SCHEMBL13087237

SCHEMBL13087237

O=C(/C=C/c1cc(O)c(O)cc1O)N1CCCCC1

nearest known ligand 0.60

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
PELI1 Q96FA3 3/20 0.60
ALOX5 P09917 2/20 0.55
MAOB P27338 2/20 0.55
TRPV1 Q8NER1 2/20 0.51
ALDH1A1 P00352 7/20 0.50
HPGD P15428 3/20 0.49
SMN1; SMN2 Q16637 2/20 0.49
MAPT P10636 4/20 0.48
L3MBTL1 Q9Y468 1/20 0.48
NPC1 O15118 2/20 0.47
RAB9A P51151 2/20 0.47
KMT2A Q03164 3/20 0.47
MEN1 O00255 2/20 0.47
KDM4E B2RXH2 2/20 0.46
MITF O75030 1/20 0.43
HTT P42858 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10446033 0.97 PELI1 (0.63) PELI1ALOX5MAOBTRPV1ALDH1A1
SCHEMBL10446290 0.95 PELI1 (0.62) PELI1ALOX5MAOBTRPV1ALDH1A1
SCHEMBL10446515 0.89 PELI1 (0.59) PELI1ALOX5MAOBTRPV1ALDH1A1
SCHEMBL10445997 0.87 PELI1 (0.58) PELI1ALOX5MAOBTRPV1ALDH1A1
SCHEMBL766033 0.86 PELI1 (0.56) PELI1ALOX5MAOBTRPV1ALDH1A1
SCHEMBL10446562 0.84 PELI1 (0.59) PELI1ALOX5MAOBTRPV1ALDH1A1
SCHEMBL10446514 0.83 PELI1 (0.54) PELI1ALOX5MAOBTRPV1ALDH1A1
SCHEMBL10446518 0.83 PELI1 (0.57) PELI1ALOX5MAOBTRPV1ALDH1A1
SCHEMBL10445978 0.83 PELI1 (0.67) PELI1ALOX5MAOBTRPV1ALDH1A1
SCHEMBL10322050 0.83 PELI1 (0.67) PELI1ALOX5MAOBTRPV1ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2010113813-A1 BASE-GENERATING AGENT, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING MATERIAL COMPRISING THE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD AND ARTICLE USING THE PHOTOSENSITIVE RESIN COMPOSITION 大日本印刷株式会社 (JP) 2010-10-07 WO disclosed