⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6324162 | 0.88 | SOAT1 (0.42) | — | |
| SCHEMBL24311035 | 0.86 | ALDH1A1 (0.35) | — | |
| SCHEMBL1449854 | 0.83 | ALDH1A1 (0.40) | — | |
| SCHEMBL47896 | 0.83 | SMN1; SMN2 (0.41) | — | |
| SCHEMBL15689729 | 0.81 | PAOX (0.47) | — | |
| Hydrochloric Acid SCHEMBL28664937 | 0.80 | IDO1 (0.39) | — | |
| SCHEMBL14740733 | 0.80 | ALDH1A1 (0.38) | — | |
| SCHEMBL28633091 | 0.80 | ALDH1A1 (0.45) | — | |
| Ammonia Solution, Strong SCHEMBL27695494 | 0.80 | ALDH1A1 (0.38) | — | |
| Water SCHEMBL18426253 | 0.80 | SMN1; SMN2 (0.39) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 39 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119955091-A | Polymer, positive-type negative-type photosensitive resin composition, pattern forming method, cured film forming method, interlayer insulating film, surface protective film, and electronic component | 信越化学工业株式会社 | 2025-05-09 | — | — | CN | disclosed |
| CN-115044040-B | Polyimide-containing polymer, positive photosensitive resin composition, negative photosensitive resin composition, and pattern forming method | 信越化学工业株式会社 | 2024-07-02 | — | — | CN | disclosed |
| CN-111381447-B | Photosensitive resin composition, laminate, and pattern forming method | 信越化学工业株式会社 | 2024-03-08 | — | — | CN | disclosed |
| CN-109388023-B | Photosensitive resin composition, photosensitive resin coating, photosensitive dry film, laminate, and pattern forming method | 信越化学工业株式会社 | 2023-12-22 | — | — | CN | disclosed |
| CN-109388022-B | Silicone-structure-containing polymer, photosensitive resin composition, photosensitive resin coating layer, photosensitive dry film, laminate, and pattern forming method | 信越化学工业株式会社 | 2023-07-28 | — | — | CN | disclosed |
| CN-108388082-B | Photosensitive resin composition, photosensitive dry film, photosensitive resin coating and pattern forming method | 信越化学工业株式会社（JP） | 2023-01-13 | — | — | CN | disclosed |
| CN-108459469-B | Pattern forming method | 信越化学工业株式会社 | 2022-11-11 | — | — | CN | disclosed |
| CN-108373856-B | Laminate and pattern forming method | 信越化学工业株式会社 | 2022-07-01 | — | — | CN | disclosed |
| CN-110016136-A | Novel tetracarboxylic dianhydride, polyimide resin and its manufacturing method, photosensitive resin composition, pattern forming method | 信越化学工业株式会社 | 2019-07-16 | — | — | CN | disclosed |
| CN-109422881-A | Containing the isocyanurate-modified organic siliconresin of epoxy group, photosensitive resin composition, photo-conductive film, laminated body and pattern forming method | 信越化学工业株式会社 | 2019-03-05 | — | — | CN | disclosed |
| EP-2169021-A1 | Ink composition, inkjet recording method, and printed material | Fujifilm Corporation (JP) | 2010-03-31 | — | — | EP | disclosed |
| US-20100075119-A1 | INK COMPOSITION, INKJET RECORDING METHOD, AND PRINTED MATERIAL | FUJIFILM CORPORATION (JP) | 2010-03-25 | — | — | US | disclosed |
| EP-1882724-B1 | Ink composition, inkjet recording method, printed material, and process for producing lithographic printing plate | FUJIFILM CORP (JP) | 2008-12-03 | — | — | EP | disclosed |
| US-20080286484-A1 | INK COMPOSITION, INKJET RECORDING METHOD, AND PRINTED MATERIAL | FUJIFILM CORPORATION (JP) | 2008-11-20 | — | — | US | disclosed |
| EP-1958788-A1 | Ink composition, inkjet recording method, and printed material | FUJIFILM Corporation (JP) | 2008-08-20 | — | — | EP | disclosed |
| US-20080074480-A1 | INK COMPOSITION, INKJET RECORDING METHOD, AND PRINTED MATERIAL | FUJIFILM CORPORATION (JP) | 2008-03-27 | — | — | US | disclosed |
| EP-1903080-A1 | Ink composition, inkjet recording method, and printed material | FUJIFILM Corporation (JP) | 2008-03-26 | — | — | EP | disclosed |
| US-20080063981-A1 | Ink composition, inkjet recording method, printed material, and process for producing lithographic printing plate | FUJIFILM CORPORATION (JP) | 2008-03-13 | — | — | US | disclosed |
| EP-1882724-A1 | Ink composition, inkjet recording method, printed material, and process for producing lithographic printing plate | FUJIFILM Corporation (JP) | 2008-01-30 | — | — | EP | disclosed |
| EP-1693707-A1 | Positive resist composition, and patterning process using the same | Shinetsu Chemical Co., Ltd. (JP) | 2006-08-23 | — | — | EP | disclosed |