⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3892557 | 0.79 | — | — | |
| SCHEMBL828954 | 0.79 | — | — | |
| SCHEMBL3893707 | 0.79 | — | — | |
| SCHEMBL27480254 | 0.76 | — | — | |
| SCHEMBL6728521 | 0.73 | — | — | |
| SCHEMBL5429936 | 0.72 | — | — | |
| SCHEMBL229948 | 0.69 | — | — | |
| SCHEMBL17607509 | 0.69 | — | — | |
| SCHEMBL3152622 | 0.67 | — | — | |
| SCHEMBL11082029 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-9524874-B2 | Aqueous polishing composition and process for chemically mechanically polishing substrates containing silicon oxide dielectric and polysilicon films | BASF SE (DE) | 2016-12-20 | — | — | US | disclosed |
| US-9275851-B2 | Aqueous, nitrogen-free cleaning composition and its use for removing residues and contaminants from semiconductor substrates suitable for manufacturing microelectronic devices | BASF SE (DE) | 2016-03-01 | — | — | US | disclosed |
| US-9070632-B2 | Aqueous polishing composition and process for chemically mechanically polishing substrates having patterned or unpatterned low-k dielectric layers | BASF SE (DE) | 2015-06-30 | — | — | US | disclosed |
| EP-2688688-A1 | AQUEOUS, NITROGEN-FREE CLEANING COMPOSITION, PREPARATION AND USE THEREOF | BASF SE (DE) | 2014-01-29 | — | — | EP | disclosed |
| US-20130273739-A1 | AQUEOUS POLISHING COMPOSITION AND PROCESS FOR CHEMICALLY MECHANICALLY POLISHING SUBSTRATES HAVING PATTERNED OR UNPATTERNED LOW-K DIELECTRIC LAYERS | BASF SE (DE) | 2013-10-17 | — | — | US | disclosed |
| EP-2649144-A1 | AQUEOUS POLISHING COMPOSITION AND PROCESS FOR CHEMICALLY MECHANICALLY POLISHING SUBSTRATES CONTAINING SILICON OXIDE DIELECTRIC AND POLYSILICON FILMS | BASF SE (DE) | 2013-10-16 | — | — | EP | disclosed |
| US-20130248756-A1 | AQUEOUS POLISHING COMPOSITION AND PROCESS FOR CHEMICALLY MECHANICALLY POLISHING SUBSTRATES CONTAINING SILICON OXIDE DIELECTRIC AND POLYSILICON FILMS | BASF SE (DE) | 2013-09-26 | — | — | US | disclosed |
| EP-2625236-A1 | AQUEOUS POLISHING COMPOSITION AND PROCESS FOR CHEMICALLY MECHANICALLY POLISHING SUBSTRATES HAVING PATTERNED OR UNPATTERNED LOW-K DIELECTRIC LAYERS | BASF SE (DE) | 2013-08-14 | — | — | EP | disclosed |
| WO-2012127336-A1 | AQUEOUS, NITROGEN-FREE CLEANING COMPOSITION, PREPARATION AND USE THEREOF | BASF SE (DE) | 2012-09-27 | — | — | WO | disclosed |
| WO-2012077063-A1 | AQUEOUS POLISHING COMPOSITION AND PROCESS FOR CHEMICALLY MECHANICALLY POLISHING SUBSTRATES CONTAINING SILICON OXIDE DIELECTRIC AND POLYSILICON FILMS | BASF SE (DE) | 2012-06-14 | — | — | WO | disclosed |
| WO-2012046179-A1 | AQUEOUS POLISHING COMPOSITION AND PROCESS FOR CHEMICALLY MECHANICALLY POLISHING SUBSTRATES HAVING PATTERNED OR UNPATTERNED LOW-K DIELECTRIC LAYERS | BASF SE (DE) | 2012-04-12 | — | — | WO | disclosed |