimed
US-20020077422-A1 Obtained by reacting 4,4'-dihydroxy-3,3',5,5'-tetramethylbiphenyl and an epihalohydrin in the presence of alkali metal compound; useful in electrical and electronic fields JAPAN EPOXY RESINS CO., LTD. (JP) 2002-06-20 US claimed
CN-1350032-A Epoxy resin composition and method of producing the same NIPPON EPOXY RESIN CO LTD (JP) 2002-05-22 CN claimed
CN-1339721-A New bipolar organic light sensitive body XIANLI NEW TECHNOLOGY CO LTD T (CN) 2002-03-13 CN claimed
CN-1330679-A Plastic moulding materials which can be detected by x-ray contrast BAYER AG (DE) 2002-01-09 CN claimed
CN-1298377-A Preparation of polyindanebisphenols and polymers derived therefrom ALLIED SIGNAL INC (US) 2001-06-06 CN claimed
CN-1263121-A Synthesis of chiral ring prepolymer UNIV JILIN (CN) 2000-08-16 CN claimed
EP-0688805-A1 Phenol aralkyl resins, preparation process thereof and epoxy resin compositions MITSUI TOATSU CHEMICALS, INCORPORATED (JP) 1995-12-27 EP claimed
US-4008266-A Coupling of aromatic compounds in the presence of molecular oxygen, a mercuric oxyanion compound, and a group VIII metal or group VIII metal oxyanion compound MONSANTO COMPANY (US) 1977-02-15 US claimed