SCHEMBL12852178

SCHEMBL12852178

C=CSCCOCCOCCSC=C

nearest known ligand 0.33

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.33
TP53 P04637 2/20 0.33
TSHR P16473 2/20 0.33
HIF1A Q16665 2/20 0.33
HSD17B10 Q99714 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18073192 0.85
SCHEMBL18073193 0.85
SCHEMBL4309346 0.81
SCHEMBL9055857 0.74
SCHEMBL29652317 0.74
SCHEMBL18073196 0.73 HSD17B10 (0.48) HSD17B10
SCHEMBL9756340 0.71 TSHR (0.52) ALDH1A1TSHR
SCHEMBL16589129 0.69
SCHEMBL8554686 0.66
SCHEMBL20897028 0.65 ALDH1A1 (0.30) ALDH1A1TP53TSHRHIF1AHSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2145765-B1 Resin composition for laser engraving, image forming material, relief printing plate precursor for laser engraving. relief printing plate, and method of producing relief printing plate FUJIFILM CORP (JP) 2016-12-07 EP disclosed
US-8367300-B2 Resin composition for laser engraving, image forming material, relief printing plate precursor for laser engraving, relief printing plate, and method of producing relief printing plate FUJIFILM CORPORATION (JP) 2013-02-05 US disclosed
EP-2168764-B1 Relief printing plate precursor for laser engraving, method of producing the same and method of producing relief printing plate FUJIFILM CORP (JP) 2012-10-31 EP disclosed
US-8278387-B2 Resin composition for laser engraving, image forming material, relief printing plate precursor for laser engraving, relief printing plate, and method of manufacturing relief printing plate FUJIFILM CORPORATION (JP) 2012-10-02 US disclosed
EP-2168764-A2 Relief printing plate precursor for laser engraving, method of producing the same, relief printing plate obtainable therefrom, and method of producing relief printing plate FUJIFILM Corporation (JP) 2010-03-31 EP disclosed
US-20100075117-A1 RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, METHOD OF PRODUCING THE SAME, RELIEF PRINTING PLATE OBTAINABLE THEREFROM, AND METHOD OF PRODUCING RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2010-03-25 US disclosed
US-20100015416-A1 RESIN COMPOSITION FOR LASER ENGRAVING, IMAGE FORMING MATERIAL, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE, AND METHOD OF PRODUCING RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2010-01-21 US disclosed
EP-2145765-A1 Resin composition for laser engraving, image forming material, relief printing plate precursor for laser engraving. relief printing plate, and method of producing relief printing plate FUJIFILM Corporation (JP) 2010-01-20 EP disclosed
EP-2135739-A2 Relief printing plate precursor for laser engraving, relief printing plate, and process for producing relief printing plate FUJIFILM Corporation (JP) 2009-12-23 EP disclosed
US-20090311494-A1 RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE, AND PROCESS FOR PRODUCING RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2009-12-17 US disclosed
US-20090246469-A1 RESIN COMPOSITION FOR LASER ENGRAVING, IMAGE FORMING MATERIAL, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE, AND METHOD OF MANUFACTURING RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2009-10-01 US disclosed
EP-2105795-A1 Resin composition for laser engraving, image forming material, relief printing plate precursor for laser engraving, relief printing plate, and method of manufacturing relief printing plate FUJIFILM Corporation (JP) 2009-09-30 EP disclosed