Predicted protein targets (top 6)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP3A4 | P08684 | 2/20 | 0.37 |
| ▸ | TSHR | P16473 | 1/20 | 0.37 |
| ▸ | TRPA1 | O75762 | 1/20 | 0.33 |
| ▸ | ALDH1A3 | P47895 | 1/20 | 0.32 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.32 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL12909396 | 0.87 | CYP3A4 (0.39) | CYP3A4TSHRTRPA1MAPK1TDP1 | |
| SCHEMBL20045932 | 0.87 | CYP3A4 (0.39) | CYP3A4TSHRTRPA1MAPK1TDP1 | |
| SCHEMBL34741 | 0.87 | CYP3A4 (0.47) | CYP3A4TSHRTRPA1MAPK1TDP1 | |
| SCHEMBL141743 | 0.83 | CYP3A4 (0.50) | CYP3A4TSHRTRPA1MAPK1TDP1 | |
| SCHEMBL139926 | 0.83 | ESR1 (0.41) | — | |
| SCHEMBL15362533 | 0.82 | CYP3A4 (0.35) | CYP3A4TSHRMAPK1TDP1 | |
| SCHEMBL10033172 | 0.82 | CYP3A4 (0.42) | CYP3A4TSHRTRPA1MAPK1TDP1 | |
| SCHEMBL15981020 | 0.82 | CYP3A4 (0.42) | CYP3A4TSHRTRPA1MAPK1TDP1 | |
| SCHEMBL31166667 | 0.81 | ESR1 (0.39) | — | |
| SCHEMBL17320306 | 0.80 | CYP3A4 (0.44) | CYP3A4TSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240016699-A1 | PHARMACEUTICAL PACKAGES WITH COATINGS COMPRISING POLYCYANURATES | CORNING INC (US) | 2024-01-18 | — | — | US | disclosed |
| US-11707411-B2 | Pharmaceutical packages with coatings comprising polycyanurates | CORNING INCORPORATED (US) | 2023-07-25 | — | — | US | disclosed |
| US-20180127626-A1 | COMPOSITION FOR BONDING WINDINGS OR CORE LAMINATES IN AN ELECTRICAL MACHINE, AND ASSOCIATED METHOD | GENERAL ELECTRIC COMPANY | 2018-05-10 | — | — | US | disclosed |
| US-9911521-B2 | Curable composition for electrical machine, and associated method | GENERAL ELECTRIC COMPANY (US) | 2018-03-06 | — | — | US | disclosed |
| US-9879163-B2 | Composition for bonding windings or core laminates in an electrical machine, and associated method | GENERAL ELECTRIC COMPANY (US) | 2018-01-30 | — | — | US | disclosed |
| US-20150353788-A1 | COMPOSITION FOR BONDING WINDINGS OR CORE LAMINATES IN AN ELECTRICAL MACHINE, AND ASSOCIATED METHOD | GENERAL ELECTRIC COMPANY | 2015-12-10 | — | — | US | disclosed |
| US-20150357086-A1 | CURABLE COMPOSITION FOR ELECTRICAL MACHINE, AND ASSOCIATED METHOD | GENERAL ELECTRIC COMPANY | 2015-12-10 | — | — | US | disclosed |
| US-8501874-B2 | Thermosetting resin composition, multilayer body using same, and circuit board | KANEKA CORPORATION (JP) | 2013-08-06 | — | — | US | disclosed |
| US-7816437-B2 | Polymide resin composition modified with bismaleimide and cyanate | CHANG CHUN PLASTICS CO., LTD. (TW) | 2010-10-19 | — | — | US | disclosed |
| US-7521511-B2 | Thermosetting resin composition, multilayer body using same, and circuit board | KANEKA CORPORATION (JP) | 2009-04-21 | — | — | US | disclosed |
| US-20080312383-A1 | Thermosetting Resin Composition, And Laminate and Circuit Substrate Using Same | KANEKA CORPORATION (JP) | 2008-12-18 | — | — | US | disclosed |
| US-20080306220-A1 | Thermosetting Resin Composition, Multilayer Body Using Same, and Circuit Board | KANEKA CORPORATION (JP) | 2008-12-11 | — | — | US | disclosed |
| US-20080176984-A1 | Thermoset resin modified polyimide resin composition | CHANG CHUN PLASTICS CO., LTD. | 2008-07-24 | — | — | US | disclosed |