SCHEMBL13012009

SCHEMBL13012009

O=C(OC1C2CC3OS(=O)(=O)C1C3C2)C(F)(F)S(=O)(=O)O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13011921 0.87
SCHEMBL23762911 0.79
SCHEMBL786930 0.79
SCHEMBL23374149 0.79
SCHEMBL18557938 0.79
SCHEMBL12968559 0.79
SCHEMBL12978123 0.78
SCHEMBL24497377 0.78
SCHEMBL17637715 0.78
SCHEMBL13012012 0.77

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 30 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11796916-B2 Pattern formation methods and photoresist pattern overcoat compositions ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2023-10-24 US disclosed
US-10766992-B2 Resin and resist composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2020-09-08 US disclosed
US-20180188654-A1 PATTERN-FORMATION METHODS U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT 2018-07-05 US disclosed
US-9996008-B2 Photoresist pattern trimming methods ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2018-06-12 US disclosed
US-9869933-B2 Pattern trimming methods ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2018-01-16 US disclosed
US-9760011-B1 Pattern trimming compositions and methods ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2017-09-12 US disclosed
US-9760011-B1 Pattern trimming compositions and methods ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2017-09-12 US disclosed
US-20170255103-A1 PATTERN TRIMMING METHODS U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT 2017-09-07 US disclosed
US-20170255102-A1 PATTERN TRIMMING COMPOSITIONS AND METHODS U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT 2017-09-07 US disclosed
US-20170255102-A1 PATTERN TRIMMING COMPOSITIONS AND METHODS U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT 2017-09-07 US disclosed
US-20160141171-A1 PHOTORESIST PATTERN TRIMMING METHODS U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT 2016-05-19 US disclosed
US-20160091790-A1 METHOD FOR FORMING RESIST PATTERN, RESIST PATTERN SPLITTING AGENT, SPLIT PATTERN IMPROVING AGENT, RESIST PATTERN SPLITTING MATERIAL, AND POSITIVE RESIST COMPOSITION FOR FORMING SPLIT PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2016-03-31 US disclosed
US-20160091790-A1 METHOD FOR FORMING RESIST PATTERN, RESIST PATTERN SPLITTING AGENT, SPLIT PATTERN IMPROVING AGENT, RESIST PATTERN SPLITTING MATERIAL, AND POSITIVE RESIST COMPOSITION FOR FORMING SPLIT PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2016-03-31 US disclosed
US-20160011513-A1 COMPOSITION FOR FORMING FINE RESIST PATTERN, AND FINE PATTERN-FORMING METHOD JSR CORPORATION (JP) 2016-01-14 US disclosed
US-20160011513-A1 COMPOSITION FOR FORMING FINE RESIST PATTERN, AND FINE PATTERN-FORMING METHOD JSR CORPORATION (JP) 2016-01-14 US disclosed
US-9051405-B2 Resin and resist composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2015-06-09 US disclosed
US-20150132698-A1 RESIN AND RESIST COMPOSITION SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2015-05-14 US disclosed
US-20140187027-A1 ION IMPLANTATION METHODS U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT 2014-07-03 US disclosed
US-20130171574-A1 PHOTORESIST PATTERN TRIMMING METHODS ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2013-07-04 US disclosed
US-20100323296-A1 RESIN AND RESIST COMPOSITION SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2010-12-23 US disclosed